June 20, 2014
Author(s)
Victor H. Vartanian, Richard Allen, Klaus Humler, Steve Olsen, Brian Sapp, Larry Smith
This chapter will focus on the metrology steps to support 2.5D and 3D reference flows employing via-mid copper through-silicon via (TSV) processing, wafer thinning, and backside processing using a handle wafer and chip-to-chip bonding. Reference flows that