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The Unaxis 790 reactive ion etcher (RIE) is a general purpose parallel plate plasma etching system which uses ionized fluorocarbon gases and oxygen to etch
The Unaxis 790 reactive ion etcher (RIE) is a general purpose parallel plate plasma etching system which uses ionized fluorocarbon gases and oxygen to etch
The 4Wave IBE-20B ion milling system uses a broad argon ion beam to controllably and uniformly remove material from a user's substrate. A secondary ion mass
The Tousimis Supercritical Autosamdri-815 Series B critical point dryer utilizes liquid carbon dioxide (LCO 2) to dry substrates in a controlled manner in order
The Semitool PSC-101 spin rinse dryer uses deionized water to rinse and heated nitrogen to dry whole wafer substrates automatically after wet chemical processes
The Reynolds RCA wet bench is used to remove organic and metal contamination from the surfaces of substrates prior to processing in high temperature furnaces
The Reynolds Tech silicon nitride etch wet bench uses dilute phosphoric acid to preferentially etch silicon nitride on silicon. The process is used to define
The Reynolds Tech silicon etch wet bench uses dilute potassium hydroxide (KOH) to preferentially etch silicon along the material's crystal planes. The process
The Tousimis Supercritical Automegasamdri-916B Series C critical point dryer uses liquid carbon dioxide (LCO 2) to dry substrates in a controlled manner in
The Reynolds RCA wet bench is used to remove organic and metal contamination from the surfaces of substrates prior to high temperature furnace processing. The
The Kulicke and Soffa Model 4526 wedge wire bonder provides electrical interconnects between a device chip and package using thin aluminum or gold wires. The
The ADT 7132 dicing saw is used to cut multi-device substrates into individual chips. The system can accommodate substrates up to 1 mm thick and supports sizes
The Allied High Tech Dual Prep PH-3 grinding and polishing system is used to mechanically thin samples and polish cleaved facets in preparation for high
The Lattice Gear LatticeAx cleaving tool is used for highly accurate, manual cleaving of substrates. The system is an indenting and cleaving tool that produces
The Fischione Model 1040 NanoMill is a low-energy, low-angle argon ion milling instrument used for preparing ultra-thin, high-quality transmission electron
White House Office of Science and Technology Policy Blog Post by Colleen V. Chien, senior advisor to the Chief Technology Officer, Intellectual Property and...
Secretary of Commerce Penny Pritzker recently reappointed Rulon Stacey as chair of the Baldrige Program's Board of Overseers. She also appointed three new...
While national security efforts seek to prevent terrorist attacks, the United States and partner countries should also prepare to work together to mitigate the...
Officials at the National Institute of Standards and Technology (NIST) have announced plans to establish two new research Centers of Excellence to work with...
Materials Resource Registry allows for the registration of materials resources, bridging the gap between existing resources, software and repositories and end
Blog by Chris Greer, Senior Executive for Cyber-Physical Systems at the National Institute of Standards and Technology In the early 1990s, a Web page consisted...
Particles of soot floating through the air and comets hurtling through space have at least one thing in common: 0.36. That, reports a research group at the...
Two researchers at the National Institute of Standards and Technology (NIST) are among 12 federal employees being honored today* as recipients of the 2013...
The Specialty Coating Systems PDS 2010 parylene deposition system provides users with reliable and repeatable conformal parylene coatings ranging from 75
The Metal Additive Manufacturing (AM) Research Facility is now called the Additive Manufacturing Research Center (AMRC). Additive manufacturing gives U.S
In the late 1970s and early 1980s the fire community was pushing for reliable bench-scale tools to measure material flammability based on heat release rate. A
The Plasma-Therm Versaline high density plasma enhanced chemical vapor deposition (HD-PECVD) system uses an inductively coupled plasma to remotely ionize