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Metrology

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Displaying 2451 - 2475 of 2718

Calibration and Fabrication Facilities for Optical Surfaces

January 1, 1997
Author(s)
Theodore V. Vorburger, Christopher J. Evans, C Asmail
NIST has calibration facilities and research services available for characterization of optical surfaces and optical figuring and finishing. The calibration facilities are for measurement of optical scatter, figure, and surface finish, and the fabrication

Ductile-Regime Grinding of Brittle Materials

January 1, 1997
Author(s)
Kenneth Blaedel, John S. Taylor, Christopher J. Evans
Under appropriate conditions, brittle materials may be ground to produce surfaces with no observable fracture damage. This chapter reviews the techniques for producing such surfaces and the mechanisms of material removal involved.

Establishing a Worldwide Unified Rockwell Hardness Scale With Metrology Traceability

January 1, 1997
Author(s)
Jun-Feng Song, Samuel Low, David J. Pitchure, A Germak, S Desogus, T Polzin, H Yang, H Ishida, G Barbato
Recently developed microform measurement techniques have reduced the measurement uncertainties in the geometry of Rockwell diamond indenters. It is now possible to establish standard grade Rockwell diamond indenters characterized by high geometry

Finish and Figure Metrology for Soft X-ray Optics

January 1, 1997
Author(s)
T Mcwaid
The performance of high quality optics relies heavily on their geometrical properties of surface finish and figure. The surface finish consists of the short spatial-wavelength departures from perfect smoothness and leads to scattering of the incident light

Hybrid Optical-Electrical Overlay Test Structure

January 1, 1997
Author(s)
Michael W. Cresswell, Robert Allen, L Linholm, William F. Guthrie, William B. Penzes, A Gurnell
This paper describes the exploratory use of electrical test structures to enable the calibration of optical overlay instruments of the type used to monitor semiconductor-device fabrication processes. Such optical instruments are known to be vulnerable to

Industrial Uses of STM and AFM

January 1, 1997
Author(s)
Theodore V. Vorburger, John A. Dagata, G. Wilkening, K Iizuka
We review the field of STM and AFM as applied to industrial problems, and we classify the applications into four classes: research with potential benefit to industry, research performed by industry, applications off-line in manufacturing, and applications

Integral Equations for Scattering by a Particle in a Layer

January 1, 1997
Author(s)
Egon Marx
The single integral equation method is applied to the scattering of electromagnetic waves by particles in a layer on top of a substrate. A second layer on top of the first one can have indentations.

Measurement Comparison of Stylus Radii

January 1, 1997
Author(s)
Jun-Feng Song, Theodore V. Vorburger
Three methods were used for measuring the radii of the same stylus of our stylus instrument. The measurement results were compared and showed good agreement. Using razor blade tracing, the stylus radius was measured as r=1.60um with an expanded uncertainty

New NIST-Certified Small Scale Pitch Standard

January 1, 1997
Author(s)
James E. Potzick
The National Institute of Standards and Technology is developing a dimensional pitch standard covering the range 1 ?m to 10 mm, intended for the calibration of microscope magnification and dimensional metrology instrument scales. While NIST has long

On Chip Morphology, Tool Wear and Cutting Mechanics in Finish Hard Turning

January 1, 1997
Author(s)
Matthew A. Davies, Y K. Chou, Christopher J. Evans
Topography of surfaces produced in finish hard turning using cubic boron nitride (CBN) tools is affected by a large number of factors including tool wear and the mechanics of the chip formation process. This paper shows first that tool wear rates are

On the Dynamics of Chip Formation in Machining Hard Metals

January 1, 1997
Author(s)
Matthew A. Davies, Timothy J. Burns, Christopher J. Evans
The results of orthogonal cutting tests on electroplated Nickel-Phosphorus (15% phosphorus) and AISI 52100 bearing steel are presented and compared. For both materials, chips become segmented at relatively low cutting speeds (0.3 m/s to 2 m/s) due to the

Optically Isolated Current to Voltage Converter in an Electron Optics System

January 1, 1997
Author(s)
Alan H. Band, John Unguris
A simple, inexpensive, optically isolated current-to-voltage converter circuit has been developed for the measurement of bipolar currents in the range of 10 pA to 1 %A on the biased elements of an electron optics system at voltages up to 3.5 kV. The design

Pitch and Step Height Measurements Using NIST

January 1, 1997
Author(s)
R Koning, Ronald G. Dixson, Joseph Fu, V W. Tsai, Theodore V. Vorburger, Edwin R. Williams, X Wang
The use of the atomic force microscope (AFM) for step height and pitch measurements in industrial applications is rapidly increasing. To compare the results obtained by different instruments and to achieve high accuracy, the scales of an AFM must be

Results of the NIST National Ball Plate Round Robin

January 1, 1997
Author(s)
Gregory W. Caskey, Steven D. Phillips, Bruce R. Borchardt
This report examines the results of the ball plate round robin administered by NIST. The round robin was part of an effort to assess the current state of industry practices for measurements made using coordinate measuring machines. Measurements of a two

The Calculation of CMM Measurement Uncertainty via The Method of Simulation by Constraints

January 1, 1997
Author(s)
Steven D. Phillips, Bruce R. Borchardt, Daniel S. Sawyer, William T. Estler, David E. Ward, K Eberhardt, M. Levenson, Marjorie A. McClain, B Melvin, Ted Hopp, Y Shen
The calculation of task specific measurement uncertainty when using coordinate measuring machines is an important and challenging task. Current methods to address this issue use simulation techniques (e.g., the virtual CMM) where the propagation of known

The Scanning Electron Microscope

January 1, 1997
Author(s)
Michael T. Postek
The scanning electron microscope (SEM) is an important research and production tool extensively used in many phases of industry throughout the world. The popularity of the instrument results from the need to inspect and obtain information about samples
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