Representation of a Thermal Resistor Network Model of a Packaged Component in STEP AP210 Edition 2
Jamie Stori, Kevin G. Brady, Thomas Thurman
STEP AP210 (ISO-10303:210) is the first international standard capable of representing both ECAD and MCAD data of packaged components within a unified model. In order to promote AP210 as a standards-based mechanism for the representation of component data, it is desired to demonstrate the ability of AP210 to support a variety of domain-specific data requirements in the design and product-realization process for electronic assemblies and products. Prior work and existing implementations have validated the ability of AP210 to serve as a neutral format for the representation of conventional ECAD data for individual components as well as bare boards (PCB / PWB) and assemblies (PCA / PWA). To date, AP210 has not been validated as a representation mechanism for communicating the analytical models and/or data necessary to support mechanical analysis (i.e. thermal and vibration) of electronic assemblies. Being able to predict the package and die temperatures of components to a reasonable degree of accuracy in an assembly under expected operating conditions is critical to the effective design of modern electronic products. In order to support the thermal analysis requirements of designers, while balancing the concerns of component suppliers to protect proprietary details of their products, there has been an increasing emphasis on the role of compact thermal models of components.