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Conferences

Metrology for 3D Integration

Author(s)
Richard Allen, Victor H. Vartanian, David T. Read, Winthrop A. Baylies
Three-dimensional stacked integrated circuit (3DS-IC) fabrication requires complex technologies such as high-aspect ratio through- silicon vias (TSVs), wafer...

Scanning Probe Microscopes for Subsurface Imaging

Author(s)
Joseph J. Kopanski, Lin You, Jungjoon Ahn, Emily Hitz, Yaw S. Obeng
Scanning probe microscopes (SPMs) have some ability to image sub-surface structures. This paper describes the theoretical and practical basis for imaging metal...

Control Fusion for Safe Multi-robot Coordination

Author(s)
Roger V. Bostelman, Jeremy A. Marvel
Future smart manufacturing systems will include more complex coordination of mobile manipulators (e.g., robot arms mounted on mobile bases). The National...

Accurate RRAM Transient Currents during Forming

Author(s)
Pragya R. Shrestha, David M. Nminibapiel, Jason P. Campbell, Jihong Kim, Canute I. Vaz, Kin P. Cheung, Helmut Baumgart
Current overshoot during forming has been shown to be a serious issue. Recently the current overshoot duration has been shown to be an important factor...

Bilateral NMI Comparison of Guarded-Hot-Plate Apparatus

Author(s)
Alain Koenen, Robert R. Zarr, William F. Guthrie
Two national metrology laboratories (NMI) have conducted an international interlaboratory comparison on thermal conductivity on two thermal insulation reference...

Powder Bed Fusion Machine Performance Testing

Author(s)
Shawn P. Moylan, Joseph Drescher, M A. Donmez
Unlike conventional machining where there is a near 1:1 correspondence of machine performance to the geometry of the workpiece, the accuracy of the machine...
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