Projects/Programs

Displaying 1 - 25 of 40

Advanced Materials: Elemental and Chemical Analysis of Microstructured Materials

Ongoing

Projects: DTSA-II – Pushing the Limits of Energy Dispersive X-ray Spectrometry Multimodal Superresolution Microscopy Forensic Trace Evidence

Advanced Materials: X-ray Science for Standards and Analysis

Ongoing

Projects: Theoretical Calculations of Near-Edge X-ray Spectra Microcalorimeter X-ray Detector X-ray Spectroscopy and Electronic Structure of Solids X-ray Methods for Chemical Imaging at Micro to Mesoscales

Applied Single-Electron Metrology

Ongoing

Atoms are natural high-fidelity standards. They are used as the basis for time and frequency standards as well as qubits in nascent quantum computer architectures. Electrostatically defined, single-electron devices behave as tunable artificial atoms which can trap, manipulate, and shuttle electrons...

Argon mini-arc meets its match: Use of a laser-driven plasma source in ultraviolet-detector calibrations

Ongoing

Many national measurement institutes, like the National Institute of Standards and Technology (NIST), provide radiometric detector and source calibration services, which span the optical portion of the electromagnetic spectrum. Optical radiation includes the ultraviolet, visible, and infrared...

Atom-scale Devices: Engineering, Metrology and Manufacturability

Ongoing

For these atomically defined devices, the exact position, type, number of atoms, and their arrangement, dramatically influence device behavior. By controlling the precise atomic makeup and geometry of a device it is possible to engineer a device’s electronic, quantum and mechanical structure to a...

Connecting Quantum Electronics and Photonics using Silicon Color Centers

Ongoing

Overview: In the first decades of the semiconductor electronics industry, color centers were ubiquitous in silicon. However, through iterative refinement of materials’ processing and spectroscopy methods, color centers are virtually non-existent in commercial silicon today, and leveraging their...

Deep Level Transient Spectroscopy/Deep Level Optical Spectroscopy

Ongoing

Custom system (0.01 eV – 6 eV) for the identification of trap energy, density, and cross-section of the important recombination centers (deep-level defects) in emerging wide-bandgap materials.

Designing Advanced Scanning Probe Microscopy Instruments

Ongoing

SPM is a general acronym for various probe instruments. The "P" in SPM stands for various types of probe measurements, such as capacitance (C), force (F), tunneling (T), etc. The scanning tunneling microscope (STM), including custom designs at the CNST, uses the quantum mechanical principle of...

Designing the Nanoworld: Nanostructure, Nanodevices, and Nano-optics

Ongoing

Developing and exploiting nanodevices for quantum and nanotechnologies requires nanoscale and atomic scale modeling of ultrasmall structures, devices, their operation, and their response to probes. Key challenges of understanding physics at the quantum/classical interface and measurement at the...

Electron Spin Resonance at the Single Atom Level

Ongoing

To study electron spin resonance (ESR) on single atoms requires a tool that can probe at atomic length scales. The scanning tunneling microscope (STM) is ideally suited for this, using a tunneling current to probe surfaces. To implement this ESR-STM combination, we send a radio frequency (RF...

Electronics for Cryogenic Environments

Ongoing

The operation of electronics optimized for room temperature applications in cryogenic environments introduces a remarkable number of physical and engineering hurdles. It is unsurprising that devices and circuits designed for room temperature encounter shifts in their operation parameters in...

Emerging Power Electronic Devices

Ongoing

The ongoing electrification of society has elevated the importance of electric transportation, renewable energy distribution, and data centers. It has also put new demands on the technologies -- called power electronics -- that control, interface, and transmit the electrical energy that powers our...

Engineered Designed Lattice Ferroelectric

Engineered Designer Lattices for Quantum Systems

Ongoing

Exposing the low-dimensional materials to a superlattice periodic potential is an effective way to engineer their electronic and other solid-state properties. One example is the moiré superlattice, created by stacking two-dimensional layers at a twist angle, which leads to novel band structures and...

Extreme ultraviolet optical constants

Ongoing

Measurements of EUV optical constants are often made by measuring the absorption or near-normal-incidence reflectivity, then performing transforms to obtain both the real and imaginary parts of the index. These sorts of measurements have considerable uncertainty because they require knowledge of...

Fabrication and Metrology of Novel Magnetic Tunnel Junctions in the Ultra-thin Barrier Limit

Completed

Within a broader program of exploring methods to fabricate structures with novel electronic properties at the nanometer scale, we are using highly charged ions (HCIs) to produce ensembles of nano-features within magnetic tunnel junctions (MTJs). Technologically, MTJs are a major component of...

Graphene

Ongoing

Two remarkable features of graphene that are opening avenues to multiple applications are its high transport carrier mobility and the broad tunability of its electronic properties. Graphene charge carriers can be tuned continuously from negative carriers (i.e., electrons) to positive carriers (holes...

High Speed (Time Domain) Power Device Characterization

Ongoing

Custom electrical characterization equipment designed to capture the time-domain transients associated with charge trapping in important power electronic devices.

High Temperature Device Characterization

Ongoing

High temperature electrical device characterization (un-packaged) from room temperature up to 1273K.

High Temperature Hall Effect Measurements

Ongoing

Customized Hall effect measurement apparatus which supports measures of Hall effect mobility and resistivity of semiconducting films across a wide range of temperatures (77K-825K).

High Voltage Device Characterization

Ongoing

High-voltage electrical device characterization at the package level (3,000 V / 50 A).

Integer and Fractional Quantum Hall Effect

Ongoing

Integer Quantum Hall Effect Graphene is a unique 2DEG system that is exposed at the surface and can be probed with scanning tunneling measurements.  A hallmark of graphene that results from the unique linear dispersion is that the energy spacing between the Landau levels is not constant but varies...

Light-matter interactions in Semiconductor Nanostructures

Ongoing

We investigate the interaction of light with semiconductor-based nanostructures. We extend concepts of entanglement and coherence in atomic physics to our solid-state systems. Our devices are based on semiconductors, like GaAs. We use InAs quantum dots (QDs) in GaAs as artificial atoms; they have...

Machine Learning to Predict Multicomponent Colloidal Crystals

Ongoing

There is a direct link between a material’s macroscopic properties and its microscopic structure, which makes rational bottom-up self-assembly a powerful tool for engineering properties of materials. In general, colloids are facile material building blocks whose shape, charge, and surface...

Massively Parallel Reliability Test Platform

Ongoing

Statistical measures of various wear-out/reliability aging mechanisms across large populations of semiconductor devices.

Micro- and nano-optomechanical systems

Ongoing

Our primary current research direction involves the use of fabricated devices with sub-wavelength periodicity (photonic crystals) as optomechanical elements. Such structures enable a rich variety of devices, including mirrors, polarizers, and filters, in a configuration that couples naturally to...

NIST Headquarters
-Creating Helpful Incentives to Produce Semiconductors for America (CHIPS)
--CHIPS Program Office
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--Communications Technology Laboratory
---Quantum Communications Division
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----Quantum Networking Transduction Group
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---RF Technology Division
----High-Speed Waveform Metrology Group
----Superconductive Electronics Group
----Guided Wave Electromagnetics Group
----Electromagnetic Fields Group
----RF Technology Division - HQ
---Smart Connected Systems Division
----IoT Devices and Infrastructures Group
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----Smart Connected Manufacturing Systems Group
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---Spectrum Technology and Research Division
----Applied Systems Metrology Group
----Fiber Sources and Applications Group
----Shared Spectrum Metrology Group
----Spectrum Technology and Research – HQ
---Wireless Networks Division
----Internet Technologies Research Group
----Radio Access and Propagation Metrology Group
----Wireless Networks Division - HQ
----Wireless Systems Innovation and Performance Group
---Public Safety Communications Research Division
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----Advanced Communications Research Group
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---Communications Technology Laboratory HQ
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----Boulder Laboratory Director Office
--Engineering Laboratory
---Building Energy and Environment Division
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---Intelligent Systems Division
----Intelligent Systems - HQ
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---Materials and Structural Systems Division
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----Infrastructure Materials Group
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----Materials and Structural Systems - HQ
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---Engineering Laboratory Office
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----Engineering Laboratory - HQ
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---Fire Research Division
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---Systems Integration Division
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----Information Modeling and Testing Group
----Systems Integration - HQ
--Information Technology Laboratory
---Applied Cybersecurity Division
----Applied Cybersecurity - HQ
----Cybersecurity and Privacy Applications Group
----National Cybersecurity Center of Excellence
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---Computer Security Division
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----Cryptographic Technology Group
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---Applied and Computational Mathematics Division
----Mathematical Software Group
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----Quantum Information Group
----High Performance Computing and Visualization Group
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---Statistical Engineering Division
----Applied and Computational Statistics Group
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---AI Research, Measurement, and Standards Division
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----Applied AI Research Group
---Technology Test and Evaluation Division
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----Biometric Technologies Group
----Multimedia Language Technologies Group
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---Information Technology Laboratory Office
----Office of IT Standardization
----Information Technology Laboratory Office - HQ
----Office of Chief Cybersecurity Advisor
--Laboratory Programs
---Emerging Technologies Acceleration Program
----Artificial Intelligence Accelerator Group
----Emerging Technologies Acceleration Program - HQ
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---Research Data and Computing Office
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---Research Protections Office
----Research Protections Office - HQ
---Research Security and Safeguarding Science Office
----Research Security and Safeguarding Science - HQ
---Standards Coordination Office
----International Standards Policy and Coordination Group
----Standards and Conformity Assessment Services Group
----Standards Coordination Office - HQ
----National Voluntary Laboratory Accreditation Program (NVLAP)
---Special Programs Office
----Special Programs Office-HQ
---Associate Director for Laboratory Programs
----Associate Director for Laboratory Programs - HQ
--Material Measurement Laboratory
---Office of Reference Materials
----Business and Quality Management Group
----Business Application Development, Support, and Security Group
----Sales and Customer Services Group
----Publication and Web Services Group
----Office of Reference Materials - HQ
----Materials and Physical Services Group
---Material Data Division
----Data Science and AI Group
----Material Data Division – HQ
----Theory, Modeling, and Simulation Group
----Data Center and Business Group
----Data Services and Infrastructure Group
---Biosystems and Biomaterials Division
----Biomarker and Genomic Sciences Group
----Cellular Engineering Group
----Biomaterials Group
----Complex Microbial Systems Group
----Cell Systems Science Group
----Biosystems and Biomaterials Division - HQ
---Chemical Sciences Division
----Biochemical and Exposure Science Group
----Optical Measurements Group
----Chemical Process and Nuclear Measurements Group
----Gas Sensing Metrology Group
----Inorganic Chemical Metrology Group
----Biospecimen Science Group
----Chemical Sciences Division - HQ
----Organic Chemical Metrology Group
---Biomolecular Measurement Division
----Biomolecular Structure and Function Group
----Mass Spectrometry Data Center Group
----Bioprocess Measurements Group
----Bioanalytical Science Group
----Biomolecular Measurement Division - HQ
----Applied Genetics Group
---Applied Chemicals and Materials Division
----Applied Chemicals and Materials Division - HQ
----Thermodynamics Research Center Group
----Thermophysical Properties of Fluids Group
----Nanoscale Reliability Group
----Fluid Characterization Group
----Fatigue and Fracture Group
---Materials Science and Engineering Division
----Thermodynamics and Kinetics Group
----Polymers Processing Group
----Mechanical Performance Group
----Polymers and Complex Fluids Group
----Materials Science and Engineering Division - HQ
----Functional Polymers Group
----Functional Nanostructured Materials Group
---Materials Measurement Science Division
----Security Technologies Group
----Surface and Trace Chemical Analysis Group
----Nanomechanical Properties Group
----Nano Materials Research Group
----Materials Structure and Data Group
----Microscopy and Microanalysis Research Group
----Synchrotron Science Group
----Materials Measurement Science Division - HQ
----Data and AI-Driven Materials Science Group
---Material Measurement Laboratory Office
----The Material Measurement Laboratory Office of Operations Group
----Material Measurement Laboratory - HQ
----Genome-Scale Measurement Group
--NIST Center for Neutron Research
---NIST Center for Neutron Research
----Research Facility Operations Group
----NIST Center for Neutron Research - HQ
----Reactor Operations and Engineering Group
----Neutron-Condensed Matter Science Group
--Physical Measurement Laboratory
---Microsystems and Nanotechnology Division
----Biophysical and Biomedical Measurement Group
----Microsystems and Nanotechnology - HQ
----Nanostructure Fabrication and Measurement Group
----Photonics and Optomechanics Group
---Time and Frequency Division
----Atomic Devices & Instrumentation Group
----Precision Photonic Synthesis Group
----Quantum & Nonlinear Nanophotonics Group
----Ion Storage Group
----Neutral Atom Optical Clocks Group
----Time Realization and Distribution Group
----Phase Noise Metrology Group
----Time and Frequency - HQ
---Quantum Physics Division
----Quantum Physics - HQ
---Radiation Physics Division
----Dosimetry Group
----Radioactivity Group
----Radiation Physics - HQ
----Neutron Physics Group
---Sensor Science Division
----Fundamental Thermodynamics Group
----Sensor Science - HQ
----Temperature & Humidity Group
----Remote Sensing Group
----Optical Radiation Group
----Fluid Metrology Group
----Surface and Interface Metrology Group
---Applied Physics Division
----Advanced Microwave Photonics Group
----Spin Electronics Group
----Applied Physics - HQ
----Faint Photonics Group
----Quantitative Nanostructure Characterization Group
----Molecular and Bio-Photonics Group
----Magnetic Imaging Group
----Quantum Nanophotonics Group
----Sources and Detectors Group
---Quantum Measurement Division
----Quantum Optics Group
----Mass and Force Group
----Quantum Measurement - HQ
----Laser Cooling and Trapping Group
----Fundamental Electrical Measurements Group
----Applied Electrical Metrology Group
---Quantum Sensors Division
----Device Fabrication Group
----Long Wavelength Sensors and Applications Group
----Quantum Calorimeters Group
----Quantum Electronics Group
----Quantum Sensors – HQ
---Nanoscale Device Characterization Division
----Atom Scale Device Group
----Nanoscale Device Characterization Division - HQ
----Alternative Computing Group
----Nanoscale Spectroscopy Group
----Advanced Electronics Group
----Quantum Nanoelectronics Group
---Physical Measurement Laboratory Office
----Boulder Microfabrication Facility
----Physical Measurement Laboratory- HQ
----Center for Nanoscale Science and Technology
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-Innovation & Industry Services
--Office of Advanced Manufacturing
---Microelectronics Manufacturing Division
----Microelectronics Manufacturing – HQ
----Microelectronics Strategy and Enterprise Group
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----Workforce and Equity Development Group
---Office of Advanced Manufacturing
----Office of Advanced Manufacturing - HQ
---Partnerships and Outreach Division
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---Program Operations Division
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----Program Operations - HQ
---Strategy and Planning Division
----Analysis and Benchmarking Group
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----Strategy and Planning – HQ
--Baldrige Performance Excellence Program
---Baldrige Performance Excellence Program Office
----Award Process Group
----Director's Office, Baldrige Performance Excellence Program
----Administrative Support/Electronic Information Group
----Outreach and Communications Group
----Publications Management Group
----Workforce Development Group
--Innovation & Industry Services
---Associate Director for Innovation & Industry Services
----Associate Director for Innovation & Industry Services - HQ
---Technology Partnerships Office
----Technology Partnerships Office - HQ
--Hollings Manufacturing Extension Partnership Program
---National Platforms Division
----National Platforms – HQ
----Network Knowledge Management Group
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---National Programs Division
----National Programs- HQ
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----Outreach and External Affairs – HQ
---Performance Evaluation and Economic Impacts Division
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----Performance Metrics and Evaluation Group
---Network Agreements Management Division
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----Node B Group
----Node A Group
---Internal Operations Division
----Internal Operations – HQ
---Hollings Manufacturing Extension Partnership Program Office
----Hollings Manufacturing Extension Partnership Program - HQ
-Director's Office
--Director's Office
---Communications and Outreach Office
----External Stakeholder Outreach Group
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----Internal Communications Group
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---Ombuds Office
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---Program Coordination Office
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---Director's Office
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---International and Academic Affairs Office
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