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Jun-Feng Song, Samuel R. Low III, David J. Pitchure, Theodore V. Vorburger
Recent developments in standard hardness machines and microform calibration techniques have made it possible to establish a worldwide unified Rockwell hardness scale with metrological traceability. This includes the establishments of the reference
This paper describes the combination of previously-developed component placement and routing algorithms into an integrated computational approach to product layout optimization. Previous work introduced simulated annealing-based algorithms for optimal
This paper presents an integrated framework for assembly design. The framework will allow the designer to represent knowledge about the design process and constraints as well as information about the artifact being designed, design history and rationale
O Glembocki, J Tuchman, John A. Dagata, K Ko, S Pang, C Stutz
Photoreflectance has been used to study the electronic properties of (100) GaAs surfaces exposed to a Cl2/Ar plasma generated by an electron cyclotron resonance source and subsequently passivated by P2S5. The plasma etch shifts the Fermi level of p-GaAs
Within the National Institute of Standards and Technology (NIST), which administers the Malcolm Baldrige National Quality Award (MBNQA), a NIST technical division has initiated a Baldrige-based effort to increase the effectiveness of its research and
Within the National Institute of Standards and Technology (NIST), which administers the Malcolm Baldrige National Quality Award (MBNQA), a NIST technical division has initiated a Baldrige-based effort to increase the effectiveness of its research and
The extinction cross-sections of doublets of polystyrene and carbon spheres are determined using the optical theorem. The forward scattering amplitude is computed using the single integral equation method. The extinction cross-sections of the doublets are
This study introduces the idea of the sharpness concept in relationship to the determination of scanning electron microscope (SEM) perfomance. Scanning electron microscopes are routinely used in many manufacturing environments. Fully automated or
R Koning, Ronald G. Dixson, Joseph Fu, V W. Tsai, Theodore V. Vorburger
The most important industrial application of Atomic Force Microscopy (AFM) is probably the accurate measurement of geometrical dimensions of small surface structures. In order to maintain the instrument''s performance and to achieve the high accuracy often
Gradient-based numerical optimization of complex engineering designs offers the promise of rapidly producing better designs. However, such methods generally assume that the objective function and constraint functions are continuous, smooth, and defined
Jun-Feng Song, Samuel R. Low III, Walter S. Liggett Jr, David J. Pitchure, Theodore V. Vorburger
A metrology-based Rockwell hardness scale is established by a standard machine and a standard diamond indenter. Both must be established through force and dimensional metrology with acceptably small measurement uncertainties. In 1994, NIST developed a
Ronald G. Dixson, V W. Tsai, Theodore V. Vorburger, Edwin R. Williams, X Wang, Joseph Fu, R Koning
The presence of the atomic force microscope (AFM) in the industrial metrology setting is rapidly increasing. Properties commonly measured in such applications are: feature spacing (pitch), feature height (or depth), feature width (critical dimension), and
In microform metrology, complex 3-D surface features in the micrometer range must be quantified for their space and size including dimensions, curves, angles, profile deviations, and alignment errors, as well as surface roughness with measure uncertainties
R Koning, Ronald G. Dixson, Joseph Fu, V W. Tsai, Theodore V. Vorburger
The use of the atomic force microscope (AFM) to characterize surface structures for industrial applications is rapidly increasing. To compare the results obtained by different instruments and to achieve high accuracy, the scales of an AFM must be
We demonstrate a new method of performing the absolute three flat test using reflection symmetries of the surfaces and an algorithm for generating the rotation of arrays of pixel data. Most of the operations involve left/right and top/bottom flips of data
Christopher J. Evans, R E. Parks, David J. Roderick, Michael L. McGlauflin
The rapidly renewable lap (RRL) uses a textured substrate over which thin films are slumped. The substrate provides the geometry of the lap and a localized texture, depending on the film thickness, properties, and means by which it is deformed over and
Developing approaches to integrating manufacturing applications is important for increasing manufacturing productivity. A reactive scheduling system architecture has been developed that defines how to integrate scheduling technology with manufacturing shop
A cross-section of length measurement capabilities fiom the Precision Engineering Division within the National Institute of Standards and Technology is benchmarked against those of other leading National Measurement Institutes. We present a variety of
Dennis A. Swyt, Howard H. Harary, Michael T. Postek, Richard M. Silver, Theodore V. Vorburger
This report, based on U.S. industry roadmaps and related National Institute of Standards and Technology studies, is a product of the process of strategic planning for the NIST Precision Engineering Division (PED) and presents the major technological trends
Jack A. Stone Jr., Martin Schroeck, Michael T. Stocker
We have made a study of one method for testing displacement-measuring interferometer systems, a modified back-to-back comparison, that automatically compensates for changes in the optical path length between the two interferometers. Although this method
E Voelkl, K Alexander, J Mabon, M O'Keefe, Michael T. Postek, M Wright, N J. Zaluzec
The Materials Microcharacterization Collaboratory (MMC) was created last year as a pilot project within the U.S. Department of Energy''s DOE2000 program. The DOE2000 program has, as its main goals, to develop improved capabilities for solving DOE''s
The growth rate and electrical character of nanostructures produced by scanned probe oxidation are investigated by integrating an in-situ electrical force characterization technique, scanning Maxwell-stress microscopy, into the fabrication process
V W. Tsai, Theodore V. Vorburger, Ronald G. Dixson, Joseph Fu, R Koning, Richard M. Silver, E. C. Williams
Due to the limitations of modern manufacturing technology, there is no commercial height artifact at the sub-nanometer scale currently available. The single-atom steps on a cleaned silicon (111) surface with a height of 0.314 nm, derived from the lattice