MfgTech Roadmap - Microelectronics

The global semiconductor supply chain has faced significant disruptions because of several different factors. In addition,  a global semiconductor shortage has affected multiple manufacturing sectors which rely on semiconductors as critical components for their finished products. These roadmaps will identify some of the essential steps toward building a domestic infrastructure that invents, demonstrates, prototypes, and produces, here in the United States.

5G/6G mmWave Materials and Electrical Test Technology

	Leading Organization:	Partners:
	International Electronics Manufacturing Initiative, Inc. (NC)	Dupont (CA) Dell Computer Corporation (TX) Intel Corporation (CA) IWPC (PA) Full List

Period of Performance:

May 1, 2022 – September 30, 2023

Accomplishments:

• Developed two 10-year hardware roadmap and implementation strategy for material development, characterization, and testing: Low Loss Dielectric Materials Characterization Roadmap and Materials Development and Electrical Test Roadmap. Developed a national consortium for execution.
• Addressed two gaps in 5G materials: availability, testing and characterization of high-speed/ultra-low loss materials and electrical testing and standardization and their impact on 5G deployment.

For more information, visit: https://inemi.org/iNEMI/iNEMI/Projects/In-Progress/5G-6G-mmWave-Materials-and-Electrical-Test-Technology-Roadmap--5G-6G-MAESTRO-.aspx

Industrial Artificial Intelligence Consortium to Advance High Mix Production

Period of Performance:

August 15, 2022 - February 14, 2024

Accomplishments:

• Outlined a comprehensive research and development program focused on advancing industrial AI in the semiconductor manufacturing industry.
• Illustrated the importance of 1) the establishment of technical standards for deploying industrial AI and digital twins in semiconductor fabs, 2) developing new technologies and process improvements, and 3) the creation of education programs to cultivate the workforce and support engineer upskilling.
• Provided recommendations for nine actionable AI/ML projects. 

For more information, visit: https://www.intelligentmetrology.com/knowledge-base/artificial-intelligence-to-advance-high-mix-production-a-roadmap-for-the-semiconductor-industry

Manufacturing Roadmap for Heterogeneous Integration and Electronics Packaging

Period of Performance:

April 1, 2022 – September 30, 2023

Accomplishments:

• Created 4 working groups (Advanced Packaging Platforms, Cross-cutting Technologies, Chiplet Architectures and Standard, and Supply Chain, Security, Test and Smart Manufacturing) to define a manufacturing-centric packaging roadmap for two major segments (High performance computing and medical electronics & hybrid device packaging)
• High performance computing specifies the scale-down and scale-out of packaging solutions that will integrate an ever-increasing number of heterogeneous dielets to provide more functionality than can be provided by monolithic solutions alone, and, at lower cost, higher performance and lower power. 

For more information, visit: https://www.semi.org/sites/semi.org/files/2024-02/MRHIEP-Final-report-for-publication.pdf

Microelectronic and Advanced Packaging Technology (MAPT)

	Leading Organization:	Partners:
	Semiconductor Research Corporation (NC)	Amazon (WA) Analog Devices (MA) Binghamton University (NY) Full List

Period of Performance:

April 1, 2022 – September 30, 2023

Accomplishments:

• Aimed to transform microchip design and production, building on breakthroughs in advanced packaging, 3D integration, and energy-efficient computing.
• Formed consortium of 112 organizations from industry, academia, and government to produce 3D semiconductor roadmap outlining research priorities and challenges for growth in the semiconductor industry.
• Focused on sustainable information and communication technologies growth, specifically in energy, environmental, and workforce sustainability. 

For more information, visit: https://srcmapt.org/