Skip to main content
U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

In-situ Stress Measurements During Cobalt Electrodeposition on (111)-Textured Au



Gery R. Stafford, Matthew R. Fayette, Ugo Bertocci


Cantilever curvature was used to examine stress generation during the electrodeposition of Co from 0.1 M NaClO4 + 0.001 M Co(ClO4)2 (pH = 4.8) in films measuring less than 100 nm in thickness. The stress-thickness product showed a -0.2 N/m compression in the first monolayer followed by increasing tensile stress as the film thickened. The initial compressive stress is most likely due to surface and interface stresses that dominate at submonolayer coverage. Steady state tensile stress, ranging from 0 to 885 MPa, developed in continuous Co films and showed a strong dependence on electrode potential, consistent with stress generating models that appear in the literature. XRD analysis indicates that the Co is face-centered cubic and maintains the (111) texture of the Au substrate, suggesting epitaxial but not pseudomorphic growth on the Au.
Journal of the Electrochemical Society


cantilever curvature, growth stress, cobalt, electrodeposition


Stafford, G. , Fayette, M. and Bertocci, U. (2016), In-situ Stress Measurements During Cobalt Electrodeposition on (111)-Textured Au, Journal of the Electrochemical Society (Accessed July 18, 2024)


If you have any questions about this publication or are having problems accessing it, please contact

Created April 14, 2016, Updated March 16, 2017