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Displaying 2826 - 2850 of 4199

NIST Reference Material (RM) 8240/2350 Project-Standard Bullets and Casings

January 1, 2003
Author(s)
Jun-Feng Song, Theodore V. Vorburger, Robert A. Clary, Li Ma, M Ols, Eric P. Whitenton
Standard bullets and casings are currently under development to support the National Integrated Ballistics Information System (NIBIN) in the U.S. Based on a numerically controlled diamond turning technique, 20 RM 8240 standard bullets were fabricated in

MSEL FY 2001 Programs and Accomplishments: Polymers Division

September 1, 2001
Author(s)
B M. Fanconi, Eric J. Amis
The Polymers Division provides measurement methods, standards, and concepts to facilitate technology development, manufacture of products, commerce, and use of synthetic polymers. Projects are selected based on assessments of current needs and in

Combinatorial Methods at NIST

January 1, 2001
Author(s)
Alamgir Karim, Eric J. Amis
New, more complex materials are increasingly in demand for applications in biotechnology, microelectronics and nanotechnology. The use of combinatorial methods -- which comprise a special set of tools and techniques -- enables scientists to conduct many

New Antenna Positioner Improves NIST's Capabilities

October 1, 1999
Author(s)
G. Kangiser, Dennis G. Camell
Antenna and electric field probe calibration requires precise positioning and movement throughout a known RF field Measurements are usually made in an anechoic chamber. A robotic six axis antenna positioner was needed that would work in this environment at

Just How Perfect Can a Perfect Crystal Be?

June 1, 1999
Author(s)
R Deslattes, Ernest G. Kessler, S M. Owens, David R. Black, Albert Henins
This overview addresses certain aspects of the perfection of the current generation of commercially manufactured silicon, specifically lattice uniformity and the more complex issues of interstitials, vacancies, and chemical impurities. The application

MEMS-Based Test Structures for IC Technology

December 31, 1998
Author(s)
S. A. Smee, Michael Gaitan, Yogendra K. Joshi, David L. Blackburn
As Integrated Circuit (IC) device sizes shrink, intrinsic and thermo-mechanical stress in interconnects is an ever increasing reliability concern. Increasing device density leads to more interconnect layers and hence, greater probability of stress related

Migration Plan for Product Data Standards

February 1, 1996
Author(s)
Mary Mitchell, William Gruttke
A significant benefit of using standards is that standards ease the migration from one computing environment to another. But what happens when the migration if from one standard to another? The organization that led the creation of both has committed to

Radiation Scattered by Two Touching Spheres

June 20, 1994
Author(s)
Egon Marx
During the manufacture of powder metal, the size distribution of the metal spheres can be determined to some extent by the distribution of light scattered by the spheres while they are streaming by a laser beam. Micrographs show the presence of chains of
Displaying 2826 - 2850 of 4199
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