Skip to main content
U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

Superconformal Silver Deposition using KSeCn Derivatized Substrates

Published

Author(s)

B C. Baker, C Witt, Daniel Wheeler, Daniel Josell, Thomas P. Moffat

Abstract

Superconformal filling of sub-micrometer trenches was achieved using substrates that were catalyzed with KSeCn prior to metal deposition in a catalyst-free, silver-cyanide electrolyte. The degree of superfill was found to be dependent on the time the specimen spent in the KSeCn-containing solution prior to electrodeposition. Longer derivitization times correspond to higher initial catalyst coverages. The feature filling resullts were consistent with the Curvature Enhanced Accelerator Coverage Mechanism of superconformal deposition.
Citation
Electrochemical and Solid State Letters
Volume
6
Issue
No. 5

Keywords

copper, derivitization, electrodeposition, silver, superconformal fill

Citation

Baker, B. , Witt, C. , Wheeler, D. , Josell, D. and Moffat, T. (2003), Superconformal Silver Deposition using KSeCn Derivatized Substrates, Electrochemical and Solid State Letters, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853235 (Accessed December 5, 2024)

Issues

If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.

Created May 1, 2003, Updated February 17, 2017