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NIST Authors in Bold

Displaying 14451 - 14475 of 17285

Review of Instrumented Indentation

August 1, 2003
Author(s)
Mark R. VanLandingham
… methods. Research efforts at the National Institute of Standards and Technology (NIST) aimed at improving the …

Combining Data in Small Multiple Method Studies

May 1, 2003
Author(s)
Robert C. Hagwood, William F. Guthrie
In this article an accurate confidence interval is derived when the results of a small number of different experimental methods are combined for the determination of an unknown quantity. ANOVA and a simple hierarchical Bayesian analysis of variance result

Advanced Test and Calibration Systems for Integrated Multi-Sensor Platforms with IR, Visible, and Laser Range Finder/Designator Capabilities

January 1, 2003
Author(s)
Paul Bryant, Jack Grigor, Pat Harris, Brian Rich, Alan Irwin, Steve McHugh, Daniel W. King, Rodney Leonhardt
This paper discusses recent advances in the development of test and evaluation instrumentation for military laser range finder (LRF) and designation systems. Recent strides have been made in the development of sophisticated active ranging simulation

Effects of noise level in fitting in situ optical reflectance spectroscopy data

January 1, 2003
Author(s)
Chih-chiang Fu, Kristine A. Bertness, C. M. Wang
Curve-fitting of simulated optical reflectance spctroscopy data is used to evaluate the accuracy of parameters derived from the fits of actual data. These simulations show that to determine the index of refraction 'n' to an accuracy of 0.0015

High-Speed Quantum Communication Testbed

December 1, 2002
Author(s)
Carl J. Williams, Xiao Tang, M Hiekkero, J Rouzard, R Lu, A Goedecke, Alan L. Migdall, Alan Mink, Anastase Nakassis, Leticia S. Pibida
… the Gaithersburg, MD campus of the National Institute of Standards and Technology (NIST), separated by approximately …

Optimizing the Covalent Cationization Method for the Mass Spectrometry of Polyolefins

August 1, 2002
Author(s)
Sheng Lin-Gibson, L Brunner, David L. VanderHart, Barry J. Bauer, B M. Fanconi, Charles M. Guttman, William E. Wallace
Previously a new method was introduced for the mass spectrometry of polyolefins whereby an organic cation is covalently bonded to the polymer to produce the necessary ionization for the creation of intact gas?phase macromolecules by matrix-assisted laser

Multifilmamentary Nb 3 Sn wires reacted in hydrogen gas

May 1, 2002
Author(s)
M Takayasu, R G. Ballinger, Ronald B. Goldfarb, A. A. Squitieri, P. J. Lee, David C. Larbalestier
Reaction of Nb 3Sn wires in an Icology 908 conduit in the presence of oxygen can decrease the conduit's fracture toughness. This may be avoided by reacting in a reducing atmosphere of 5% hydrogen-95% argon. The effects of the hydrogen reaction on the

Implementation of CMOS Compatible Conductance-based Micro-Gas-Sensor System

August 28, 2001
Author(s)
Muhammad Afridi, John S. Suehle, Mona E. Zaghloul, Jason E. Tiffany, Richard E. Cavicchi
A CMOS compatible micro-gas sensor system was designed and fabricated in a standard CMOS process through MOSIS. This chip was post-processed to create microhotplates using bulk micro-machining techniques. Tin-oxide-sensing films were grown over post

NIST Multizone Modeling Website

April 2, 2001
Author(s)
William S. Dols
… and Fire Research Laboratory of the National Institute of Standards and Technology (NIST). Multizone modeling refers to …

Porous Thin Films for Thermal Barrier Coatings

April 1, 2001
Author(s)
K D. Harris, D Vick, E J. Gonzalez, T Smy, K Robbie, M J. Brett
A new approach is described in the deposition of thin films for thermal barrier applications. In a physical vapour deposition experiment, extreme shadowing, present only at highly oblique flux/substrate angles, was employed to introduce porosity into thin

Test Chip for Electrical Linewidth of Copper-Interconnection Features and Related Parameters

February 6, 2001
Author(s)
Michael W. Cresswell, N. Arora, Richard A. Allen, Christine E. Murabito, Curt A. Richter, Ashwani K. Gupta, Loren W. Linholm, D. Pachura, P. Bendix
This paper reports a new electrical test structure for measuring the barrier-layer thickness and total physical linewidth of copper-cored interconnect features. The test structure has four critical dimension (CD) reference segments of different drawn

Enthalpies of Formation in the Pseudobinary LaAl x Ni 5-x System

December 1, 2000
Author(s)
R Klein, P A. O'Hare, I Jacob
The pseudobinary system LaAl xNi 5-x has a composition limit at x {nearly equal to} 1.3. The standard molar enthalpies of formation fHm (298.15 K) were determined by solution calorimetry in HCl (c = 6 mol dm -3) to be -(129.4 +6.5) kJ mol -1 for x = 0.25;

Cross Comparison of Direct Strength Testing Techniques on Polysilicon Films

November 1, 2000
Author(s)
D A. LaVan, T Tsuchiya, G Coles, W G. Knauss, I Chasiotis, David T. Read
Several direct and indirect testing techniques to characterize the strength and distribution in strength of structural thin films have been developed with widely varying results appearing in the literature (roughly 1 to 4 GPa for polysilicon). Much of the
Displaying 14451 - 14475 of 17285
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