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MMIC Package Characterization with Active Loads



K. R. Phillips, Dylan Williams


Abstract: A technique for characterizing microwave packages based on active PIN diode standards is discussed. The technique allows packages to be accurately characterized from external reflection coefficient measurements when a single bias-dependent active standard is embedded within it. The frequency characteristics, stability, and linearity of active PIN diode standards are investigated.
Proceedings Title
Tech Dig., Auto. RF Tech. Group Conf.
Conference Dates
November 29-30, 1990
Conference Location
Monterey, CA


Phillips, K. and Williams, D. (1990), MMIC Package Characterization with Active Loads, Tech Dig., Auto. RF Tech. Group Conf., Monterey, CA, [online],, (Accessed April 16, 2024)
Created October 31, 1990, Updated October 12, 2021