The Department of Commerce awarded Entegris up to $77 million in direct funding to support the construction of a state-of-the-art manufacturing center in Colorado Springs, Colorado. The center is being built in multiple phases: the first phase will support the production of Front Opening Unified Pods (FOUPs) and liquid filter membranes, and the second phase is expected to support the production of advanced liquid filters and fluid handling solutions. In addition to the manufacturing center, Entegris is committed to further expanding its R&D capabilities in the United States by the end of the decade. This investment will onshore critical semiconductor supply chain materials and solutions for leading-edge chip production.
Entegris is a leading supplier of advanced materials and process solutions for the semiconductor and other high-technology industries. Notably, the company invented FOUPs, which are highly specialized containers that secure semiconductor wafers while they are handled and transported during the manufacturing process and are currently produced exclusively abroad. These internal transportation systems have dramatically enhanced the productivity of semiconductor manufacturing over the last two decades, with many of the world’s largest chipmakers, like Intel, TSMC, Micron, and GlobalFoundries, being major customers for these carriers. Entegris is also a global leader in the production of advanced membranes, chemical filters, and chemical storage drums that help with contamination control and the purification of processing chemicals in the semiconductor production process. As semiconductor technology continues to become more advanced, demand for these materials and solutions is rapidly increasing.
Entegris Project Overview | ||
|---|---|---|
Project Summary | Recipient | Entegris |
| Location(s) | Colorado Springs, Colorado | |
| Congressional District | Georgia's 5th Congressional District | |
| Estimated Job Creation | Approximately 900 direct jobs | |
Financial Summary | Program | CHIPS Program Office |
| Direct Funding Amount | Up to $75 million and $2 million in dedicated workforce funding | |
| Expected Capital Expenditure | $722 million | |
Facility Summary | Project Type | Construction and onshoring of critical supply chain materials and equipment for leading-edge chip production |
| Technology | Advanced materials and process solutions | |
| Project Timeline | Phase 1 peak capacity by 2028 and Phase 2 peak capacity by 2032 | |