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Chip-Scale Atomic Frequency References: Fabrication and Performance

Published

Author(s)

John E. Kitching, Svenja A. Knappe, Li-Anne Liew, John Moreland, Hugh Robinson, P Schwindt, V Shah, Vladislav Gerginov, Leo W. Hollberg

Abstract

The physics package for a chip-scale atomic frequency standard was constructed and tested. The device has a total volume of 9.5 mm3, dissipates 75 mW of electrical power at an ambient temperature of 45 °C and has a short-term fractional frequency instability of 2.4×10-10/√τ. Advanced cell fabrication techniques indicate a long-term instability near 10-11 may be feasible
Proceedings Title
Proc. EFTF Conf.
Conference Dates
March 21-24, 2005
Conference Location
Besancon,

Keywords

atomic, clock, compact, microfabrication., wafer bonding

Citation

Kitching, J. , Knappe, S. , Liew, L. , Moreland, J. , Robinson, H. , Schwindt, P. , Shah, V. , Gerginov, V. and Hollberg, L. (2005), Chip-Scale Atomic Frequency References: Fabrication and Performance, Proc. EFTF Conf., Besancon, , [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=50132 (Accessed May 22, 2024)

Issues

If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.

Created March 21, 2005, Updated February 17, 2017