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Displaying 51601 - 51625 of 74186

A Phase Field Model of the Impingement of Solidifying Particles

December 1, 1998
Author(s)
James A. Warren, W Carter, R Kobayashi
We propose a model of the impingement of solidifying crystalline particles, the ensuing grain boundary formation, and grain coarsening. This model improves upon previous theoretical descriptions of this phenomenon, in that the model has the proper behavior

A Search for Possible 'Universal-Applications' Gas Mixtures

December 1, 1998
Author(s)
Loucas G. Christophorou, James K. Olthoff, David S. Green
In an effort to respond to the recent concerns over the possible impact of SF 6 on global warming, we have searched for an SF 6 substitute gas that could be used in high voltage equipment instead of pure SF 6, with minimal changes in practice, operation

Accuracy Differences Among Photomask Metrology Tools and Why They Matter

December 1, 1998
Author(s)
James E. Potzick
A variety of different kinds of photomask critical dimensions (CD) metrology tools are available today to help meet current and future metrology challenges. These tools are based on different operating principles, and have different cost, throughput

Characteristics of Partial Discharges on a Dielectric Surface in SF 6 -N 2 Mixtures

December 1, 1998
Author(s)
X. Han, Yicheng Wang, Loucas G. Christophorou, Richard J. Van Brunt
An important tool for improving the reliability of HV-insulation systems relies on partial discharge (PD) measurements. The assessment of the insulation failure of HV equipment using PD measurements requires an interpretation of the PD measurements

Characterization and Applications of On-Wafer Diode Noise Sources

December 1, 1998
Author(s)
Lawrence P. Dunleavy, James P. Randa, Dave K. Walker, Robert L. Billinger, John Rice
A set of wafer-probeable diode noise source transfer standards are characterized using on-wafer noise-temperature methods developed at the National Institute of Standards and Technology (NIST), Boulder, CO.
Displaying 51601 - 51625 of 74186
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