U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

Search Publications by:

Search Title, Abstract, Conference, Citation, Keyword or Author
Displaying 51 - 75 of 80

Database for Computational Thermodynamics and Diffusion Modeling Workshop Report

November 1, 2002
Author(s)
Ursula R. Kattner, William J. Boettinger, J E. Morral
Databases for computational thermodynamics and diffusion modeling can be applied to predict phase diagrams for alloy design and alloy behavior during processing and service. Databases that are currently available to scientists, engineers and students need

On Differential Thermal Analyzer Curves for the Melting and Freezing of Alloys

June 1, 2002
Author(s)
William J. Boettinger, Ursula R. Kattner
A model for the response of differential thermal analysis measurement techniques to melting and freezing is explored. The model, which uses a system of ordinary differential equations, predicts sample, sample cup and thermocouple temperature histories

Whisker Formation on Electroplated Sn-Cu

June 1, 2002
Author(s)
Maureen E. Williams, C E. Johnson, Kil-Won Moon, Gery R. Stafford, C A. Handwerker, William J. Boettinger
The probability of whisker growth on as-deposited tin (Sn) electrodeposits has been measured as a function of copper (Cu superscript2+) addition to a commercial bright methanesulfonate electrolyte. Two substrate materials were used: free standing 250 um

Mechanism of Fillet Lifting in Sn-Bi Alloys

May 1, 2002
Author(s)
William J. Boettinger, C A. Handwerker, B Newbury, TG Y. Pan, J M. Nicholson
The probability of fillet lifting in through-hole solder joints was determined for a series of seven binary Sn-Bi solders with compositions between 2.6 and 65 mass percent Bi. A 20 pin ceramic dual inline package was soldered to printed wiring boards with

Phase Field Modeling Applied to the Double Layer

May 1, 2002
Author(s)
Jonathan E. Guyer, William J. Boettinger, James A. Warren, Geoffrey B. McFadden
We present the first application of phase field modeling to electrochemistry. A free energy functional that includes the electrostatic effect of charged particles leads to rich interactions between concentration, electrostatic potential, and phase

Model of Electrochemical Double Layer" Using the Phase Field Method

March 20, 2002
Author(s)
William J. Boettinger, Geoffrey B. McFadden, James A. Warren, Jonathan E. Guyer
We present the first application of phase field modeling to electrochemistry. A free energy functional that includes the electrostatic effect of charged particles leads to rich interactions between concentration, electrostatic potential, and phase

Development of a Diffusion Mobility Database for Ni-Base Superalloys

February 1, 2002
Author(s)
Carelyn E. Campbell, William J. Boettinger, Ursula R. Kattner
For a wide variety of Ni-base superalloy applications, including solidification, homogenization, y precipitation, bonding and repairing processes, and protective bond coats, multicomponent diffusion data are needed. Thus, in the Ni-Al-Co-Cr-Hf-Mo-Re-Ta-Ti

The Formation of Whiskers on Electroplated Tin

December 1, 2001
Author(s)
Kil-Won Moon, Maureen E. Williams, C E. Johnson, Gery R. Stafford, C A. Handwerker, William J. Boettinger
ta is presented on the probability of whisker growth on as-grown tin (Sn) electrodeposits as a function of Cu concentration in the electrolye. A commercial bright methanesulfonate electrolyte was employed at 25 degreesC with copper (Cu) concentrations from

Thermodynamic Assessment of the Gallium - Nitrogen System

November 1, 2001
Author(s)
Albert Davydov, William J. Boettinger, Ursula R. Kattner, T J. Anderson
Thermochemical and phase diagram data for the Ga-N system were assessed by employing the CALPHAD method. A consistent model representation of available thermodynamic properties agrees well with the critically evaluated experimental data. Thermodynamic

Moving the Pulsed Heating Technique Beyond Monolithic Specimens: Experiments with Coated Wires

August 1, 2001
Author(s)
Daniel Josell, D Basak, J L. McClure, Ursula R. Kattner, Maureen E. Williams, William J. Boettinger, M Rappaz
Pulsed heating experiments based on pyrometric measurement of the temperature-time history of metal specimens rapidly heated by passage of electric current have a thirty year history at NIST. In recent years, efforts have been made to move beyond the

An Introduction to the Phase-Field Method: Simulation of Alloy Solidification

July 1, 2001
Author(s)
William J. Boettinger, James A. Warren, C Beckermann, A N. Karma
An overview of the phase-field method for modeling alloy solidification is presented together with several example results. Using a phase-field variable and a corresponding governing equation to describe the state (solid or liquid) in a material as a

Abstracts for the MSEL Assessment Panel, March 2001

January 26, 2001
Author(s)
Leslie E. Smith, Alamgir Karim, Leonid A. Bendersky, C Lu, J J. Scott, Ichiro Takeuchi, Kathleen M. Flynn, Vinod K. Tewary, Davor Balzar, G A. Alers, Stephen E. Russek, Charles C. Han, Haonan Wang, William E. Wallace, Daniel A. Fischer, K Efimenko, Wen-Li Wu, Jan Genzer, Joseph C. Woicik, Thomas H. Gnaeupel-Herold, Henry J. Prask, Charles F. Majkrzak, Norman F. Berk, John G. Barker, Charles J. Glinka, Eric K. Lin, Ward L. Johnson, Paul R. Heyliger, David T. Read, R R. Keller, J Blendell, Grady S. White, Lin-Sien H. Lum, Eric J. Cockayne, Igor Levin, C E. Johnson, Maureen E. Williams, Gery R. Stafford, William J. Boettinger, Kil-Won Moon, Daniel Josell, Daniel Wheeler, Thomas P. Moffat, W H. Huber, Lee J. Richter, Clayton S. Yang, Robert D. Shull, R A. Fry, Robert D. McMichael, William F. Egelhoff Jr., Ursula R. Kattner, James A. Warren, Jonathan E. Guyer, Steven P. Mates, Stephen D. Ridder, Frank S. Biancaniello, D Basak, Jon C. Geist, Kalman D. Migler
Abstracts relating to research and development in the NIST Materials Science and Engineering Laboratory (MSEL) are presented for a poster session to be presented to the 2001 MSEL Assessment Panel.

The Effect of Pb Contamination on the Solidification Behavior of Sn-Bi Solders

January 1, 2001
Author(s)
Kil-Won Moon, William J. Boettinger, Ursula R. Kattner, C A. Handwerker, D J. Lee
This paper presents experimental results and theoretical calculations to evaluate the effects of Pb contamination on the solidification behavior of Sn-x mass Bi alloys (x = 5, 10, and 58 mass %). The pasty (mushy) range, the type of solidification path

Alpha Case Thickness Modeling in Investment Castings

December 1, 2000
Author(s)
William J. Boettinger, Maureen E. Williams, Sam R. Coriell, Ursula R. Kattner, B A. Mueller
The alpha case thickness at the surface of a Ti-6Al-4V step wedge investment casting has been measured and successfully predicted. The prediction uses temperature-time results obtained from a heat flow simulation of the casting that was performed with a

Transient Liquid-Phase Bonding in the Ni-Al-B System

November 1, 2000
Author(s)
Carelyn E. Campbell, William J. Boettinger
Transient liquid phase (TLP) bonding experiments were performed using a Ni-10.3 at. % Al alloy and a Ni-10 at. %B filler material and the results were compared to simulations performed using the finite-difference diffusion code, DICTRA. For the simulations

Experimental and Thermodynamic Assessment of Sn-Ag-Cu Solder Alloys

October 1, 2000
Author(s)
Kil-Won Moon, William J. Boettinger, Ursula R. Kattner, Frank S. Biancaniello, C A. Handwerker
Sn-rich alloys in the Sn-Ag-Cu system are being studied for their potential as Pb-free solders. Thus, the location of the ternary eutectic involving L, (Sn), Ag 3)Sn and Cu( 6)Sn( 5) phases is of critical interest. Phase diagram data in the Sn-rich corner

The Ternary Eutectic of Sn-Ag-Cu Solder Alloys

September 1, 2000
Author(s)
Kil-Won Moon, William J. Boettinger, Ursula R. Kattner, Frank S. Biancaniello, C A. Handwerker
New measurements using precision thermal analysis and existing experimental data for the Sn-Ag-Cu system are summarized. For Sn-Ag-Cu alloys, the location of the ternary eutectic involving L, Sn, Ag3Sn, and Cu6Sn5 phases in the Sn-rich corner is of

On the Properties of Alpha/Alpha + Beta Diffusion Couples

January 1, 2000
Author(s)
William J. Boettinger, Sam R. Coriell, Carelyn E. Campbell, Geoffrey B. McFadden
The properties of diffusion couples in a ternary system are examined theoretically when one end member is composed of single-phase material (alpha) and the other end member is composed of two-phase material (α + Β). Using the model of Morral and co-workers

Solidification Microstructures: Recent Developments, Future Directions

January 1, 2000
Author(s)
William J. Boettinger, Sam R. Coriell, A L. Greer, A N. Karma, W Kurz, M Rappaz, R Trivedi
This review is intended to critically evaluate the latest status of solidification science and to discuss and propose future directions of research in this technologically important area. It is an updated version of the outcome of the 1998 Zermatt Workshop

Modeling the Fillet Lifting Defect

September 11, 1999
Author(s)
Clare Bailey, William J. Boettinger
A multi-physics simulation tool is described which has the ability to simulate fluid flow, heat transfer including solidification, and stress evolution in a integrated manner. This modelling framework is used to predict the behavior of two solder materials

Rapid Melting of Nb - 47 Mass % Ti: Effect of Heating Rate and Grain Size

September 8, 1999
Author(s)
William J. Boettinger, Daniel Josell, Sam R. Coriell, D Basak
The effect of heating rate and grain size on the melting behavior of Nb - 47 mass % Ti is measured. The experimental method uses rapid resistive self-heating of wire specimens at rates between 10(2 superscript) and 104 superscript) K/s and simultaneous