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Wafer Level Underfill: Experiments and Modeling.

Published

Author(s)

Daniel Josell, William E. Wallace, Daniel Wheeler
Citation
NIST Interagency/Internal Report (NISTIR) - 6731
Report Number
6731

Keywords

Electronic Materials, Flipchip, Microscopy, Simulations & Modeling, Solder, Surface Evolver, Underfill

Citation

Josell, D. , Wallace, W. and Wheeler, D. (2001), Wafer Level Underfill: Experiments and Modeling., NIST Interagency/Internal Report (NISTIR), National Institute of Standards and Technology, Gaithersburg, MD, [online], https://doi.org/10.6028/NIST.IR.6731, https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853766 (Accessed April 17, 2024)
Created December 31, 2000, Updated October 12, 2021