Superconformal Silver Deposition using KSeCn Derivatized Substrates

Published

May 1, 2003

Author(s)

B C. Baker, C Witt, Daniel Wheeler, Daniel Josell, Thomas P. Moffat

Abstract

Superconformal filling of sub-micrometer trenches was achieved using substrates that were catalyzed with KSeCn prior to metal deposition in a catalyst-free, silver-cyanide electrolyte. The degree of superfill was found to be dependent on the time the specimen spent in the KSeCn-containing solution prior to electrodeposition. Longer derivitization times correspond to higher initial catalyst coverages. The feature filling resullts were consistent with the Curvature Enhanced Accelerator Coverage Mechanism of superconformal deposition.

Citation

Electrochemical and Solid State Letters

Volume

6

Issue

No. 5

Pub Type

Journals

Download Paper

Local Download

Keywords

copper, derivitization, electrodeposition, silver, superconformal fill

Citation

Baker, B. , Witt, C. , Wheeler, D. , Josell, D. and Moffat, T. (2003), Superconformal Silver Deposition using KSeCn Derivatized Substrates, Electrochemical and Solid State Letters, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853235 (Accessed April 25, 2024)