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Projects/Programs: Grand Challenge 4: Modeling and Simulating Semiconductor Materials, Designs, and Components

Displaying 1 - 11 of 11

RF Channel Propagation Measurements and Models for Communications Circuits

Ongoing
The research community has long identified the need for propagation measurements to develop and evaluate communication circuits. Since 2011, NIST has been to prototyping state-of-the-art channel sounders for measuring RF channel propagation. NIST current channel sounders include LIDAR and camera

Dynamic EUV Metrology of Nanoscopic Thermal Transport in Active Devices

Ongoing
Heat is greatly impeding progress in microelectronics, which is only getting worse as dimensions are reduced and device architectures move more towards being 3-dimensional. The dynamics and physics of nanoscale thermal transport are unknown and dynamic measurements of active devices at this scale do

High Speed Metrology for Magnetoelectronic Devices and Models

Ongoing
The U.S. Semiconductor industry is integrating ferromagnet-based microelectronic devices such as magnetic RAM (MRAM) into existing silicon-based technologies. MRAM has much shorter write times and higher write endurance than the embedded Flash currently used. These properties makes MRAM highly

RF Metrology for High-Frequency Transistor Models

Ongoing
Due to the challenges of high-frequency measurements, that includes inaccuracy in on-wafer calibration and a lack of instrumentation for transistor characterization, models are currently extracted from low frequency measurements and extrapolated to higher frequencies. This methodology has been shown

Multiscale Modeling and Validation of Semiconductor Materials and Devices

Ongoing
The limitations of scaling traditional CMOS (complementary metal-oxide semiconductors) designs have necessitated that the semiconductor industry consider new materials and design concepts. For wide bandgap semiconductor devices, optimization of materials and fabrication processes is needed to

Nanocalorimetry for Semiconductors and Semiconductor Process Metrology

Ongoing
In September 2022, NIST published a report titled Strategic Opportunities for U.S. Semiconductor Manufacturing , which cited, among other challenges, the need to understand and improve heat dissipation and performance in advanced microelectronics. Specifically, there needs to be better measurements