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Displaying 601 - 625 of 3439

Raman Stress Evaluation: Hydrostatic vs. Biaxial Calibration

February 19, 2017
Author(s)
L M. Braun, Grady S. White
Comparisons of two technical approaches for stress measurement based on the peak shifts associated with micro-Raman spectra are described. Stress values were obtained from evaluation of the relationship between peak shift and stress determined by both a

Rapid Detection of Thin-Film Interfacial Reactions by MEMS-DSC

February 19, 2017
Author(s)
Lawrence P. Cook, Richard E. Cavicchi, Yanbao Zhang, Mark D. Vaudin, Christopher B. Montgomery, William F. Egelhoff Jr., Martin L. Green, Leslie Allen
A MEMS-based differential scanning calorimeter (DSC) has been used to characterize the Ni/Si interfacial reaction in thin films at ramp rates of 940 C/s and 3760 C/s. The DSC devices were fabricated using CMOS semiconductor processing technology, and were

Relationship Between Microstructure and Wear of Dental Ceramics and Composite Resins

February 19, 2017
Author(s)
V S. Nagarajan, S Jahanmir, B Hockey, Victoria Thompson
The effect of microstructure on the wear mechanisms of glass-ceramics and resin composites was studied. Wear tests on both types of materials were conducted using a pin-on-disk apparatus. Wear of glass-ceramics increased with increasing mica platelet

Simulations of Microstructural Evolution: Anisotropic Growth and Coarsening

February 19, 2017
Author(s)
A R. Roosen, W Carter
Two-dimensional calculations of anisotropic growth and coarsening are illustrated. This model is intended to simulate the development of microstructure in materials like Silicon Nitride. The model is comprised of an ensemble of polygonal particles with
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