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Calvin Chan, Lee J. Richter, Brad A. Dinardo, Cherno Jaye, Brad Conrad, Hyun Wook Ro, David Germack, Daniel A. Fischer, Dean M. DeLongchamp, David J. Gundlach
Mariona Coll Bau, Oana Jurchescu, Nadine Gergel-Hackett, Curt A. Richter, Christina Hacker
Flip Chip Lamination approach to fabricate top metal contacts on organic-based devices ; M.Coll, O.D. Jurchescu, N. Gergel-Hackett, C.A. Richter, C,A, Hacker, American Physical Society (APS), March 2010, Portland, OR, USA (oral)
Norman A. Sanford, Paul T. Blanchard, Kristine A. Bertness, Lorelle Mansfield, John B. Schlager, Aric W. Sanders, Alexana Roshko, Beau Burton, Steven George
Analysis of steady-state and transient photoconductivity measurements at room temperature performed on c-axis oriented GaN nanowires yielded estimates of free carrier concentration, drift, mobility, surface band bending, and surface capture coefficient for
Nhan V. Nguyen, Min Xu, Oleg A. Kirillov, Pei D. Ye, C Wang, Kin P. Cheung, John S. Suehle
Band offsets at the interfaces of InxGa1-xAs / Al2O3 / Al where x = 0.53 and x = 0.75 were determined by internal photoemission and spectroscopic ellipsometry. The photoemission energy threshold at the InxGa1-xAs / Al2O3 interface was found to be
Michael C. Weiger, Jung Jin Park, Marc D. Roy, Christopher M. Stafford, Alamgir Karim, Matthew L. Becker
The genesis of bone and teeth results from highly coordinated processes which involve several cell types, proteins which direct the nucleation and crystallization of inorganic hydroxyapatite (HA). Recent studies have shown that engineered peptide sequences
Transistors have been made from single molecules, where the flow of electrons is controlled by modulating the energy of the molecular orbitals. Insight from such systems could aid the development of future electronic devices.
Mariona Coll Bau, Curt A. Richter, Christina Hacker
Nanoelectronic fabrication with Flip chip lamination Mariona Coll, CA Richter, CA Hacker, Colloquium Catalan Institute of Nanoscience and Nanotechnology CIN2, Barcelona Spain, Dec 2009.
STEP AP210 (ISO-10303:210) is the first international standard capable of representing both ECAD and MCAD data of packaged components within a unified model. In order to promote AP210 as a standards-based mechanism for the representation of component data