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Displaying 36401 - 36425 of 74167

Examination of Multicomponent Diffusion Between Two Ni-Base Superalloys

September 11, 2005
Author(s)
Carelyn E. Campbell, William J. Boettinger, T Hansen, P Merewether, B A. Mueller
The interdiffusion at 1293 degree C between two multicomponent Ni-base superalloys, Rene-N4 and ene-N5, was assessed by measuring the composition vs. distance curves and by comparing the measured curves to predictions obtained using a diffusion mobility

Observed Correlation of Sn Oxide film to Sn Whisker Growth in Sn-Cu electrodeposit for pb-free Solders

September 11, 2005
Author(s)
Kil-Won Moon, C E. Johnson, Maureen E. Williams, O Kongstein, Gery R. Stafford, C A. Handwerker, William J. Boettinger
To evaluate the effects of the oxide film on Sn whisker growth, a bright Sn-Cu electrodeposit was tested in an ultrahigh vacuum chamber with Auger analysis. After Ar+ ion beam cleaning to remove the oxide film, the sample was analyzed and stored in the

A Modular System Architecture for Agile Assembly of Nanocomponents using Optical Tweezers

September 10, 2005
Author(s)
Arvind K. Balijepalli, Thomas W. LeBrun, Cedric V. Gagnon, Yong-Gu Lee, Nicholas G. Dagalakis
In order to realize the flexibility optical trapping offers as a nanoassembly tool, we need to develop natural and intuitiveinterfaces to assemble large quantities of nanocomponents quickly and cheaply. We propose a system to create such aninterface that

A Solution for Wireless Privacy and Payments based on E-cash

September 9, 2005
Author(s)
A Karygiannis, Y. Tsiounis, A. Kayias
With wireless capable devices becoming more and more accessible, there is an increasing need for standardization of wireless networking. One of the most utilized standards that is deployed by many current devices (including theWindows XP OS) for building

Issues in Line Edge and Linewidth Roughness Metrology

September 9, 2005
Author(s)
John S. Villarrubia
In semiconductor electronics applications, line edge and linewidth roughness are generally measured using a root mean square (RMS) metric. The true value of RMS roughness depends upon the length of edge or line that is measured and the chosen sampling

Wetting-Dewetting Transition Line in Thin Polystyrene Films

September 9, 2005
Author(s)
H Raghavan, K M. Ashley, A Seghal, Jack F. Douglas, Alamgir Karim
We review recent advances in the application of combinatorial methods to polymer thin film characterization. Combinatorial methods allow the rapid exploration of multidimensional parameter spaces that naturally arise in the description of polymer film

A Unifying Standard for Interfacing Transducers to Networks IEEE-1451.0

September 8, 2005
Author(s)
James Wiczer, Kang B. Lee
A committee of industry and government technology experts has completed a three-year effort to develop a set of specifications that consist of a unifying set of functions, communications protocols, a common set of commands, and electronic data sheet

Indoor Positioning Using Spatial Spectrum

September 7, 2005
Author(s)
Kamran Sayrafian
We have implemented a quantum key distribution (QKD) system with polarization encoding at 850 nm over 1 km of optical fiber. The high-speed management of the bit-stream, generation of random numbers and processing of the sifting algorithm are all handled

Low-Leakage Superconducting Tunnel Junctions with a Single-Crystal Al2O3 Barrier

September 5, 2005
Author(s)
Seongshik Oh, Katarina Cicak, Kevin Osborn, Raymond Simmonds, David P. Pappas, Robert Mcdermott, Ken B. Cooper, Matthias Steffen, John M. Martinis
We have developed a two-step growth scheme for single-crystal Al2O3 tunnel barriers. The barriers are epitaxially grown on single-crystal rhenium (Re) base electrodes that are grown epitaxially on a sapphire substrate, while polycrystalline Al is used as

Rheopexy of Synovial Fluid and Protein Aggregation

September 5, 2005
Author(s)
Katherine Oates, Wendy Krause, Ronald L. Jones, R H. Colby
Bovine synovial fluid and albumin solutions of similar concentration are rheopectic (stress increases with time in steady shear). This unusual flow characteristic is caused by protein aggrega- tion, and the total stress is enhanced by entanglement of this

Silicide Barrier SNS Junctions for AC Josephson Voltage Standards

September 5, 2005
Author(s)
Paul Dresselhaus, Yonuk Chong, Nicolas Hadacek, Burm Baek, Michio Watanabe, Charles J. Burroughs, Samuel Benz
We have used MoSi2 barrier superconductor-normal-metal-superconductor (SNS) double stacked junctions to generate audio frequency ac waveforms with metrological accuracy. Circuits used in this experiment were two parallel arrays of 1280 stacks of 2

Predicting Gaseous Air Cleaner Performance in the Field

September 4, 2005
Author(s)
Cynthia H. Reed, Steven J. Nabinger, Steven Emmerich
As part of an ongoing effort to better understand the performance of indoor air cleaners in real buildings, the National Institute of Standards and Technology (NIST) has completed a series of air cleaner field tests and model simulations. This paper

A Framework to Ensure Trustworthy Web Services

September 1, 2005
Author(s)
Jia Zhang, L Zhang
The National Software Reference Library (NSRL) of the U.S. National Institute of Standards and Technology (NIST) collects software from various sources and publishes file profiles computed from this software (such as MD5 and SHA-1 hashes) as a Reference

A Simulation and Gaming Architecture for Manufacturing Research, Testing, and Training

September 1, 2005
Author(s)
Charles R. McLean, Sanjay Jain, Yung-Tsun Lee, Frank H. Riddick
Manufacturing systems are often costly to develop and operate. Simulation technology has been demonstrated to be an effective tool for improving the efficiency of manufacturing system design, operation, and maintenance. But manufacturing simulations are
Displaying 36401 - 36425 of 74167
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