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Displaying 55476 - 55500 of 74167

Calibration of Scanning Electron Microscope Magnification Standards SRM-484

May 1, 1996
Author(s)
Joseph Fu, Theodore V. Vorburger, D Ballard
Standard Reference Material (SRM) 484 is an artifact for calibrating the magnification scale of a scanning electron microscope. Since 1977 the National Institute of Standards and Technology (NIST) has produced seven issues of SRM484 amounting to

Controlling Activities in a Virtual Manufacturing Cell

May 1, 1996
Author(s)
Michael Iuliano, Albert W. Jones
Researchers at the National Institute of Standards and Technology are developing a virtual manufacturing cell. This cell will contain simulation models of a wide range of manufacturing equipment, processes, and systems. It will have commercial and

Electrical Test Structures Replicated in Silicon-On-Insulator Material

May 1, 1996
Author(s)
Michael W. Cresswell, J Sniegowski, Rathindra Ghoshtagore, Robert Allen, L Linholm, John S. Villarrubia
Measurements of the linewidths of submicrometer features made by different metrology techniques have frequently been characterized by differences of up to 90 nm. The purpose of the work reported here is to address the special difficulties that this

High Accuracy Overlay Measurements

May 1, 1996
Author(s)
Richard M. Silver, James E. Potzick, Fredric Scire, Robert D. Larrabee
The reduced critical dimensions of semiconductor devices place more stringent requirements on the precision and accuracy of overlay metrology tools used to monitor stepper feature placement. The use of mix and match stepper techniques and step and scan

High-Accuracy Critical-Dimension Metrology Using a Scanning Electron Microscope

May 1, 1996
Author(s)
J R. Lowney, Andras Vladar, Michael T. Postek
Two Monte Carlo computer codes have been written to simulate the transmitted-, backscattered-, and secondary-electron signals from targets in a scanning electron microscope. The first discussed, MONSEL-II, is applied to semi-infinite lines produced

Job Shop Scheduling

May 1, 1996
Author(s)
Albert T. Jones, Luis C. Rabelo, Yuehwern Yih
A large number of approaches to the modeling and solution of job shop scheduling problems have been reported in the OR literature, with varying degrees of success. These approaches revolve around a series of technological advances that have occurred over

Measurement of a CD and Sidewall Angle Artifact with Two Dimensional CD AFM Metrology

May 1, 1996
Author(s)
Ronald G. Dixson, N. Sullivan, J Schneir, T Mcwaid, V W. Tsai, J Prochazka, M. Young
Despite the widespread acceptance of SEM metrology in semiconductor manufacturing, there is no SEM CD standard currently available. Producing such a standard is challenging because SEM CD measurements are not only a function of the linewidth, but also

New Algorithm for the Measurement of Pitch in Metrology Instruments

May 1, 1996
Author(s)
Nien F. Zhang, Michael T. Postek, Robert D. Larrabee, L Carroll, William J. Keery
Traditionally, the measurement of pitch in metrology instruments is thought to be a benign self-compensating function. However, as the measurement uncertainty of metrology instruments is pushed to the nanometer level, evaluation of the performance of the

NIST Construction Automation Initiative

May 1, 1996
Author(s)
William C. Stone
Before we get started, let me introduce a few key people who have helped to organize this workshop. I would like to thank Ken Goodwin from the Manufacturing Engineering Laboratory (MEL), Kent Reed from the Building and Fire Research Laboratory (BFRL), and

Real-Time GPS and Non-Line-of-Sight Metrology

May 1, 1996
Author(s)
William C. Stone
I would like to pick up where Eric left off and describe the results of research which is currently underway at NIST in the field of construction metrology. Earlier I indicated that there were many technological steps along the way to implementing the real

SEM Performance Evaluation Using the Sharpness Criterion

May 1, 1996
Author(s)
Michael T. Postek, Andras Vladar
Fully automated or semi-automated scanning electron microscopes (SEM) are now commonly used in semiconductor production and other forms of manufacturing. The industry requires that an automated instrument must be routinely capable of 5 nm resolution (or
Displaying 55476 - 55500 of 74167
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