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Journals

Collector Series-Resistor to Stabilize a Broadband 400 GHz Common-Base Amplifier

Author(s)
Jerome Cheron, Dylan Williams, Richard Chamberlin, Miguel Urteaga, Kassi Smith, Nick Jungwirth, Bryan Bosworth, Chris Long, Nate Orloff, Ari Feldman
The indium phosphide (InP) 130 nm double-heterojunction bipolar transistor (DHBT) offers milliwatts of output power and high signal amplification in the lower...

Magnetic depth profiling Co/Cu multilayers to investigate magnetoresistance

Author(s)
John Unguris, D. Tulchinsky, Michael H. Kelley, Julie Borchers, Joseph Dura, Charles Majkrzak, S. Y. Hsu, R. Loloee, W. P. Pratt, J. Bass
The magnetic microstructure responsible for the metastable high resistance state of weakly coupled, as-prepared [Co(6nm)/Cu(6nm)] 20 multilayers was analyzed...

Anomalous Asymmetric Intermixing in Pt/Ti

Author(s)
P Sule, M. Menyhard, L Kotis, J Labar, William F. Egelhoff Jr.
The ion-sputtering induced intermixing is studied by Monte-Carlo TRIM, molecular dynamics (MD) simulations, and Auger electron spectroscopy depth pro_ling (AES...

NEMI Tin Whisker Test Method Standards

Author(s)
I Boguslavsky, P Bush, E Kam-Lum, M Kwoka, J McCullen, K Spalding, K Vo, Maureen E. Williams
The need to better understand whisker growth has dramatically increased as component suppliers convert from tin-lead (SnPb) finishes to Pb-free finishes of Sn...

Environmentally Enhanced Crack Growth in AlN

Author(s)
Roy W. Rice, C C. Wu, K R. McKinney, Stephen W. Freiman, L E. Dolhert, J H. Enloe
Three tests: (1) dynamic fatigue; (2) flexure strength, and (3) direct, double-cantilever beam stress intensity-crack velocity measurements carried out in air...

Tin Whisker Test Method Development

Author(s)
Valeska Schroeder, P Bush, Nick Vo, Maureen E. Williams
In response to legislation banning Pb from electronics, any component suppliers plan to implement tin-based lead-free surfaces finishes to replace current Sn-Pb...
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