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Metrology

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Displaying 1151 - 1175 of 2718

The Effect of Turbulence on a Multi-Hole Pitot Calibration

June 10, 2013
Author(s)
Christopher J. Crowley, Iosif I. Shinder, Michael R. Moldover
Abstract- Accurate calibrations of multi-hole Pitot tubes require thousands of measurements spanning ranges of the fluid’s velocity, and the pitch and yaw angles. When calibrating a commercially-manufactured multi-hole Pitot tube in NIST’s low-turbulence

SHREC13 Track: Large Scale Sketch-Based 3D Shape Retrieval

June 6, 2013
Author(s)
Afzal A. Godil, Bo Li , Yijuan Lu, Tobias Schreck
Sketch-based 3D shape retrieval has become an important research topic in content-based 3D object retrieval. The aim of this track is to measure and compare the performance of sketch-based 3D shape retrieval methods based on a large scale hand-drawn sketch

A REFERENCE MEASUREMENT SYSTEM FOR ELECTROSHOCK WEAPONS

June 3, 2013
Author(s)
Nicholas G. Paulter Jr., Donald R. Larson
We have developed a measurement system to accurately measure the electrical current and high-voltage output of electroshock weapons (ESW) that are used to deliver an electrical stimulus to humans for the purpose of incapacitation. Since the output of

Effect of Organic SAMs on the Evolution of Strength of Silicon Nanostructures

June 3, 2013
Author(s)
Scott Grutzik, Brian G. Bush, Frank W. DelRio, Richard S. Gates, Melissa Hines, Alan Zehnder
The ability to accurately predict the strength of nanoscale, single crystal structures is critical in micro- and nano-electromechanical systems (MEMS and NEMS) design. Because of the small length scales involved failure does not always follow the same

Traceability for Aerosol Electrometer in the fA Range

June 1, 2013
Author(s)
Dean G. Jarrett, Miles Owen
Described here are the configurations and procedures used to provide traceability to electrical standards for an aerosol electrometer calibration in the range ± 20 fA to ± 40 fA. The technique used here simulated the condition of a current induced when

The Development and Implementation of Quality Assurance Programs to Support Nutritional Measurements

May 24, 2013
Author(s)
Lane C. Sander, Mary Bedner, David L. Duewer, Katrice A. Lippa, Melissa M. Phillips, Karen W. Phinney, Catherine A. Rimmer, Michele M. Schantz, Katherine E. Sharpless, Susan Tai, Jeanice M. Brown Thomas, Stephen A. Wise, Laura J. Wood, J. M. Betz, Paul M. Coates
The National Institute of Standards and Technology administers quality assurance programs devoted to improving measurements of nutrients and related metabolites in foods, dietary supplements, and serum and plasma samples. These programs have been developed

Writing Guidelines to Develop an Memorandum of Understanding for Interoperable Automated Fingerprint Identification Systems

May 14, 2013
Author(s)
Susan M. Ballou, Michael Garris, Anthony Clay, Joi Dickerson, Peter T. Higgins, Lisa Jackson, Joe Morrissey, Beth Owens, Joe Polski, Janet Hoin, Leo Norton, Melissa Taylor
This is one of a series of documents prepared by the Latent Print Automated Fingerprint Identification System (AFIS) Interoperability Working Group. The purpose of these documents is to provide guidance and a framework to those involved in the

High Accuracy Measurements Using a Scanning System with a Single Point Triangulation Sensor

May 13, 2013
Author(s)
Theodore D. Doiron, Wei Ren, Eric S. Stanfield, Balasubramanian Muralikrishnan, Christopher J. Blackburn
The capabilities of non-contact laser spot triangulation sensors for high accuracy measurements have slowly increased over the past decade, and now have usable resolution below 0.1 µm. The Dimensional Metrology Group has developed a simple scanning system

Metrology for Lab-on-a-Chip Final-Product Devices

May 12, 2013
Author(s)
Darwin R. Reyes-Hernandez, Michael W. Halter, Jeeseong Hwang
New metrology tools to measure the critical parameters of internal structures in lab on a chip devices are greatly needed in order to develop standard tests for this technology. Here we present a method that combines a custom made optical coherence

TSV Reveal height and bump dimension metrology by the TSOM method

April 30, 2013
Author(s)
Ravikiran Attota, Haesung Park, Victor H. Vartanian, Ndubuisi G. Orji, Richard A. Allen
Through-focus scanning optical microscopy (TSOM) transforms conventional optical microscopes into truly 3D metrology tools for nanoscale- to- microscale dimensional analysis with nanometer-scale sensitivity. Although not a resolution enhancement method

Use of TSOM for sub-11 nm node pattern defect detection and HAR features

April 30, 2013
Author(s)
Ravikiran Attota, Abraham Arceo, Bunday Benjamin
In-line metrologies currently used in the semiconductor industry are being challenged by the aggressive pace of device scaling and the adoption of novel device architectures. In defect inspection, conventional bright field techniques will not likely be

Frequency-agile, rapid scanning spectroscopy

April 28, 2013
Author(s)
Gar W. Truong, Kevin O. Douglass, Stephen E. Maxwell, Roger D. van Zee, David F. Plusquellic, Joseph T. Hodges, David A. Long
Challenging applications in trace gas analyses require high precision and acquisition rates.1-4 Many continuous-wave laser spectroscopy techniques exhibit significant sensitivity and potential;5 however, their scanning rates are slow because they rely upon
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