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Search Publications by: Daniel Josell (Fed)

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Displaying 126 - 142 of 142

Prediction of Lateral and Normal Force-Displacement Curves for Flipchip Solder Joints

September 1, 2001
Author(s)
Daniel Wheeler, Daniel Josell, James A. Warren, William E. Wallace
We present the results of experiments and modeling of flip-chip geometry solder joint shapes under shear loading. Modeling, using Surface Evolver, included development of techniques that use an applied vector force (normal and shear loading) as input to

Moving the Pulsed Heating Technique Beyond Monolithic Specimens: Experiments with Coated Wires

August 1, 2001
Author(s)
Daniel Josell, D Basak, J L. McClure, Ursula R. Kattner, Maureen E. Williams, William J. Boettinger, M Rappaz
Pulsed heating experiments based on pyrometric measurement of the temperature-time history of metal specimens rapidly heated by passage of electric current have a thirty year history at NIST. In recent years, efforts have been made to move beyond the

Superconformal Electrodeposition in Submicron Features

July 1, 2001
Author(s)
Daniel Josell, Daniel Wheeler, W H. Huber, Thomas P. Moffat
Superconformal electrodeposition is explained based on a local growth velocity that increases with coverage of a catalytic species adsorbed on the copper-electrolyte interface. For dilute concentration of the catalyst precursor in the electrolyte, local

Abstracts for the MSEL Assessment Panel, March 2001

January 26, 2001
Author(s)
Leslie E. Smith, Alamgir Karim, Leonid A. Bendersky, C Lu, J J. Scott, Ichiro Takeuchi, Kathleen M. Flynn, Vinod K. Tewary, Davor Balzar, G A. Alers, Stephen E. Russek, Charles C. Han, Haonan Wang, William E. Wallace, Daniel A. Fischer, K Efimenko, Wen-Li Wu, Jan Genzer, Joseph C. Woicik, Thomas H. Gnaeupel-Herold, Henry J. Prask, Charles F. Majkrzak, Norman F. Berk, John G. Barker, Charles J. Glinka, Eric K. Lin, Ward L. Johnson, Paul R. Heyliger, David T. Read, R R. Keller, J Blendell, Grady S. White, Lin-Sien H. Lum, Eric J. Cockayne, Igor Levin, C E. Johnson, Maureen E. Williams, Gery R. Stafford, William J. Boettinger, Kil-Won Moon, Daniel Josell, Daniel Wheeler, Thomas P. Moffat, W H. Huber, Lee J. Richter, Clayton S. Yang, Robert D. Shull, R A. Fry, Robert D. McMichael, William F. Egelhoff Jr., Ursula R. Kattner, James A. Warren, Jonathan E. Guyer, Steven P. Mates, Stephen D. Ridder, Frank S. Biancaniello, D Basak, Jon C. Geist, Kalman D. Migler
Abstracts relating to research and development in the NIST Materials Science and Engineering Laboratory (MSEL) are presented for a poster session to be presented to the 2001 MSEL Assessment Panel.

Cu Electrodeposition for On-Chip Interconnections

January 1, 2001
Author(s)
Gery R. Stafford, Thomas P. Moffat, V D. Jovic, David R. Kelley, John E. Bonevich, Daniel Josell, Mark D. Vaudin, N G. Armstrong, W H. Huber, A Stanishevsky
The electrochemical behavior of copper in copper sulfate - sulfuric acid, containing various combinations of NaCl, sodium 3 mercapto-1 propanesulfonate (MPSA), and polyethylene glycol (PEG) is examined. The i-E deposition characteristics of the

Superconformal Electrodeposition of Copper in 500-90 nm Features

December 1, 2000
Author(s)
Thomas P. Moffat, Daniel Wheeler, W H. Huber, Daniel Josell
Superconformal electrodeposition of copper in 500 nm deep trenches ranging from 500 to 90 nm in width has been demonstrated using an acid cupric sulfate electrolyte containing chloride (C1), polyethylene glycol (PEG), and 3-meracapto- 1propanesulfonate

Morphological Stability of Ni(Al)/Ni 3 Al Nanolaminate Composites

March 1, 2000
Author(s)
J P. Fain, R Banerjee, Daniel Josell, P M. Anderson, H Fraser, N Tymiak, W Gerberich
This manuscript discusses the morphological instability observed when multilayered samples with alternating layers of γ-Ni(Al)/γ 1-Ni 3Al are exposed to 800 degrees}C for approximately 100 h. Samples with 20 nm / 20 nm or 120nm/120nm layer thickness and ir

Application of Laser Polarimetry to the Measurement of Specific Heat Capacity and Enthalpy of the Alloy 53Nb-47Ti (mass%) in the Temperature Range 1600 K to 2000 K by a Millisecond-Resolution Pulse Heating Technique

November 1, 1999
Author(s)
D Basak, Ursula R. Kattner, J L. McClure, Daniel Josell, A Cezairliyan
The determination of the specific heat capacity, enthalpy and electrical resistivity of the alloy, 53Nb-47Ti (mass%), in the temperature range 1600 K to 2000 K is described. The method is based on rapid resistive self-heating of a solid cylindrical

Measuring the Interface Stress: Silver/Nickel Interfaces

November 1, 1999
Author(s)
Daniel Josell, John E. Bonevich, I Shao, R C. Cammarata
Interface stress is a surface thermodynamics quantity associated with the reversible work of elastically straining an internal solid interface. In a multilayered thin film, the combined effect of the interface stress of each interface results in an in

Rapid Melting of Nb - 47 Mass % Ti: Effect of Heating Rate and Grain Size

September 8, 1999
Author(s)
William J. Boettinger, Daniel Josell, Sam R. Coriell, D Basak
The effect of heating rate and grain size on the melting behavior of Nb - 47 mass % Ti is measured. The experimental method uses rapid resistive self-heating of wire specimens at rates between 10(2 superscript) and 104 superscript) K/s and simultaneous

Face-Centered Cubic Titanium: An Artifact in Titanium/Aluminum Multilayers

May 1, 1999
Author(s)
John E. Bonevich, D van Heerden, Daniel Josell
The present investigation is the first comprehensive comparative study of x-ray diffraction (XRD) and transmission electron microscopy (TEM) results to address the important issue of fcc Ti formation in nanoscale multilayers Ti/Al multilayers with 7.2 and

Tensile Testing Low Density Multilayers: Aluminum/Titanium

October 1, 1998
Author(s)
Daniel Josell, D van Heerden, D Shechtman, David T. Read
Yield stresses, ultimate tensile strengths, and specific strengths of aluminum/Titanium multilayer thin films are determined from the results of uniaxial tensile tests. The plasticity in the stress-strain curves. The nature of the fracture surfaces, and

Effect of Heating Rate and Grain Size on the Melting Behavior of the Alloy Nb-47 Mass% Ti in Pulse-Heating Experiments

September 1, 1998
Author(s)
D Basak, William J. Boettinger, Daniel Josell, Sam R. Coriell, J L. McClure, Sitaraman Krishnan, A Cezairliyan
The effect of heating rate and grain size on the melting behavior of Nb-47 mass % Ti is measured and modeled. The experimental method uses rapid resistive self-heating of wire specimens at rates between -10 2 and -10 4 K/s and simultaneous measurement of

Stability of Multilayer Structures: Capillary Effects

June 1, 1998
Author(s)
Daniel Josell, W Carter, John E. Bonevich
The long term stability of multilayer materials composed of nonreactive, immiscible materials is related to the equilibrium shapes of the individual grains within the layers. These shapes are determined by the free energies and locations of the interfaces
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