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Search Publications by: Sushil K Satija (Fed)

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Displaying 26 - 50 of 85

Characterization of the non-uniform reaction in chemically-amplified calix[4]resorcinarene molecular resist thin films

July 19, 2011
Author(s)
Vivek M. Prabhu, Shuhui Kang, Regis J. Kline, Dean M. DeLongchamp, Daniel A. Fischer, Wen-Li Wu, Sushil K. Satija, Jing Sha, Christopher K. Ober, Peter V. Bonnesen
The ccc stereoisomer-purified tert-butoxycarbonyloxy (t-Boc) protected calix[4]resorcinarene molecular resists blended with photoacid generator exhibit a non-uniform photoacid catalyzed reaction in thin films. The surface displays a reduced reaction extent

Lateral Uniformity in Chemical Composition along a Buried Reaction Front in Polymers

November 15, 2010
Author(s)
Kristopher Lavery, Vivek Prabhu, Sushil K. Satija, Wen-Li Wu
Off-specular neutron reflectometry was applied to characterize the form and amplitude of lateral compositional variations at a buried reaction-diffusion front. In this work, off-specular neutron measurements were first calibrated using off-specular X-ray

Little Things Mean a Lot: Water and the Adhesive Bond

February 21, 2010
Author(s)
Donald L. Hunston, Kar T. Tan, Bryan D. Vogt, Sushil K. Satija, Cyril Clerici, David E. White
The ability of water to dramatically weaken many types of adhesive bonds has been widely studied. One surprising result is the existence of a critical moisture level in the bond. Above this level the strength drops to very low values. Numerous studies have

Solvent Retention In Thin Spin-Coated Polystyrene And Poly(Methyl Methacrylate) Homopolymer Films Studied By Neutron Reflectometry

January 19, 2010
Author(s)
Xiaohua Zhang, Kevin G. Yager, Shuhui Kang, Nathaniel J. Fredin, Bulent Akgun, Sushil K. Satija, Jack F. Douglas, Alamgir Karim, Ronald L. Jones
We utilize neutron reflectometry (NR) to probe the amount of residual solvent inside thin polystyrene (PS) and poly(methyl methacrylate) (PMMA) films spin-coated from deuterated toluene polymer solutions onto silicon substrates . The effect of thermal

Application of Thermal Gradients to Achieve Orientational Order in Block Copolymer Thin Films

August 18, 2009
Author(s)
Nathaniel J. Fredin, Brian Berry, Kevin G. Yager, Alamgir Karim, Sushil K. Satija, Deanna Pickel, Ronald L. Jones
The development of methods that permit control over the long-range order and orientation of microdomains in block copolymer (BCP) thin films for bottom-up approaches to nanoscale surface patterning is of great interest for many applications, including

Moisture Attack on Adhesive Joints: Roles of Adhesive and Interface Properties

July 22, 2009
Author(s)
Donald L. Hunston, Kar T. Tan, Sushil K. Satija, Christopher C. White, Bryan D. Vogt, Cyril Clerici
It is well-known that moisture will attack many adhesive joints. A particularly interesting feature is the observation that when the moisture level in certain systems exceeds a critical concentration, the bonded joint shows a dramatic loss of strength. A

Impact of polymer modulus on water accumulation at polymer / metal oxide interfaces

April 1, 2009
Author(s)
Alper Karul, Kar T. Tan, Christopher C. White, Donald L. Hunston, Steve marshall, Bulent Akgun, Sushil K. Satija, Christopher Soles, Bryan D. Vogt
Ambient moisture is known to accumulate at the interface between polymers and metal oxides, leading to detrimental consequences on physical properties such as modulus and adhesion. Direct measurement of the interfacial profile has utilized neutron

Impact of Polymer Chemistry on the Durability of Model Adhesives Supported on SiOx Substrates in Humid Environments Using Homologous Series of Poly(n-alkyl methacrylate)s

January 7, 2009
Author(s)
Kar T. Tan, Bryan D. Vogt, Christopher C. White, Kristen Hamilton, Nicholas Wagman, Joshua E. Goldman, Jessica M. Torres, Kristen L. Steffens, Cyril Clerici, Sushil K. Satija, Donald L. Hunston
There are many advantages that structural adhesives can offer compared to the more traditional joining methods, such as welding, bolting, mechanical fastening, etc. However, there are some issues that currently limit the wider application of adhesives. One

Impact of Adhesive Modulus on Humidity Induced Failure

December 17, 2008
Author(s)
Kar T. Tan, Christopher C. White, Kristen Hamilton, Nicholas Wagman, Joshua E. Goldman, Alper Karul, Jessica M. Torres, Sushil K. Satija, Cyril Clerici, Donald L. Hunston, Bryan D. Vogt

Neutron Reflectivity for Interfacial Materials Characterization

October 16, 2008
Author(s)
Eric K. Lin, D J. Pochan, R Kolb, Wen-Li Wu, Sushil K. Satija
Measurements of the physical properties of materials, such as the coefficient of thermal expansion (CTE), in thin films and at interfaces are very important in microelectronics packaging and interconnection, especially as electronic devices decrease in

Swelling of Grafted Polymer Brushes

October 16, 2008
Author(s)
Jack Douglas, M S. Kent, Sushil K. Satija, Alamgir Karim
The end-grafting of polymer chains to surfaces provides a robust method for modifying surface properties. Such layers are increasingly being employed in applications-modifying the biocompatibility of implants, the wetting, adhesive and frictional

Mechanisms of Moisture Attack in Adhesive bonds Exposed to High Humidity

July 23, 2008
Author(s)
Kar T. Tan, Christopher C. White, Cyril Clerici, Donald L. Hunston, Bryan D. Vogt, Sushil K. Satija, Joshua E. Goldman, Kristen L. Steffens
Studies have show that certain adhesive joints exhibit a dramatic loss of strength when exposed to humidities above a certain critical value. Although much is know about this effect, questions still exist. This study combines neutron reflectivity

Fundamentals of the Reaction-Diffusion Process in Model EUV Photoresists

March 1, 2006
Author(s)
Kristopher Lavery, George Thompson, Hai Deng, D S. Fryer, Kwang-Woo Choi, B D. Vogt, Vivek Prabhu, Eric K. Lin, Wen-Li Wu, Sushil K. Satija, Michael Leeson, Heidi B. Cao
More demanding requirements are being made of photoresist materials for fabrication of nanostructures as the feature critical dimensions (CD) decrease. For EUV resists, control of line width roughness (LWR) and high resist sensitivity are key requirements