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Journals

Metal Complexes and Free Radical Toxicity Derived From Pfiesteria piscicida

Author(s)
Peter D. Moeller, Kevin Beauchesne, Kevin Huncik, William Davis, Steven J. Christopher, Andrew Gelasco, Pamela Riggs-Gelasco
Pfiesteria piscicida represents one of many dinoflagellate species inhabiting inter-coastal waterways and estuaries. This organism has been implicated in the

Solvation Structure of Ions in Water

Author(s)
Raymond D. Mountain
Molecular dynamics simulations of ions in water are reported for solutionsof varying solute concentration at ambient conditions for6 cations and 4 anions in 10

Low-Noise PPLN-based Single-Photon Detector

Author(s)
Hai Xu, Lijun Ma, Oliver T. Slattery, Xiao Tang
This paper describes the detection of single photons, which have been transmitted through standard fiber at the telecom wavelength of 1310 nm. Following

120Hz Pulse Tube Cryocooler for Fast Cooldown to 50K

Author(s)
Srinivas Vanapalli, Michael A. Lewis, Zhihua Gan, Ray Radebaugh
A pulse tube cryocooler operating at 120 Hz with 3.5 MPa average pressure achieved a no-load temperature of about 49.9 K and a cooldown time to 80 K of 5.5

Trilateral optical powermeter comparison between NIST, NMIJ/AIST, and METAS

Author(s)
Igor Vayshenker, John H. Lehman, David J. Livigni, Xiaoyu X. Li, Kuniaki Amemiya, Daiji Fukuda, Seiji Mukai, Shinji Kimura, Michiyuki Endo, Jacques Morel, Armin Gambon
We describe the results of a comparison of reference standards between three National Metrology Institutes: the National Institute of Standards and Technology

Mechanically Robust Spin-On Organosilicates Glasses for Nanoporous Applications

Author(s)
Hyun Wook Ro, K Char, Eun-Chae Jeon, H C. Kim, Dongil Kwon, Hae-Jeong Lee, J. H. Lee, Hee-Woo Rhee, Christopher L. Soles, Do Y. Yoon
An increasing number of technologies demand nanoporous materials with vastly improved physical, mechanical and thermal properties. This manuscript develops the

Superfilling When Adsorbed Accelerators Are Mobile

Author(s)
Daniel Josell, Thomas P. Moffat, Daniel Wheeler
Bottom-up superfill during electrodeposition that is used for industrial processing of damascene copper interconnects has also been demonstrated during