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Displaying 52226 - 52250 of 74036

Fluorescent Probe for Cure Monitoring of Bonding Agent on Surface

June 1, 1998
Author(s)
K Komatsu, Francis W. Wang
The adhesive strength of a composite resin to dentin is greatly influenced by the degree of cure of the bonding agent. Flouorescent probes have often been used for cure monitoring of resins. The purpose of this study is to select a fluorescent probe for

In-Line Multiport Calibration Algorithm

June 1, 1998
Author(s)
Dylan F. Williams, Dave K. Walker
We present a multiport measurement procedure well suited to on-wafer measurement. It can correct multiport measurements with any conventional in-line calibration, including the thru-reflect-line calibration. We demonstrate the procedure in a four-port

Lumped-Element Impedance Standards

June 1, 1998
Author(s)
Dylan F. Williams, Dave K. Walker
We measure the electrical parameters of commercial lumped-element impedance standards manufactured for the calibration of on-wafer probing systems. The standard's impedance depends not only on the standard itself, but also on probe placement, probe

Measurement of Pitch and Width Samples with the NIST Calibrated Atomic Force Microscope

June 1, 1998
Author(s)
Ronald G. Dixson, R Koning, Theodore V. Vorburger, Joseph Fu, V W. Tsai
Because atomic force microscopes (AFMs) are capable of generating three dimensional images with nanometer level resolution, these instruments are being increasingly used in many industries as tools for dimensional metrology at sub- micrometer length scales

Measurements and Modeling of the Microwave Impedance in High-T c Grain-Boundary Josephson Junctions: Fluxon Generation and RF Josephson-Vortex Dynamics

June 1, 1998
Author(s)
Y. M. Habib, C. J. Lehner, D. E. Oates, Leila R. Vale, Ronald H. Ono, G. Dresselhaus, M. Dresselhaus
Measurements and modeling of the microwave-frequency (rf) power dependence of the impedance in Y-Ba-Cu-O thin-film grain-boundary Josephson junctions (jj's) are presented. Microwave impedance measurements were performed using a stripline resonator with an

Metal-Insulator-Semiconductor Transmission Line Model

June 1, 1998
Author(s)
Dylan F. Williams
This paper investigates the one-dimensional metal-insulator-semiconductor transmission line. It develops closed-form expressions for equivalent-circuit parameters, compares them to exact calculations, and explores their limitations. It also investigates

Metrology: Impact on National Economy and International Trade

June 1, 1998
Author(s)
Hratch G. Semerjian, Robert L. Watters
The U.S. Federal Government has a strong role in metrology R&D in the U.S because of its importance to the nation's economy and the Constitutional authority given to the National Institute of Standards and Technology (NIST). However, pressures to maintain

Multi-Stage Active Vibration Isolation System

June 1, 1998
Author(s)
S J. Richman, J A. Giaime, David B. Newell, R T. Stebbins, P L. Bender, J E. Faller
The major obstacle to the detection of low-frequency gravitational waves with an earth-based interferometer is seismic noise. The current design of the initial LIGO (Laser Interferometer Gravitational-wave Observatory) receiver, now under construction

Optimizing GMR Spin Valves: The Outlook for Improved Properties

June 1, 1998
Author(s)
William F. Egelhoff Jr., P J. Chen, Cedric J. Powell, D Parks, Robert McMichael, J Judy, D Martien, A. E. Berkowitz, J M. Daughton
The current generation of giant magnetoresistance (GMR) spin valves exhibits performance characteristics which are not quite as good as desired for ultrahigh-density nonvolatile memory applications. This paper addresses the scientific issues underlying the

Preparation and Characterization of Polymer/Dendrimer Blends Progress Report 2/24/97

June 1, 1998
Author(s)
Eric J. Amis, Barry J. Bauer, F I. Groehn, T J. Prosa, Da-Wei Liu, K A. Barnes, C L. Jackson, B D. Viers, Alamgir Karim, Jack F. Douglas
Dendrimer, dendrigraft, and hyperbranched solutions, blends, and interpenetrating polymer networks are characterized by small neutron and x-ray scattering, reflectivity, atomic force microscopy, and transmission electron microscopy.

Process Engineering Data STEP Application Protocol, Version 1.0

June 1, 1998
Author(s)
S W. Kline, Mark E. Palmer, J Fielding, M Gilbert, T Teague, D Witherall
This document specifies the scope and information requirements of the STEP application protocol (AP) for the exchange of process engineering data with a central emphasis on process design and major equipment. It specifies the information required to

Process Measurement Assurance Program for U.S. State Metrology Laboratories

June 1, 1998
Author(s)
J L. Everhart, Georgia L. Harris
This paper describes how the Process Measurement Assurance Program (PMAP) is used in the United States State metrology laboratories (weights and measures laboratories) to provide uniformity among the laboratories in measurement control, uncertainty

Production Systems Engineering: Requirements Analysis for Discrete-Event Simulation

June 1, 1998
Author(s)
Anna Bartolotta, Charles R. McLean, Yung-Tsun T. Lee, Albert W. Jones
This document describes the results of the requirement analysis phase for a neutral interface specification to discrete event simulation software. The interface specification should provide a neutral mechanism capable of describing input data to a discrete
Displaying 52226 - 52250 of 74036
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