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Displaying 1351 - 1375 of 1580

MMIC Package Characterization with Active Loads

November 1, 1990
Author(s)
K. R. Phillips, Dylan Williams
Abstract: A technique for characterizing microwave packages based on active PIN diode standards is discussed. The technique allows packages to be accurately characterized from external reflection coefficient measurements when a single bias-dependent active

Progress Toward MMIC On-Wafer Standards

November 1, 1990
Author(s)
Dylan F. Williams, Roger Marks, K. R. Phillips, T. Miers
A prototype standard set in coplanar waveguide suitable for the calibration of wafer probe stations has been developed through a cooperative effort between the National Institute of Standards and Technology and a MIMIC Phase 3 team. The coplanar standard

The Interpretation and Use of S-Parameters in Lossy Lines

November 1, 1990
Author(s)
Dylan F. Williams, Roger Marks
Although a fundamental parameter of transmission lines, the characteristic impedance is difficult to measure accurately. We suggest a method by which it may be easily determined from a measurement of the propagation constant. The method is based on a

Scaling behavior of YBa 2 Cu 3 O 7 delta thin-film weak links

July 6, 1990
Author(s)
Stephen E. Russek, D. K. Lathrop, D. H. Shin, Brian H. Moeckly, R A. Buhrman, J. Silcox
The superconductive weak link properties of microbridges formed in c-axis normal YBa 2 Cu 3 O 7 δ polycrystalline thin films containing a variable amount of large angle tilt boundaries have been studied. In the low critical current density limit these weak
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