Feldman, A.
(2017),
Report of VAMAS TWA 23 - Thermal Properties of Thin Films: A Round Robin to Measure the Thermal Conductivity of Silcon Dioxide Films on Silicon, Journal of Materials Research
(Accessed October 11, 2024)
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Report of VAMAS TWA 23 - Thermal Properties of Thin Films: A Round Robin to Measure the Thermal Conductivity of Silcon Dioxide Films on Silicon
Published
Author(s)
Abstract
A round-robin to measure the thermal conductivity (k) of SIQ^2^ thin films has taken place under the Versailles Project on Advanced Materials and Standards (VAMAS). Films with nominal thickness of 50 nm, 100 nm, 200 nm, and 500 nm, produced by oxidation of Si wafers, were distributed to the participating laboratories. Each laboratory received a separate set of specimens.Citation
Journal of Materials Research
Pub Type
Journals
Keywords
round-robin, silicon dioxide, thermal conductivity, VAMAS
Citation
Issues
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Created February 19, 2017