January 1, 2003
Author(s)
David T. Read, Yi-Wen Cheng, Joseph D. McColskey, R R. Keller
Here we report the results of tensile tests of thin films of Al-0.5 % Cu deposited on bare silicon. This material was on a wafer that was subjected to the complete CMOS fabrication process, tensile strength, and elongation were all lower than the