MfgTech Roadmap - Microelectronics

The global semiconductor supply chain has faced significant disruptions as a result of several different factors, including the COVID-19 pandemic. In addition,  a global semiconductor shortage has affected multiple manufacturing sectors which rely on semiconductors as critical components for their finished products. These roadmaps will identify some of the essential steps toward building a domestic infrastructure that invents, demonstrates, prototypes, and produces, here in the United States.

 

Title	Recipient	Federal Funds
5G/6G mmWave Materials and Electrical Test Technology	International Electronics Manufacturing Initiative, Inc.	$290,865
Industrial Artificial Intelligence Consortium to Advance High Mix Production	University of Cincinnati	$298,106
Manufacturing Roadmap for Heterogeneous Integration and Electronics Packaging	The Regents of the University of California, Los Angeles	$300,000
Microelectronic and Advanced Packaging Technology (MAPT)	Semiconductor Research Corporation	$300,000

5G/6G mmWave Materials and Electrical Test Technology

	Leading Organization:	Partners:
	International Electronics Manufacturing Initiative, Inc. (NC)	Dupont (CA) Dell Computer Corporation (TX) Intel Corporation (CA) IWPC (PA) Full List

Deliverables:

Develop a roadmap for advancing the leading edge 5G and 6G products to accelerate the development of the next generation of U.S. high-performance wireless networks.

Activities:

• Develop three work packages: a survey-based technology and market needs assessment, a technical roadmap, and an implementation strategy for a proposed RF cluster.
• Disseminate findings through public webinars, technical papers, conference presentations and post-award through curricula developed for community colleges and universities.

Potential Impacts:

To meet increasing industry and government demands, high-performance next-generation communication 5G/6G technologies aim to enable faster wireless connection speeds and high capacity with low latency. The 5G/6G MAESTRO will create a world-leading knowledge base and technical know-how in mmWave material selection, characterization and test to help the U.S. become a competitive leader in 5G/6G technology.

Period of Performance:

May 1, 2022 – September 30, 2023

Industrial Artificial Intelligence Consortium to Advance High Mix Production

Leading Organization	Partners:
University of Cincinnati (OH)	University of Michigan (MI) North Carolina Agricultural and Technical State University (NC) Predictronics Corporation (OH) Full List

Deliverables:

• Establish a U.S.-based industrial artificial intelligence (AI) consortium to address the high-priority technical barriers in high-mix production.​
• Provide a roadmap for semiconductor manufacturing and for other high-mix industries to improve overall competitiveness in a global marketplace. ​

Activities:

•  Establish industrial AI consortium structure: executive committee and Industry Advisory Board.​
• Conduct surveys of top industry needs, barriers, applications, and high-priority research areas. ​
• Engage with industry: site visits, personnel exchanges (e.g., visiting scholars, student​ interns), and feasibility studies for technology demonstrations.​
• Hold workshops that cover fundamental research presentations, use-case demonstrations, and​ strategic talks. ​
• Disseminate the roadmap through publications, conferences, workshops, and white papers. ​

Potential Impacts:

The roadmap will benefit companies of all sizes and will impact many sectors (e.g., semiconductor, medical product, energy storage, and pharmaceutical) who manufacture large variety of products yet low quantity of each one.

Period of Performance:

August 15, 2022 - February 14, 2024

Manufacturing Roadmap for Heterogeneous Integration and Electronics Packaging

Leading Organization	Partners:
The Regents of the University of California, Los Angeles (CA)	SEMI (CA)

Deliverable:

Produce an actionable roadmap for advancing the nation's capabilities and competitiveness in heterogeneous integration and advanced packaging technologies. The roadmap will include recommendations for manufacturing development infrastructure, pathways for manufacturing standards, workforce development and sustainability, manufacturing sustainability, and equitable manufacturing infrastructure.

Activities:

• Hold a kick-off "packaging manufacturing" workshop to form technology working groups.
• Disseminate MRHIEP through conference presentations.

Potential Impact:

The revitalization of the U.S. semiconductor industry is a national priority to secure the microelectronics supply chain and realize the significant economic benefits. The roadmap will advance nation's capabilities and competitiveness in heterogeneous integration and advanced packaging technologies.

Period of Performance:

April 1, 2022 – September 30, 2023

Microelectronic and Advanced Packaging Technology (MAPT)

	Leading Organization:	Partners:
	Semiconductor Research Corporation (NC)	Amazon (WA) Analog Devices (MA) Binghamton University (NY) Full List

 

Deliverables:

• A consortium that includes stakeholders from all parts of the supply chain.
• Identification of emerging applications that will drive future microelectronics and packaging needs.
• Roadmap that guides technology development, manufacturing advances, and workforce development.

Activities:

• Establish a consortium to identify emerging applications at the convergence of semiconductors and microelectronics and associated advanced packaging technology needs.
• Inclusive and transparent approach to create a Roadmap Executive Committee and Technical Working Groups to develop the content for the roadmap.
• Hold a 1.5-day conference at the end of the first year of activities.

Potential Impacts:

• Ensure that the U.S. develops technological and manufacturing leadership in an area that is critical to U.S. economic and national security.
• Will be used by industry, academia, and government to make critical strategic decisions regarding technology, manufacturing and workforce development.
• Address a key national need, creating a resilient, diverse, and highly skilled workforce in microelectronics and advanced packaging to support R&D, infrastructure development, technology transfer, prototyping, and U.S. manufacturing.

Period of Performance:

April 1, 2022 – September 30, 2023