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Displaying 26 - 28 of 28

Whisker Formation in Pb-Free Surface Finishes

September 11, 2006

Author(s)

Gery R. Stafford, Maureen E. Williams, C E. Johnson, Kil-Won Moon, Ugo Bertocci, William J. Boettinger

High purity bright Sn, Sn-Cu and Sn-Pb layers measuring 3,7 and 16 microns thick were electrodeposited onto phosphor bronze cantilever beams in a rotating disk apparatus. Beam deflection measurements within 15 min. of plating proved that all

In Situ Stress and Nanogravimetric Measurements During Underpotential Deposition of Pb on (111)-Textured Au

June 16, 2006

Author(s)

Gery R. Stafford, Ugo Bertocci

The surface stress associated with the underpotential deposition (upd) of lead on (111)-textured Au is examined, using the wafer curvature method, in acidic perchlorate supporting electrolyte. The surface stress is correlated to Veta, the fractional Pb

An EQMB Examination of Cu Surface Oxides in Borate Buffer

April 1, 2004

Author(s)

Ugo Bertocci

The oxidation and reduction of copper, either electrodeposited or vapor-deposited onto quartz crystal resonators, was examined in borate/boric acid mixtures at different pH's, comparing electrochemical measurements with mass changes. The results showed