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Search Publications by: Dylan Williams (Fed)

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Displaying 551 - 575 of 583

Anomalies Observed in Wafer Level Microwave Testing

July 10, 1991
Author(s)
Dylan F. Williams, Roger Marks, T H. Miers, A Cangellaris
Two anomalies have been observed in the course of developing planar wafer level standards for the testing of GaAs monolithic microwave integrated circuits. The first involves a low-frequency characteristic impedance change of microstrip and coplanar

MMIC Package Characterization with Active Loads

November 1, 1990
Author(s)
K. R. Phillips, Dylan Williams
Abstract: A technique for characterizing microwave packages based on active PIN diode standards is discussed. The technique allows packages to be accurately characterized from external reflection coefficient measurements when a single bias-dependent active

Progress Toward MMIC On-Wafer Standards

November 1, 1990
Author(s)
Dylan F. Williams, Roger Marks, K. R. Phillips, T. Miers
A prototype standard set in coplanar waveguide suitable for the calibration of wafer probe stations has been developed through a cooperative effort between the National Institute of Standards and Technology and a MIMIC Phase 3 team. The coplanar standard

The Interpretation and Use of S-Parameters in Lossy Lines

November 1, 1990
Author(s)
Dylan F. Williams, Roger Marks
Although a fundamental parameter of transmission lines, the characteristic impedance is difficult to measure accurately. We suggest a method by which it may be easily determined from a measurement of the propagation constant. The method is based on a

Damping of the Resonant Modes of a Rectangular Metal Package

January 1, 1989
Author(s)
Dylan F. Williams
When an electrical circuit is enclosed in a metal package large enough to support resonant modes within the frequencies of operation of the enclosed circuit, coupling between the circuit and these resonant cavity modes may disturb circuit operation. These

De-embedding Coplanar Probes with Planar Distributed Standards

December 1, 1988
Author(s)
Dylan F. Williams, Tom H. Miers
Two methods are used to de-embed coplanar probes using offset coplanar waveguide shorts and transmission lines. The accuracy of the de-embedded measurements is verified. The S parameters of lumped standards provided by the manufacturer of the probes are

A Coplanar Probe to Microstrip Transition

July 1, 1988
Author(s)
Dylan F. Williams, Tom H. Miers
A transition between a coplanar probe and a microstrip transmission line is reported. The transition is significant in that it does not require substrate via holes. A set of microstrip impedance standards were developed for the purpose of de-embedding the

Adjustable tuning for planar millimeter-wave circuits

August 12, 1986
Author(s)
Dylan F. Williams, S E. Schwarz, J. A. Sedlacek, D J. Ehrlich
At millimeter wavelengths uncontrollable parasitics are of ten large enough to significantly degrade circuit performance when they are not compensated by adjustable elements. It is difficult to add adjustable elements to planar millimeter-wave circuits

A planar subharmonically-pumped 71 GHz receiver with integral feed antenna

November 12, 1985
Author(s)
Dylan F. Williams, S E. Schwarz
A planar, subharmonically-pumped, hybrid millimeter-wave receiver with integral antenna is described. Coplanar waveguide filters are used to isolate the ports and provide image enhancement. The integral planar antenna has 12 dB gain and is suited for use
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