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Electronics

Semiconductors

Projects/Programs

Keyword

Organizational Unit

Fundamental Electromagnetic Technologies and Standards

Ongoing

U.S. innovation and industrial competitiveness rely on NIST to provide world class traceability to the International System of Units (SI) and to advance

Fundamental Metrology for Communications

Ongoing

NIST CTL’s Radio Frequency Technology Division conducts research into electromagnetic measurement, modeling, and theory in support of advanced wireless

GaN Nanowire Growth

Ongoing

GaN nanowires grown by catalyst-free molecular beam epitaxy have the unique property that most nanowires are completely free of crystalline defects. This

GaN Nanowire Metrology and Applications

Ongoing

We synthesize semiconductor nanostructures to serve both as test structures for measurement techniques and as building blocks for novel metrology tools and

Diagram showing the electro-thermo-mechanical relations in a crystal

Genomics of Electronic Materials

Ongoing

Our goal is to develop the metrology to enable a materials genomic approach to the discovery and optimization of complex electronic and electromagnetic

Getting from Qubit to Mega-Qubit Quantum Computers with Radio Frequency (RF) Calibrations

Ongoing

Today, device performance needs to be evaluated to determine success of materials development. This project will advance metrology for magnetic materials and develop models to predict device performance.

High Speed Metrology for Magnetoelectronic Devices and Models

Ongoing

Ferromagnet-based microelectronic devices play an increasingly important role within the semiconductor ecosystem. Magnetic RAM (MRAM) is already replacing

High-Frequency Electronics

Ongoing

The High-Frequency Electronics project supports advanced communications, millimeter-wave technologies, quantum computing, and the semiconductor industry through

Ab initio theoretical modeling for predicting structure and properties in advanced materials

Ongoing

We develop first-principles-based methods for prediction of atomic arrangements and properties in advanced materials and develop tools for the prediction and

Small array of transistors designed for single device integration.

Integrated CMOS Testbeds for Nanoelectronics and Machine Learning

Ongoing

With the rise of artificial intelligence and its insatiable demand for low-energy, high performance computing, research is accelerating into novel nanodevices

Light-matter interactions in Semiconductor Nanostructures

Ongoing

The quantum optics of light interacting with semiconductor-based nanostructures is being studied to extend concepts of entanglement and coherence in atomic

Magnetic Random Access Memory

Ongoing

The program on magnetic random-access memory develops metrology to determine how spin currents can be generated and used to control and manipulate magnetization

Custom-built wafer level probes in position to perform EDMR measurements on fully processed transistors.

Magnetic Resonance Spectroscopy

Ongoing

The Magnetic Resonance Spectroscopy Project strives to be at the forefront of understanding the roles that critical atomic-scale defects play in determining

Mapping of Thermal Properties at the Nanoscale

Ongoing

Precise measurements of thermal properties at the nanoscale are needed to engineer advanced and heterogeneously integrated devices, but measurements at this

Measurements of Point-Defect Chemistry in Complex Oxides

Ongoing

All inorganic materials contain point defects in the form of impurities, interstitials, or vacancies. Common imaging techniques fail to capture these defects

STM image of the surface states of a topological insulator - 3D perspective

Measuring Topological Insulator Surface State Properties

Ongoing

The transmission of information in today's electronics requires the movement of electrical charge, which expends energy and generates heat, creating two

A line drawing of a woman's head styled like a classical carved bust

METIS

Ongoing

A new publication describes METIS, a Metrology Exchange to Innovate in Semiconductors We are seeking comments on the draft publication through February 16, 2024

Schematic diagram of a 3D stacked integrated circuit (3D-SIC), achieved using copper through-silicon via interconnects.

Metrology for Emerging Integrated Systems

Ongoing

This program aims to develop the metrology to enable quantitative assessment of performance limiting reliability issues, and to describe the physics of failure

Metrology for extreme ultraviolet lithography

Ongoing

Much of the activity of the UV Physics Group is aimed at supporting the R&D effort by the microelectronics industry to develop Extreme Ultraviolet Lithography

RF Metrology for High-Frequency Transistor Models

Ongoing

Advanced semiconductor technology has led to continuous performance improvements in transistors. However, many iterations are needed to obtain optimal

Metrology for Integration of New Magnetic Materials

Ongoing

Electromagnetic (EM) systems use magnetic components such as inductors, isolators, and adaptive filters, but these are currently bulky and difficult to

Metrology of Materials, Surfaces, and Processes for Hybrid Advanced Packaging

Ongoing

Advanced bonding and integration physically bring together components, devices, and materials that are produced separately. There are strong economic and

A micromechanical bulk acoustic resonator that uses phononic crystal tethers to achieve a quality factor approaching the fundamental dissipation limit (fxQ can be as large as 1.2 x 1013 Hz)

Micro- and Nanoelectromechanical Systems

Completed

Microelectromechanical systems (MEMS) are integrated devices with critical applications in sensing, timing, signal processing, and biomedical diagnostics, and

Molecular Dynamics Simulation of Heat Transport in Gate-All-Around Transistors

Ongoing

Heat management in semiconductor devices is a crucial problem currently limiting device performance and essentially all progress involving reduction of device

Multiscale Modeling and Validation of Semiconductor Materials and Devices

Ongoing

A comprehensive understanding of how current and next-generation materials impact the performance of semiconductor devices is critical to U.S. Semiconductor

NIST Headquarters
-Creating Helpful Incentives to Produce Semiconductors for America (CHIPS)
--CHIPS Program Office
---CHIPS Program Headquarters
----CHIPS Program Headquarters - HQ
----Opportunity & Inclusion Group
---External & Government Affairs Division
----External & Government Affairs – HQ
---Investments Division
----Investments Division – HQ
---Operations Office
----Operations Office – HQ
---Risk Management Division
----Risk Management – HQ
---Strategy, Technology & Policy Division
----Strategy, Technology & Policy – HQ
--CHIPS Research & Development Program Office
---CHIPS Research & Development Program Headquarters Division
----CHIPS Research & Development Program Headquarters – HQ
----Integration & Policy Office
----Outreach & Partnerships Office
---External R&D Partnerships Division
----External R&D Partnerships – HQ
----National Advanced Packaging Manufacturing Program Group
----National Semiconductor Technology Center Group
---Industrial Advisory Committee
----Industrial Advisory Committee – HQ
---Semiconductor Manufacturing Institute Division
----Semiconductor Manufacturing Institute – HQ
---Semiconductor Metrology & Characterization Office
----Semiconductor Metrology & Characterization Office – HQ
-Management Resources
--Management Resources
---Associate Director for Management Resources
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---Grants Management Division
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----Acquisition Operations
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--Office of Information Systems Management
---Applications Systems Division
----Applications Systems - HQ
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---Business Systems Division
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---Information Technology Security & Networking Division
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---Identity, Credential, and Access Management Division
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---Customer Access and Support Division
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---Infrastructure Services Division
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---Office of Information Systems Management
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---Innovation and Solutions Division
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---Learning and Organizational Development Division
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--Office of Safety, Health and Environment
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---Gaithersburg Safety, Health and Environment Division
----Safety and Health Group
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----Fire and Facilities Safety Group
----Environmental Management Group
---Radiation Safety Division
----Radiation Facilities Group
----Program Development and Compliance Group
----Radiation Safety - HQ
---Boulder Safety, Health and Environment Division
----Boulder Safety, Health and Environment - HQ
--Office of Financial Resource Management
---Financial Systems and Reporting Division
----CBS Core Support Group
----CBS Feeder System Support Group
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----Financial Statements Group
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---Office of Financial Resource Management
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---Finance Division
----Finance - HQ
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---Financial Operations Division
----Travel Group
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----Accounts Payable II Group
----Financial Operations - HQ
----Accounts Payable Group
---Budget Division
----Technical and Extramural Programs Group
----Institutional Support and Facilities Group
----Budget - HQ
----Formulation and Financial Management Group
-Laboratory Programs
--Communications Technology Laboratory
---RF Technology Division
----High-Speed Waveform Metrology Group
----Superconductive Electronics Group
----Metrology for Wireless Systems Group
----Guided Wave Electromagnetics Group
----Electromagnetic Fields Group
----RF Technology Division - HQ
---Smart Connected Systems Division
----IoT Devices and Infrastructures Group
----Networked Control Systems Group
----Smart Connected Manufacturing Systems Group
----Smart Grid Group
----Transformational Networks and Services Group
---Spectrum Technology and Research Division
----Applied Systems Metrology Group
----Fiber Sources and Applications Group
----Shared Spectrum Metrology Group
----Spectrum Technology and Research – HQ
---Wireless Networks Division
----Internet Technologies Research Group
----Radio Access and Propagation Metrology Group
----Wireless Networks Division - HQ
----Wireless Systems Innovation and Performance Group
---Public Safety Communications Research Division
----Public Safety Communications Research Division - HQ
----Advanced Communications Research Group
----Network Operations Group
---Communications Technology Laboratory HQ
----Communications Technology Laboratory HQ Gp
----Boulder Laboratory Director Office
----Communication Test Coordination Office
--Engineering Laboratory
---Building Energy and Environment Division
----Building Energy and Environment - HQ
----Mechanical Systems and Controls Group
----Indoor Air Quality and Ventilation Group
----HVAC&R Equipment Performance Group
----Heat Transfer and Alternative Energy Systems Group
---Intelligent Systems Division
----Intelligent Systems - HQ
----Manipulation and Mobility Systems Group
----Cognition and Collaboration Systems Group
----Production Systems Group
----Sensing and Perception Systems Group
---Materials and Structural Systems Division
----Earthquake Engineering Group
----Infrastructure Materials Group
----Inorganic Materials Group
----Community Resilience Group
----Materials and Structural Systems - HQ
----Polymeric Materials Group
----Structures Group
---Engineering Laboratory Office
----Applied Economics Office
----Engineering Laboratory - HQ
----Engineering Laboratory Data, Security, Technology Group
---Fire Research Division
----National Fire Research Laboratory Group
----Wildland Urban Interface Fire Group
----Flammability Reduction Group
----Fire Research - HQ
----Engineered Fire Safety Group
----Fire Fighting Technology Group
---Systems Integration Division
----Life Cycle Engineering Group
----Process Engineering Group
----Information Modeling and Testing Group
----Systems Integration - HQ
--Information Technology Laboratory
---Applied Cybersecurity Division
----Applied Cybersecurity - HQ
----Cybersecurity and Privacy Applications Group
----National Cybersecurity Center of Excellence
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----NICE
---Computer Security Division
----Computer Security - HQ
----Cryptographic Technology Group
----Secure Systems and Applications Group
----Security Components and Mechanisms Group
----Security Test, Validation and Measurement Group
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---Applied and Computational Mathematics Division
----Mathematical Software Group
----Mathematical Analysis and Modeling Group
----Computing and Communications Theory Group
----High Performance Computing and Visualization Group
----Applied and Computational Mathematics - HQ
---Statistical Engineering Division
----Applied and Computational Statistics Group
----Statistical Design, Analysis, and Modeling Group
----Statistical Engineering - HQ
---Software and Systems Division
----Systems Interoperability Group
----Software Quality Group
----Software and Systems - HQ
----Cyber Infrastructure Group
----Information Systems Group
---Information Access Division
----Information Access - HQ
----Image Group
----Multimodal Information Group
----Retrieval Group
----Visualization and Usability Group
---Information Technology Laboratory Office
----Office of Computational Science for Metrology
----Office of Emerging Technologies
----Office of IT Standardization
----Office of Government and Industrial Liaison
----Information Technology Laboratory Office - HQ
----Office of Chief Cybersecurity Advisor
--Laboratory Programs
---Research Protections Office
----Research Protections Office - HQ
---Standards Coordination Office
----International Standards Policy and Coordination Group
----Standards and Conformity Assessment Services Group
----Standards Coordination Office - HQ
----National Voluntary Laboratory Accreditation Program (NVLAP)
---Special Programs Office
----Special Programs Office-HQ
----Law Enforcement Standards Office
---Associate Director for Laboratory Programs
----Associate Director for Laboratory Programs - HQ
--Material Measurement Laboratory
---Office of Reference Materials
----Business and Quality Management Group
----Business Application Development, Support, and Security Group
----Sales and Customer Services Group
----Publication and Web Services Group
----Office of Reference Materials - HQ
----Materials and Physical Services Group
---Office of Data and Informatics
----Office of Data and Informatics - HQ
----Data Services Group
----Data Sciences Group
---Biosystems and Biomaterials Division
----Biomarker and Genomic Sciences Group
----Cellular Engineering Group
----Biomaterials Group
----Genome-Scale Measurements Group
----Complex Microbial Systems Group
----Cell Systems Science Group
----Biosystems and Biomaterials Division - HQ
---Chemical Sciences Division
----Biochemical and Exposure Science Group
----Chemical Informatics Group
----Optical Measurements Group
----Chemical Process and Nuclear Measurements Group
----Gas Sensing Metrology Group
----Inorganic Chemical Metrology Group
----Biospecimen Science Group
----Environmental Chemical Sciences Group
----Chemical Sciences Division - HQ
----Marine Biochemical Sciences Group
----Organic Chemical Metrology Group
---Biomolecular Measurement Division
----Biomolecular Structure and Function Group
----Mass Spectrometry Data Center Group
----Bioprocess Measurements Group
----Bioanalytical Science Group
----Biomolecular Measurement Division - HQ
----Applied Genetics Group
---Applied Chemicals and Materials Division
----Applied Chemicals and Materials Division - HQ
----Thermodynamics Research Center Group
----Thermophysical Properties of Fluids Group
----Nanoscale Reliability Group
----Fluid Characterization Group
----Fatigue and Fracture Group
---Materials Science and Engineering Division
----Thermodynamics and Kinetics Group
----Polymers Processing Group
----Mechanical Performance Group
----Polymers and Complex Fluids Group
----Materials Science and Engineering Division - HQ
----Functional Polymers Group
----Functional Nanostructured Materials Group
---Materials Measurement Science Division
----Security Technologies Group
----Surface and Trace Chemical Analysis Group
----Nanomechanical Properties Group
----Nano Materials Research Group
----Materials Structure and Data Group
----Microscopy and Microanalysis Research Group
----Synchrotron Science Group
----Materials Measurement Science Division - HQ
----Data and AI-Driven Materials Science Group
---Material Measurement Laboratory Office
----The Material Measurement Laboratory Office of Operations Group
----Material Measurement Laboratory - HQ
----Genome-Scale Measurement Group
--NIST Center for Neutron Research
---NIST Center for Neutron Research
----Research Facility Operations Group
----NIST Center for Neutron Research - HQ
----Reactor Operations and Engineering Group
----Neutron-Condensed Matter Science Group
--Physical Measurement Laboratory
---Microsystems and Nanotechnology Division
----Biophysical and Biomedical Measurement Group
----Microsystems and Nanotechnology - HQ
----Nanostructure Fabrication and Measurement Group
----Photonics and Optomechanics Group
---Time and Frequency Division
----Atomic Devices & Instrumentation Group
----Precision Photonic Synthesis Group
----Quantum & Nonlinear Nanophotonics Group
----Atomic Standards Group
----Ion Storage Group
----Neutral Atom Optical Clocks Group
----Time Realization and Distribution Group
----Phase Noise Metrology Group
----Time and Frequency - HQ
---Quantum Physics Division
----Quantum Physics - HQ
---Radiation Physics Division
----Dosimetry Group
----Radioactivity Group
----Radiation Physics - HQ
----Neutron Physics Group
---Sensor Science Division
----Fundamental Thermodynamics Group
----Ultraviolet Radiation Group
----Sensor Science - HQ
----Dimensional Metrology Group
----Temperature & Humidity Group
----Remote Sensing Group
----Optical Radiation Group
----Fluid Metrology Group
----Surface and Interface Metrology Group
---Applied Physics Division
----Advanced Microwave Photonics Group
----Spin Electronics Group
----Applied Physics - HQ
----Faint Photonics Group
----Quantitative Nanostructure Characterization Group
----Quantum Devices Group
----Molecular and Bio-Photonics Group
----Optoelectronic Manufacturing Group
----Magnetic Imaging Group
----Quantum Nanophotonics Group
----Sources and Detectors Group
---Quantum Measurement Division
----Quantum Optics Group
----Mass and Force Group
----Quantum Measurement - HQ
----Laser Cooling and Trapping Group
----Fundamental Electrical Measurements Group
----Applied Electrical Metrology Group
----Atomic Spectroscopy Group
---Quantum Sensors Division
----Device Fabrication Group
----Long Wavelength Sensors and Applications Group
----Quantum Calorimeters Group
----Quantum Electronics Group
----Quantum Processing Group
----Quantum Sensors Group
----Quantum Sensors – HQ
----Nanoscale Spin Dynamics Group
----Microfabrication Group
----Spin Electronics Group
----Magnetics Group
---Nanoscale Device Characterization Division
----Atom Scale Device Group
----Nanoscale Device Characterization Division - HQ
----Alternative Computing Group
----Nanoscale Spectroscopy Group
----Advanced Electronics Group
----Nanoscale Processes and Measurements Group
---Physical Measurement Laboratory Office
----Boulder Microfabrication Facility
----Physical Measurement Laboratory- HQ
----PML Information Office
----Center for Nanoscale Science and Technology
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-Innovation & Industry Services
--Office of Advanced Manufacturing
---Microelectronics Manufacturing Division
----Microelectronics Manufacturing – HQ
----Microelectronics Strategy and Enterprise Group
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---Office of Advanced Manufacturing
----Office of Advanced Manufacturing - HQ
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--Baldrige Performance Excellence Program
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----Award Process Group
----Director's Office, Baldrige Performance Excellence Program
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----Publications Management Group
----Workforce Development Group
--Innovation & Industry Services
---Associate Director for Innovation & Industry Services
----Associate Director for Innovation & Industry Services - HQ
---Advanced Manufacturing Office
----Advanced Manufacturing Office - HQ
---Economic Analysis Office
----Economic Analysis Office - HQ
---Technology Partnerships Office
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---Technology Innovation Program Office
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--Hollings Manufacturing Extension Partnership Program
---National Platforms Division
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----Network Knowledge Management Group
----Supply Chain Group
---National Programs Division
----National Programs- HQ
---Network Learning and Strategic Competitions Division
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---Performance Evaluation and Economic Impacts Division
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---Regional and State Partnerships Division
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----Node B Group
----Node A Group
---Internal Operations Division
----Internal Operations – HQ
----Center Operations and Financial Management Group
---Extension Services Division
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---Hollings Manufacturing Extension Partnership Program Office
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-Director's Office
--Director's Office
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