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Advanced packaging involves increasingly challenging requirements for heterogeneous integration and chiplet packaging. Needs such as fine pitch interconnects (
The semiconductor industry continues to push for smaller features, more integration, and increased yield. New photoresist chemistries and advances in extreme
The semiconductor industry is in need of new, high throughput in-line dimensional metrology methods to characterize next generation 3D nanostructures. The
The state of the art for measurement and inspection of the smallest printed features on an integrated circuits (IC) chip is a combination of electron scanning
This project is focused on developing the measurement methods and polymer physics models needed to accelerate the innovation cycle for organic semiconductor
Our goal is to develop measurements that quantify the shape, size, orientation, and fidelity of nanoscale patterns as a platform to quantitatively evaluate
The manufacture of polymeric materials from their raw form into their final useful product occurs under highly non-equilibrium conditions where temperature and
The Polymer Analytics project was established with the goal of accelerating the discovery of new polymer physics through the development of datasets, methods