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Conferences

Temperature Determination Methods on Copper Material for Highly Accelerated Electromigration Tests (e.g., SWEAT)

February 1, 2003

Author(s)

Jochen von Hagen, Harry A. Schafft

Highly accelerated electromigration tests conducted at wafer level require meaningful measurements of the stress temperature of the test line. Estimates of the

Electromigration Discussion Group Summary

February 1, 2003

Author(s)

Harry A. Schafft, James R. Lloyd

Measuring Resin Temperature During Extrusion Using a Fluorescence Technique

January 30, 2003

Author(s)

Anthony J. Bur, S C. Roth, D W. Baugh, K A. Koppi, M A. Spalding, J Gunderson, W C. Buzanowski

We have used a temperature sensitive fluorescent dye, doped into polycarbonate, to monitor the true resin temperature during extrusion processing. The

Computer Tools to Determine Material Properties for Fire Growth Modeling From Cone Calorimeter Data.

January 27, 2003

Author(s)

Daniel Murphy, M L. Janssens, J Kimble

A set of computer tools was developed to assist fire protection engineers with the analysis of Cone calorimeter data for modeling. The tools consist of various

NIST CFIT: Testing Disk Imaging Tools

January 27, 2003

Author(s)

James R. Lyle

There is a critical need in the law enforcement community to ensure the reliability of computer forensic tools. A capability is required to ensure that forensic

Studying the Response of Building Systems to Fire Using a Virtual Cybernetic Building Test-Bed

January 24, 2003

Author(s)

William D. Davis

As the ability to predict fire conditions in buildings using sensor signals improves, these predictions can be used to inform first responders about the

SCUBA-2: a large format submillimeter camera on the James Clerk Maxwell Telescope

January 20, 2003

Author(s)

Wayne Holland, William Duncan, Kent D. Irwin, Anthony Walton, Peter Ade, Ian Robson

SCUBA-2 is a second generation, wide-field submillimeter camera under development for the James Clerk Maxwell Telescope. With over 12,000 pixels, in two arrays

Time-Division SQUID Multiplexers for Transition-Edge Sensors

January 14, 2003

Author(s)

Kent D. Irwin, James A. Beall, Joern Beyer, Steven Deiker, W.Bertrand (Randy) Doriese, S. L. Ferreira, Gene C. Hilton, Sae Woo Nam, Carl D. Reintsema, Joel Ullom, Leila R. Vale

Microcalorimeters and bolometers based on superconducting transition-edge sensors (TES) are important tools for the detection of photons from millimeter waves

Electron Energy Loss Spectroscopy of CeO₂-x Nanoparticles

January 7, 2003

Author(s)

W Lijun, H J. Wiesmann, A R. Moodenbaugh, Daniel A. Fischer, Y Zhu, M Suenaga

ria has been widely studied due to its applications, such as a catalyst in vehicle emissions system and an electrolyte material in solid oxide fuel cells

Numerical Experiments in Scattering by a Dielectric Wedge

January 1, 2003

Author(s)

Egon Marx

A general discussion of the scattering of plane monochromatic waves by dielectric wedges precedes this paper. Numerical solutions of the problem of scattering

NIST Accelerator Facilities and Programs in Support of Industrial Radiation Research, ed. by J.L. Duggan and I.L. Morgan

January 1, 2003

Author(s)

Fred B. Bateman, Marc F. Desrosiers, Lawrence T. Hudson, Bert M. Coursey, F. P. Bergstrom, Stephen M. Seltzer

Optical Clocks with Cold Atoms and Stable Lasers

January 1, 2003

Author(s)

Leo W. Hollberg, Christopher W. Oates, G Wilpers, E A. Curtis, C Hoyt, Scott A. Diddams, A Bartels, T M. Ramond

Evaluation of Performance of Integrating Spheres For Indirect Emittance Measurement, ed. by B. Fellmuth, J. Seidel, and G. Scholz

January 1, 2003

Author(s)

Leonard M. Hanssen, Sergey Mekhontsev, Alexander Prokhorov

Machining Damage Cracks: How to Find and Characterize Them by Fractography

January 1, 2003

Author(s)

George D. Quinn, L K. Ives, S Jahanmir

Subsurface machining cracks may control strength and performance of finished ceramics. Previously, machining cracks had been though to be difficult or

Computed Images of Dielectric Strips on a Substrate

January 1, 2003

Author(s)

Egon Marx

Accurate computed optical images of lines and trenches placed on semiconductors are of great interest to the manufacturers of computer components, especially in

Precise phase control of short pulses

January 1, 2003

Author(s)

Jun Ye, D J. Jones, R J. Jones, K W. Holman, S Foreman

Noise Figure vs. PM Noise Measurements: A Study at Microwave Frequencies,

January 1, 2003

Author(s)

Archita Hati, David A. Howe, F L. Walls, D. Walker

This paper addresses two issues: (i) it compares the usefulness of phase-modulation (PM) noise measurements vs. noise figure (NF) measurements in characterizing

Low Scatter Optical System For Emittance and Temperature Measurements

January 1, 2003

Author(s)

Leonard M. Hanssen, Sergey Mekhontsev

Mechanical Behavior of Contact Aluminum Alloy

January 1, 2003

Author(s)

David T. Read, Yi-Wen Cheng, Joseph D. McColskey, R R. Keller

Here we report the results of tensile tests of thin films of Al-0.5 % Cu deposited on bare silicon. This material was on a wafer that was subjected to the

Dynamic Material Properties for Machining Simulation Using the NIST Pulse-Heated Kolsky Bar

January 1, 2003

Author(s)

Richard L. Rhorer

The modeling or simulation of machining processes is important for economically implementing new manufacturing processes such as high-speed milling or

Instrumentation for old gravity, ed. by O. Francis and T. van Dam

January 1, 2003

Author(s)

J E. Faller

New Frequency Comparisons Using GPS Carier-Phase Time Transfer

January 1, 2003

Author(s)

C Hackman, Judah Levine

Reciprocity Principle and the Choice of Reflectance Model for Physically Correct Modeling of Effective Emissivity

January 1, 2003

Author(s)

Leonard M. Hanssen, Sergey Mekhontsev, Alexander Prokhorov

Recent Developments in the Characterization of Anisotropic Void Populations in Thermal Barrier Coatings Using Ultra-Small Angle X-ray Scattering

January 1, 2003

Author(s)

Gabrielle G. Long, T A. Dobbins, Andrew J. Allen, J Ilavsky, P Jemain, A Kulkarni, H Herman

Thermal barrier coatings (TBC) have complex void microstructures which control their in service properties. In the research reported here, ultra-small-angle X

A Model for Step Height, Edge Slope and Linewidth Measurements Using AFM

January 1, 2003

Author(s)

Xuezeng Zhao, Theodore V. Vorburger, Joseph Fu, Jun-Feng Song, C Nguyen

Nano-scale linewidth measurements are performed in semiconductor manufacturing and in the data storage industry and will become increasingly important in micro

Phase stabilization of modelocked lasers

January 1, 2003

Author(s)

Steven T. Cundiff, T M. Fortier, D J. Jones, Jun Ye

Timekeeping and time dissemination in a distributed space-based clock ensemble

January 1, 2003

Author(s)

S Francis, B J. Ramsey, S R. Stein, J Leitner, M Moreau, R Burns, R A. Nelson, T R. Bartholomew, A Gifford

Highly Charged Ion Bombardment of Silicon Surfaces Applications of Accelerators in Research and Industry, ed. by J.L. Duggan

January 1, 2003

Author(s)

Lori S. Goldner

Numerical Analysis of a Coaxial Line Terminated with a Complex Gap Capacitance

January 1, 2003

Author(s)

Jan Obrzut, A Anopchenko

Scale-Space Analysis of Line Edge Roughness on 193 nm Lithography Test Structures

January 1, 2003

Author(s)

Ndubuisi G. Orji, Theodore V. Vorburger, Xiaohong Gu, Jayaraman Raja

Line edge roughness (LER) is a potential showstopper for the semiconductor industry. As the width of patterned line structures decreases, LER is becoming a non

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