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Displaying 26 - 50 of 56

In situ stress measurement during hydrogen sorption and desorption on Pd overlayers deposited on (111) textured Au

April 28, 2011

Author(s)

Jae W. Shin, Ugo Bertocci, Gery R. Stafford

The stress behavior of hydrogen adsorption/absorption into Pd layers electrodeposited on (111)-textured gold has been examined in alkaline solution. Although the kinetics are much slower than in acidic solution, the stress induced by H adsorption and

Superconformal Ni Electrodeposition using 2-Mercaptobenzimidazole

April 4, 2011

Author(s)

Chang H. Lee, John E. Bonevich, Ugo Bertocci, Kristen L. Steffens, Thomas P. Moffat

Ni superconformal filling of sub-micrometer trenches is demonstrated using a Watts bath containing an inhibitor 2-mercaptobenzimidazole (MBI). Hysteretic voltammetry marks the breakdown of the MBI-induced passive-state coincident with the onset of Ni

Underpotential Deposition of Tl on (111)-Textured Au: In Situ Stress and Nanogravimetric Measurements

September 15, 2010

Author(s)

Jae W. Shin, Ugo Bertocci, Gery R. Stafford

The surface stress associated with the underpotential deposition (UPD) of thallium (Tl) on (111)-textured Au is examined, using the wafer curvature method, in acidic perchlorate supporting electrolyte. The process was also examined by independent

Electrodeposition of Metastable Au-Ni Alloys

May 13, 2010

Author(s)

Gery R. Stafford, E. Rouya, Ugo Bertocci, J. J. Mallett, R. Schad, M. R. Begley, R. G. Kelly, M. Reed, G. Zangari

The electrodeposition of Au-Ni alloys from near neutral, sulfite-based electrolytes derived from a commercial bath for soft gold plating is investigated. Alloy compositions ranging from 0 to 90 at% Ni were obtained by varying the deposition potential, with

Stress Response to Surface Alloying and De-Alloying During Under Potential Deposition of Pb on (111)-Textured Au

April 5, 2010

Author(s)

Jae W. Shin, Ugo Bertocci, Gery R. Stafford

The stress during Pb underpotential deposition (upd) on (111)-textured Au has been examined on a cantilever beam electrode in perchloric acid supporting electrolyte. The upd peaks change from double to single going from higher to lower sweep rates, while a

Compositional Control in Electrodeposited Pt(subscript 100-x)Cu(subscript x) Alloys.

October 7, 2009

Author(s)

J Mallett, Ugo Bertocci, John E. Bonevich, Thomas P. Moffat

The electrodeposition of Pt100-xCux alloys is demonstrated using an electrolyte comprised of 1mol/L H2SO4, 0.001 mol/L K2PtCl4 and 0.1 mol/L CuSO4. Film growth proceeds by facile Cu underpotential deposition (upd) occurring in parallel with Pt

In Situ Stress and Nanogravimetric Measurements During Hydrogen Adsorption/Absorption on Pd Overlayers Deposited onto (111)-Textured Au

July 7, 2009

Author(s)

Gery R. Stafford, Ugo Bertocci

The stress induced by electrochemical hydrogen adsorption and absorption in very thin palladium layers electrodeposited onto (111)-textured gold has been examined in 0.1M H(subscript 2)SO(subscript 4) by the cantilever curvature method, as well by

In Situ Stress and Nanogravimetric Measurements During Underpotential Deposition of Pd on (111)-Textured Au.

December 10, 2008

Author(s)

Gery R. Stafford, Ugo Bertocci

The surface stress associated with the electrodeposition of Pd onto (111)-textured Au cantilever electrodes in 0.1 M H2SO4 supporting electrolyte has been examined. An electrochemical quartz crystal nanobalance (EQNB) was also used in order to correlate

In Situ Stress Measurements During the Electrochemical Adsorption/Desorption of Self-Assembled Monolayers.

December 8, 2007

Author(s)

Christopher D. Zangmeister, Ugo Bertocci, Carlos R. Beauchamp, Gery R. Stafford

Electrodeposition of Bismuth from Nitric Acid Electrolyte

June 20, 2007

Author(s)

E Sandnes, Maureen E. Williams, Ugo Bertocci, Mark D. Vaudin, Gery R. Stafford

Electrodeposition of Bismuth From Nitric Acid Electrolyte

April 2, 2007

Author(s)

E Sandnes, Maureen E. Williams, Ugo Bertocci, Mark D. Vaudin, Gery R. Stafford

The electrodeposition of Bi from acidic nitrate solution was examined. Bismuth deposition was determined to be quasi-reversible on Au, with a current efficiency of 100%, based on integration of deposition and stripping voltammetric waves. No interference

In Situ Stress and Nanogravimetric Measurements During Underpotential Deposition of Bismuth on (111)-Textured Au

October 1, 2006

Author(s)

Gery R. Stafford, Ugo Bertocci

The surface stress associated with the underpotential deposition of bismuth on (111)-textured Au is examined, using the wafer curvature method, in acidic perchlorate and nitrate supporting electrolyte. The surface stress is correlated to Bi coverage by

Underpotential Co-Deposition of Cu_subscript(1-x)Pt_subscript(x) Alloys

September 30, 2006

Author(s)

J Mallett, Ugo Bertocci, Erik B. Svedberg, John E. Bonevich, Alexander J. Shapiro, William F. Egelhoff Jr., Thomas P. Moffat

The electrodeposition of Cu_subscript (1-x)Pt_subscript(x) alloys by underpotential co-deposition of Cu with Pt is demonstrated using an H_subscript(2)SO_subscript(4)-CuSO_subscript(4-)PtCl_subscript(4)_superscript(2-) electrolyte. The composition and