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Conferences

Optical Linewidth Models: Then and Now

June 1, 1999

Author(s)

Robert D. Larrabee, Richard M. Silver, M P. Davidson

In the late 1970's, Dr. Diana Nyyssonen demonstrated that NIST could optically calibrate photomask linewidth standards that were narrower than the classical

Telepresence: A New Paradigm for Industrial and Scientific Collaboration

June 1, 1999

Author(s)

Michael T. Postek, Marylyn H. Bennett, N J. Zaluzec

The successful development of a collaboratory for Telepresence Microscopy (TPM) provides an important new tool to promote technology transfer in the areas of

Modeling and Experimental Aspects of Apparent Beam Width as an Edge Resolution Measure

June 1, 1999

Author(s)

C Archie, J R. Lowney, Michael T. Postek

The SEMATECH advanced metrology advisory group (AMAG) recently issued a critical dimension (CD) scanning electron microscope (SEM) specification. One component

Carrier Concentration Dependence of Scanning Capacitance Microscopy Signal in the Vicinity of P-N Junctions

June 1, 1999

Author(s)

Joseph Kopanski, Jay F. Marchiando, Brian G. Rennex

Scanning capacitance microscopy was used to image 1) boron dopant gradients in p-type silicon, and 2) identical boron dopant gradients in n-type silicon. The

High Accuracy High Speed Gaussian Filter in Surface Metrology

May 31, 1999

Author(s)

Y B. Yuan, Jun-Feng Song, Theodore V. Vorburger

Both (1+x^2)^(-n) and (sin x/x)^n functions are very close to the Gaussian distribution for large value of n. Based on these functions, two new algorithms are

Update on a Consumer-Oriented Guide for Surge Protection

May 27, 1999

Author(s)

Francois D. Martzloff, T. S. Key, D. Nastasi, K. O. Phipps, J. May

Caught among contradictory stories on the need for surge protection as well as unsupported anecdotes of surge-related failures found in some editorial

Cyanate Ester Clay Nanocomposites: Synthesis and Flammability Studies

May 23, 1999

Author(s)

Jeffrey W. Gilman, Richard H. Harris Jr., Douglas Hunter

New goals outlined by the U. S. Federal Aviation Administration (FAA) Advanced Fire-Safe Aircraft Materials Research Program enumerate an order-of-magnitude

Bursting Bubbles From Combustion of Thermoplastic Materials in Microgravity.

May 18, 1999

Author(s)

Kathryn M. Butler

Many thermoplastic materials in common use for a wide range of applications, including spacecraft, develop bubbles internally as they bum due to chemical

Bursting Bubbles From Combustion of Thermoplastic Materials in Microgravity

May 18, 1999

Author(s)

Kathryn M. Butler

Many thermoplastic materials in common use for a wide range of applications, including spacecraft, develop bubbles internally as they bum due to chemical

A Framework for Throughput and Stability Analysis of a DS-CDMA Network

May 17, 1999

Author(s)

Vladimir V. Marbukh, Nader Moayeri

We propose a framework for throughput and stability analysis of a Direct Sequence Code Division Multiple Access (DS-CDMA) network. Given chip rate, processing

Critical Infrastructures Protection: Research Agendas for Information Systems Security

May 17, 1999

Author(s)

Stuart W. Katzke, A Oldehoeft, Shirley M. Radack

Several national studies have examined the vulnerabilities and threats to the critical infrastructures upon which the United States depends for its national

A Statistical Text-To-Phone Function Using Ngrams and Rules

May 10, 1999

Author(s)

W M. Fisher

Adopting concepts from statistical language modeling and rule-based transformations can lead to effective and efficient text-to-phone (TTP) functions. We

Cyclic Contact Fatigue of Brittle Ceramics

May 10, 1999

Author(s)

Brian R. Lawn, Yeon-Gil G. Jung, D H. Kim, S K. Lee, I M. Peterson

Contact damage modes in cyclic loading with spheres are investigated in several ceramics, principally silicon nitride but also some ceramics used for dental

Construction Metrology Beyond Earth: A White Paper

May 6, 1999

Author(s)

D T. Latimer

Construction metrology standardization research currently focuses on terrestial applications. For space based applications, there is the potential for great

Compensation of Thermal Expansiveness In Plastic DCA-Flip-Chip Assemblies Using A Mechanically Compliant Dielectric

May 3, 1999

Author(s)

Jan Obrzut

Application of a compliant, low modulus dielectric layer between the chip joints (C4) and the carrier can decrease the thermally induced bending and probability

Modeling Chamber Radiation Effects on Pyrometric Temperature Measurement in Rapid Thermal Processing

May 2, 1999

Author(s)

F Rosa, Yong Zhou, Z M. Zhang, D P. DeWitt, Benjamin K. Tsai

A detailed analysis of the radiation environment in the lower chamber of the RTP test bed at the National Institute of Standard and Technology (NIST) is

Overview of the Manufacture and Certification of Electrodeposited Coating Thickness Standard Reference Materials

May 1, 1999

Author(s)

Carlos R. Beauchamp, Hilary B. Gates, David R. Kelley, Stefan D. Leigh

This paper documents major changes in the production of Electrodeposited Coating Thickness Standard Reference Materials. These standards consist of pre

Characterization of Nanostructured Tungsten Heavy Alloy Produced by Double Ball Milling

May 1, 1999

Author(s)

Frank S. Biancaniello, Stephen D. Ridder, Maureen E. Williams, Rodney D. Jiggetts, L S. Magness

Tungsten powder was ball milled in a controlled atmosphere environment with rapidly solidified powders to produce a nanostructured material. The milled powders

Characterization of Atomized High Nitrogen Stainless Steel as a Possible Implant Material

May 1, 1999

Author(s)

Frank S. Biancaniello, Rodney D. Jiggetts, Richard E. Ricker, Stephen D. Ridder

High Nitrogen Stainless Steel (HNSS) can simultaneously have high strength (ultimate and yield), high hardness, high ductility, and outstanding corrosion

The Formation and Behavior of Particles in Silane Discharges

May 1, 1999

Author(s)

Alan Gallagher

Particle growth in silane RF discharges and the incorporation of particles into hydrogenated-amorphous-silicon (a-Si: H) devices is described. Measurements of

Carbon Monoxide and Soot Formation in Inverse Diffusion Flames.

May 1, 1999

Author(s)

L G. Blevins, George W. Mulholland, R W. Davis

The objective of this project is to study carbon monoxide (CO) and soot formation in laminar, inverse diffusion flames (IDFs). The IDF is used because it is a

Evolution of Refrigerant Application

May 1, 1999

Author(s)

Piotr A. Domanski

The paper reviews the development of chlorofluorocarbon refrigerants, the implemented replacements of ozone-depleting fluids, other considered alternatives, and

Test Procedure Development for Residential Dishwashers

May 1, 1999

Author(s)

Natascha S. Milesi-Ferretti

It has been recognized that the current Department of Energy (DOE) dishwasher test procedure is inadequate in testing soil sensing dishwashers. As a result, DOE

The Fujita Tornado Intensity Scale: A Reassessment From Structural Engineering Perspective

May 1, 1999

Author(s)

Long T. Phan, Emil Simiu

This paper is a condensed version of two previous publications: NIST Technical Note 1426, by Long T. Phan and Emil Simiu; and ASCE Civil Engineering magazine

Relating Thermoplastic Olefin (TPO) Microstructure to Paint Adhesion

May 1, 1999

Author(s)

Mark R. VanLandingham

Advances in the use of the atomic force microscope (AFM) to characterize polymeric materials have recently been made. Phase imaging with the AFM has emerged as

Polystyrene Box Uniform Light Sources

May 1, 1999

Author(s)

Edward F. Kelley

Evaluation of Light Measuring Devices for Flying-Spot Display Measurements

May 1, 1999

Author(s)

Paul A. Boynton

Calculable Coaxial Resistors for Precision Measurements

May 1, 1999

Author(s)

Randolph E. Elmquist

Coaxial straight-wire resistors have been constructed with the purpose of improving comparisons between resistors, capacitors, and inductors in the audio

Flat-Panel Display Measurements and Standards

May 1, 1999

Author(s)

Edward F. Kelley

0.1-10 GHZ CMOS Voltage Standard

May 1, 1999

Author(s)

Dylan F. Williams, Dave K. Walker

We discuss the development of a sinusoidal CMOS voltage standard. The standard incorporates a FET power sensor that transfers the voltage measured at a primary

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