January 1, 1999
      
                  
        
  Author(s)
  Michael T. Postek,   Marylyn H. Bennett,   N J. Zaluzec
 
       
            
    
    
        When a contamination event occurs in a semiconductor fab, a process engineer must act quickly to find the cause. It is cost-prohibitive to maintain a full complement of analytical tools in a fab that would be necessary to identify very small particles and