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Displaying 1 - 25 of 28

In-situ Stress Measurements During Cobalt Electrodeposition

January 12, 2019
Author(s)
Gery R. Stafford, Ugo Bertocci
In situ cantilever curvature is used to quantify the growth stress in Co thin films, electrodeposited from an electrolyte consisting of 0.5 mol/L Na2SO4, 0.5 mol/L H3BO3, and 0.1 mol/L CoSO4 . 7 H20. The average biaxial steady-state stress is measured as a

In-situ Stress Measurements During Cobalt Electrodeposition on (111)-Textured Au

April 14, 2016
Author(s)
Gery R. Stafford, Matthew R. Fayette, Ugo Bertocci
Cantilever curvature was used to examine stress generation during the electrodeposition of Co from 0.1 M NaClO4 + 0.001 M Co(ClO4)2 (pH = 4.8) in films measuring less than 100 nm in thickness. The stress-thickness product showed a -0.2 N/m compression in

Role of Elastic Strain on Electrocatalysis of Oxygen Reduction Reaction on Pt

July 23, 2015
Author(s)
Gery R. Stafford, Vijay Sethuraman, Deepa Vairavapandian, Manon C. Lafouresse, Tuhina Maark, Naba Karan, Shouheng Sun, Ugo Bertocci, Andrew Peterson, Pradeep Guduru
The effect of elastic strain on catalytic activity of platinum (Pt) towards oxygen reduction reaction (ORR) is investigated through de-alloyed Pt-Cu thin films; stress evolution in the de-alloyed layer and the mass of the Cu removed are measured in real

Dynamic Stress Analysis Applied to the Electrodeposition of Copper

March 16, 2015
Author(s)
Manon C. Lafouresse, Ugo Bertocci, Gery R. Stafford
Stress development during the electrodeposition of copper from additive-free, acidic CuSO_(4) electrolyte was analyzed by dynamic stress analysis, an in situ characterization technique that combines electrochemical impedance spectroscopy with cantilever

Understanding residual stress in electrodeposited Cu thin films

December 13, 2013
Author(s)
Eric Chason, Alison Engwal, Fei Pei, Manon C. Lafouresse, Ugo Bertocci, Gery R. Stafford, Joseph A. Murphy, Catherine Lenihan, D. N. Buckley
We report on the results of a multi-laboratory study to measure the steady state growth stress of planar copper thin films, electrodeposited from additive-free acidic sulfate electrolyte. Measurements were made using the wafer curvature method, that

Electrodeposition of Ternary Pt_(100-x-y)Co_(x)Ni_(y) Alloys

November 7, 2013
Author(s)
Carlos M. Hangarter, Yihua Y. Liu, D. Pagonis, Ugo Bertocci, Thomas P. Moffat
Electrodeposition of ternary Pt_(100-x-y)Co_(x)Ni_(y) alloy films and the respective Pt binary alloys were examined and compared to the characteristics of the constituent elements. The potential dependence of alloy composition, structure and deposition

Dynamic Stress Analysis Applied to (111)-Textured Pt in HClO_(4) Electrolyte

July 20, 2013
Author(s)
Manon C. Lafouresse, Ugo Bertocci, Gery R. Stafford
Dynamic stress analysis (DSA) was performed on Pt cantilever electrodes immersed in a 0.1 mol/L HClO_(4) electrolyte. DSA combines elements of electrochemical impedance spectroscopy (EIS) and cantilever curvature. In this paper DSA is used to determine the

Self-terminating Growth of Pt by Electrochemical Deposition

December 7, 2012
Author(s)
Yihua Y. Liu, Dincer Gokcen, Ugo Bertocci, Thomas P. Moffat
A self-terminating rapid electrodeposition process for controlled growth of Pt monolayer films from a K_(2)PtCl_(4)-NaCl electrolyte has been developed that is tantamount to wet atomic layer deposition (ALD). Despite the deposition overpotential being in

In situ stress measurement during electrodeposition of Ni_(x)Pt_(1-x) alloys

June 20, 2012
Author(s)
Jae W. Shin, Carlos M. Hangarter, Ugo Bertocci, Yihua Y. Liu, Thomas P. Moffat, Gery R. Stafford
Stress generation was examined during the electrodeposition of NixPt1-x alloys from 0.5 M NaCl + 3 mM K2PtCl4 + 0.1 M NiCl2 (pH=2.5), using the wafer curvature method, in films measuring less than 50 nm in thickness. Steady state tensile stress, ranging

Superconformal Ni Electrodeposition using 2-Mercaptobenzimidazole

April 4, 2011
Author(s)
Chang H. Lee, John E. Bonevich, Ugo Bertocci, Kristen L. Steffens, Thomas P. Moffat
Ni superconformal filling of sub-micrometer trenches is demonstrated using a Watts bath containing an inhibitor 2-mercaptobenzimidazole (MBI). Hysteretic voltammetry marks the breakdown of the MBI-induced passive-state coincident with the onset of Ni

Electrodeposition of Metastable Au-Ni Alloys

May 13, 2010
Author(s)
Gery R. Stafford, E. Rouya, Ugo Bertocci, J. J. Mallett, R. Schad, M. R. Begley, R. G. Kelly, M. Reed, G. Zangari
The electrodeposition of Au-Ni alloys from near neutral, sulfite-based electrolytes derived from a commercial bath for soft gold plating is investigated. Alloy compositions ranging from 0 to 90 at% Ni were obtained by varying the deposition potential, with

Electrodeposition of Bismuth From Nitric Acid Electrolyte

April 2, 2007
Author(s)
E Sandnes, Maureen E. Williams, Ugo Bertocci, Mark D. Vaudin, Gery R. Stafford
The electrodeposition of Bi from acidic nitrate solution was examined. Bismuth deposition was determined to be quasi-reversible on Au, with a current efficiency of 100%, based on integration of deposition and stripping voltammetric waves. No interference

Underpotential Co-Deposition of Cu_subscript(1-x)Pt_subscript(x) Alloys

September 30, 2006
Author(s)
J Mallett, Ugo Bertocci, Erik B. Svedberg, John E. Bonevich, Alexander J. Shapiro, William F. Egelhoff Jr., Thomas P. Moffat
The electrodeposition of Cu_subscript (1-x)Pt_subscript(x) alloys by underpotential co-deposition of Cu with Pt is demonstrated using an H_subscript(2)SO_subscript(4)-CuSO_subscript(4-)PtCl_subscript(4)_superscript(2-) electrolyte. The composition and