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Search Publications by: Theodore V. Vorburger (Assoc)

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Displaying 76 - 100 of 209

Internet-Based Surface Metrology Algorithm Testing System

December 1, 2004
Author(s)
Son H. Bui, Thomas B. Renegar, Theodore V. Vorburger, Jayaraman Raja, Mark C. Malburg
This paper presents the development of an Internet-based surface metrology algorithm testing system. The system includes peer-reviewed surface analysis tools and a surface texture specimen database for parameter evaluation and algorithm verification. The

Traceable Pico-Meter Level Step Height Metrology

December 1, 2004
Author(s)
Ndubuisi G. Orji, Ronald G. Dixson, Joseph Fu, Theodore V. Vorburger
The atomic force microscope (AFM) increasingly being used as a metrology tool in the semiconductor industry where the features measured are at the nanometer level and continue to decrease. Usually the height sensors of the AFM are calibrated using step

Virtual Surface Calibration and Computational Uncertainty

October 1, 2004
Author(s)
Son H. Bui, Theodore V. Vorburger, Thomas B. Renegar
This paper presents the development of a virtual surface calibration database for parameter evaluation and algorithm verification. The database runs from a web site at the National Institute of Standards and Technology (NIST), USA. Companies, universities

Determination of Optimal Parameters for CD-SEM Measurement of Line Edge Roughness

May 1, 2004
Author(s)
B Bunday, M R. Bishop, D Mccormack, John S. Villarrubia, Andras Vladar, Theodore V. Vorburger, Ndubuisi George Orji, J Allgair
The measurement of line-edge roughness (LER) has recently become a topic of concern in the litho-metrology community and the semiconductor industry as a whole. The Advanced Metrology Advisory Group (AMAG), a council composed of the chief metrologists from

Modeling, Simulation and Prediction of Rockwell Hardness Indentation

February 1, 2004
Author(s)
Li Ma, Samuel R. Low III, Richard J. Fields, Roland deWit, Jun-Feng Song, Theodore V. Vorburger, J Zhou
Rockwell hardness test, as a measure of the resistance of a material to localized plastic deformation, is a valuable and widely used mechanical test. However, the accuracy of Rockwell hardness measurement is still in question. The indenter, including both

Initial Measurement Results for 20 NIST RM 8240 Standard Bullets

January 1, 2004
Author(s)
Li Ma, Jun-Feng Song, Eric P. Whitenton, Theodore V. Vorburger, J Zhou, A Zheng
The SRM (Standard Reference Material) 2460 standard bullets are developed at the National Institute of Standards and Technology (NIST) to support the National Integrated Ballistics Information Network (NIBIN), recently established by the Bureau of Alcohol

Initial Measurement Results for 40 NIST RM 8240 Standard Bullets

January 1, 2004
Author(s)
Jun-Feng Song, Eric P. Whitenton, Li Ma, Theodore V. Vorburger, A Zheng
The RM (Reference Material) 8240 standard bullets are developed at the National Institute of Standards and Technology (NIST) to support the National Integrated Ballistics Information Network (NIBIN), recently established by the Bureau of Alcohol, Tobacco

Virtual Surface Calibration Database

January 1, 2004
Author(s)
Thomas B. Renegar, Theodore V. Vorburger, Son H. Bui
This paper presents the development of a virtual surface calibration database for parameter evaluation and algorithm verification. The database runs from a web site at the National Institute of Standards and Technology (NIST), USA. Companies, universities

Manufacturing and Quality Control of the NIST Reference Material 8240 Standard Bullet

October 26, 2003
Author(s)
Eric P. Whitenton, Clarence Johnson, David R. Kelley, Robert A. Clary, Brian S. Dutterer, Li Ma, Jun-Feng Song, Theodore V. Vorburger
The National Integrated Ballistics Information Network (NIBIN) is currently under development by the Bureau of Alcohol, Tobacco and Firearms (ATF) and the Federal Bureau of Investigation (FBI). In support of this effort, the National Institute of Standards

Space-Scale Analysis of Line Edge Roughness on 193 nm Lithography Test Structures

October 1, 2003
Author(s)
Ndubuisi G. Orji, Jayaraman Raja, Theodore V. Vorburger, Xiaohong Gu
Line edge roughness (LER) is a potential showstopper for the semiconductor industry. As the width of patterned line structures decreases, LER is becoming a non-negligible contributor to resist critical dimension (CD) variation. The International Technology

Influence of analysis Algorithms on the Value of Distorted Step Height Data

September 1, 2003
Author(s)
Ndubuisi G. Orji, Jayaraman Raja, Son H. Bui, Theodore V. Vorburger
One of the most important aspects of step height evaluation are the analysis algorithms used. There algorithms assume that the profiles and images being analyzed are ideal, but real step profiles are not ideal and the analysis algorithms can influence the

Toward Traceability for At-line AFM Dimensional Metrology

July 1, 2003
Author(s)
Marylyn H. Bennett, Angela Guerry, Ronald G. Dixson, Michael T. Postek, Theodore V. Vorburger
The in-line and at-line measurement tools for critical dimension (CD) metrology in semiconductor manufacturing are technologically advanced instruments that exhibit excellent measurement repeatability - below one nanometer in some cases. Accuracy, however

Sub-Nanometer Wavelength Metrology of Lithographically Prepared Structures: A Comparison of Neutron and X-Ray Scattering

June 1, 2003
Author(s)
Ronald L. Jones, T Hu, Eric K. Lin, Wen-Li Wu, D M. Casa, Ndubuisi George Orji, Theodore V. Vorburger, P J. Bolton, Z Barclay
The challenges facing current metrologies based on SEM, AFM, and light scatterometry for technology nodes of 157 nm imaging and beyond suggest that the development of new metrologies capable of routine measurement in this regime are required. We provide

Implementation of a Reference Measurement System Using CD-AFM

May 1, 2003
Author(s)
Ronald G. Dixson, Theodore V. Vorburger, Angela Guerry, Marylyn H. Bennett, B Bunday
International SEMATECH (ISMT) and the National Institute of Standards and Technology (NIST) are working together to improve the traceability of atomic force microscope (AFM) dimensional metrology in semiconductor manufacturing. The rapid pace of

A Model for Step Height, Edge Slope and Linewidth Measurements Using AFM

January 1, 2003
Author(s)
Xuezeng Zhao, Theodore V. Vorburger, Joseph Fu, Jun-Feng Song, C Nguyen
Nano-scale linewidth measurements are performed in semiconductor manufacturing and in the data storage industry and will become increasingly important in micro-mechanical engineering. With the development of manufacturing technology in recent years, the

Bullet Signature Measurements at NIST

January 1, 2003
Author(s)
Jun-Feng Song, Li Ma, Eric P. Whitenton, Theodore V. Vorburger
The RM (Reference Material) 8240 standard bullets are currently under development at the National Institute of Standards and Technology 9NIST) to support the coming National Integrated Ballistics Information Network (NIBIN). A bullet signature measurement

NIST Reference Material (RM) 8240/2350 Project-Standard Bullets and Casings

January 1, 2003
Author(s)
Jun-Feng Song, Theodore V. Vorburger, Robert A. Clary, Li Ma, M Ols, Eric P. Whitenton
Standard bullets and casings are currently under development to support the National Integrated Ballistics Information System (NIBIN) in the U.S. Based on a numerically controlled diamond turning technique, 20 RM 8240 standard bullets were fabricated in

Scale-Space Analysis of Line Edge Roughness on 193 nm Lithography Test Structures

January 1, 2003
Author(s)
Ndubuisi G. Orji, Theodore V. Vorburger, Xiaohong Gu, Jayaraman Raja
Line edge roughness (LER) is a potential showstopper for the semiconductor industry. As the width of patterned line structures decreases, LER is becoming a non-negligible contributor to resist critical dimension (CD) variation. The International Technology

Surface Finish and Sub-Surface Metrology

January 1, 2003
Author(s)
Theodore V. Vorburger, Ndubuisi George Orji, Li Piin Sung, T Rodriguez
Surface finsih affects the performance of a wide variety of manufactured products ranging from road surfaces and ships to mechanical parts, microelectronics, and optics. Accordingly roughness values can vary over many orders of magnitude. A variety of
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