April 1, 2001
Author(s)
Allen R. Hefner Jr., David W. Berning, David L. Blackburn, Christophe C. Chapuy, Sebastien Bouche
A new high-speed transient thermal imaging system is presented that provides the capability to measure the transient temperature distributions on the surface of a silicon chip with 1 υs time, and 15 υm spatial resolution. The system uses virtual instrument