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We examine the performance of multimodal biometric authentication systems using state-of-the-art Commercial Off-the-Shelf (COTS) fingerprint and face biometric
Jon R. Pratt, John A. Kramar, David B. Newell, Douglas T. Smith
If nanomechanical testing is to evolve into a tool for process and quality control in semiconductor fabrication, great advances in throughout, repeatability
B D. Vogt, Christopher Soles, Vivek Prabhu, Sushil K. Satija, Eric K. Lin, Wen-Li Wu
The emergence of immersion lithography as a potential alternative for the extension of current lithography tools will require a fundamental understanding of the
Malgorzata Kopycinska-Mueller, Roy H. Geiss, Paul Rice, Donna C. Hurley
Tip wear and its corresponding change in geometry is a major impediment for quantifying atomic force acoustic microscopy (AFAM). To better understand the
John E. Kitching, Svenja A. Knappe, Li-Anne Liew, P Schwindt, V Shah, John Moreland, Leo W. Hollberg
We summarize the development of microfabricated atomic frequency references at NIST. The physics packages of these devices have volumes near 10 mm3, power
The physical mechanisms responsible for the degradation and breakdown of silicon dioxide have been studied for over three decades. Although a large body of
Peter Yim, Xiaoyi Y. Zhang, E S. DeJong, J M. Carroll, John P. Marino, Lori S. Goldner
We used single molecular fluorescence resonance energy transfer (FRET) to understand the conformation of a RNA loop to loop complex, termed a kissing complex
We have begun to demonstrate the next generation of coatings for laser power and energy measurement standards, which are based on carbon nanotubes on a variety
Thomas A. Siewert, David R. Smith, Yi-Wen Cheng, Juan C. Madeni, S X. Liu
The rising interest in lead-free solders creates a need for complete property data on the various lead-free solder compositions. Various types of data are
This paper examines the hypothesis that the under-prediction errors of current finite element analysis (FEA) springback models would be eliminated by the
Both infrared and Raman are increasingly applied in biomolecular structure characterization, thus getting acceptance alongside traditional bioanalytical
Ulf Griesmann, Quandou (. Wang, Johannes A. Soons, Remi Carakos
When measuring the form errors of precision optics with an interferometer, the calibration of the reference wavefront is of central importance. Ball averaging
Nadia Machkour-Deshayes, Ulf Griesmann, Byoung C. Kim
A method for the measurement of precise aspheric optical surfaces based on measurements of the second derivatives of the surface is evaluated. A compact phase
Jun-Feng Song, Li Ma, Eric P. Whitenton, Theodore V. Vorburger
Autocorrelation and cross-correlation functions are proposed for 2D and 3D surface texture comparisons. At the maximum correlaton point of the two correlated
Features on photomasks used in the semiconductor industry have steadily decreased in size to fit more elements on a wafer. When the size becomes smaller than
Over the past decade modern measurement uncertainty evaluation has evolved from an obscure art practiced at National Measurement Institutes (NMIs) to an
Joseph Fu, Ronald G. Dixson, Ndubuisi G. Orji, Theodore V. Vorburger, C Nguyen
Image stitching is a technique that combines two or more images to form one composite image, which provides a field of view that the originals cannot. It has
Theodore D. Doiron, Eric S. Stanfield, Bryon S. Faust, John R. Stoup, Mary Abbott
A number of new or revised services in dimensional metrology are presented. Included are: a lower cost, high accuracy calibration for sphere diameter; reduced
Sensors and networks, both wired and wireless, are key components in building distributed sensor networks nation-wide for monitoring and protecting critical
Shu Guo, Martin Y. Chiang, Christopher M. Stafford
Mechanical properties of ultra-thin (submicrometer) films coated on a substrate are paramount in many applications. One question arises as to whether the
Shu Guo, Christopher M. Stafford, Martin Y. Chiang
We recently reported on a new buckling-based metrology for probing the elastic modulus of thin polymer films. In this experimental geometry, a thin film of