NOTICE: Due to a lapse in annual appropriations, most of this website is not being updated. Learn more.
Form submissions will still be accepted but will not receive responses at this time. Sections of this site for programs using non-appropriated funds (such as NVLAP) or those that are excepted from the shutdown (such as CHIPS and NVD) will continue to be updated.
An official website of the United States government
Here’s how you know
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Self-terminating Growth of Pt by Electrochemical Deposition
Published
Author(s)
Yihua Y. Liu, Dincer Gokcen, Ugo Bertocci, Thomas P. Moffat
Abstract
A self-terminating rapid electrodeposition process for controlled growth of Pt monolayer films from a K_(2)PtCl_(4)-NaCl electrolyte has been developed that is tantamount to wet atomic layer deposition (ALD). Despite the deposition overpotential being in excess of 1 V, Pt deposition is quenched at potentials just negative of proton reduction by an alteration of the double layer structure induced by a saturated surface coverage of underpotential deposited hydrogen, (H_(upd)). The surface is reactivated for Pt deposition by stepping the potential to more positive values where Hupd is oxidized and fresh sites for adsorption of PtCl_(4)^(2-) become available. Periodic pulsing of the potential enables sequential deposition of two dimensional (2-D) Pt layers to fabricate films of desired thickness relevant to a range of advanced technologies.
Liu, Y.
, Gokcen, D.
, Bertocci, U.
and Moffat, T.
(2012),
Self-terminating Growth of Pt by Electrochemical Deposition, Nature Materials
(Accessed October 22, 2025)