January 1, 2004
Author(s)
Zachary H. Levine, Steven E. Grantham, D J. Paterson, I McNulty, I C. Noyan, T M. Levin
… Two regions of interest on a copper/tungsten integrated circuit interconnect were imaged using … and 1722 eV. The energies were chosen to optionally excite tungsten and tantalum above their M 5 edges yet stay below … silicon K edge. Four materials in the circuits, tantalum, tungsten, silica, and copper were mapped using both …