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Electronics

News and Updates

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NIST to Hold E-Book Conference

September 18, 2000

Interest in electronic books is soaring in the wake of best-selling novelist Stephen King's decision to publish his own e-book via the Internet earlier this...

Silver Medal Awarded to Developers of Bran

September 13, 2000

Seven current and former members of the U.S. Department of Commerce's Boulder Laboratories shared in a Silver Medal award from the Department for their roles in...

Private Certification Bodies Get Okay To Approve Some FCC-Regulated Products

June 2, 2000

Certifying new telecommunications equipment as compliant with federal and foreign requirements to prevent radio-wave interference should be cheaper and faster...

NIST/Lucent Team Develops Method for Ultraprecise

April 27, 2000

Researchers from the Commerce Department's National Institute of Standards and Technology and Bell Laboratories of Lucent Technologies have teamed to produce a...

New Book Confronts Issues Challenging Semiconductor Industry

November 2, 1998

A wide range of issues important to the U.S. semiconductor industry—and a strategy to correct what some experts see as a potentially dangerous trend of...

New Interface Standard Simplifies Integration of Sensors and Actuators

October 7, 1997

It just got easier to assemble smart sensors and actuators—digital devices that function much like eyes, ears and hands—into control networks that monitor and...

Biosensors and Biomimetic Membrane Technology Gets Boost From NIST

September 7, 1997

Many U.S. biotech firms are working to develop new medical diagnostics, pharmaceuticals and sensors based on DNA, genetically engineered proteins and other...

New Measurement Capabilities to Support Next Generation of Microchips

June 24, 1997

The Commerce Department's National Institute of Standards and Technology, the Energy Department's Sandia National Laboratories and the private sector's SEMATECH...

NIST Semiconductor Research Advances Industry's Goals

July 15, 1996

Twenty-three semiconductor research projects are advancing efforts to provide key measurements labeled as critical by the industry for the production of next...

Electronic Materials Group Urges Greater Industry/Government Cooperation On R&D; Efforts

June 24, 1996

In an effort to improve the competitiveness of the U.S. electronics industry, materials and electronics experts from industry, government and universities met...

Workshop on Moisture in Microelectronics Seeks Papers

December 7, 1995

Electronic engineers, materials scientists, designers and others engaged in the development and manufacture of microelectronic products are invited to submit...

Commerce's NIST Celebrates 40 Years of Semiconductor Research in Partnership with Industry

June 21, 1995

The Commerce Department and the U.S. semiconductor industry next month will celebrate the 40th anniversary of a partnership in a field that has enabled such...

Low-Cost, Thin-Film Multijunction Thermal Converter Wins 1994 R&D; 100 Award

September 22, 1994

A multilayer, thin-film multijunction thermal converter, or MJTC, developed jointly by the National Institute of Standards and Technology and Ballantine...

Agreement Between U.S. and Japan Spawns Innovative International Optoelectronics Program for Computing

July 12, 1994

The United States and Japan have agreed on the last critical step before realization of a joint program to further the design and development of the advanced...

NIST Scientists Help Visitors to the Smithsonian's Science in American Life Exhibition Learn About Lasers and Enzymes

April 18, 1994

How far away is the moon? How fast does light travel? How do detergent enzymes trounce laundry stains? Visitors to the Smithsonian's National Museum of...

Commerce Acts on Industry's Call for Semiconductor Measurement Assistance

March 2, 1994

U.S. Commerce Secretary Ronald H. Brown today announced that the Commerce Department's National Institute of Standards and Technology (NIST) is entering into an...

Commerce Acts on Industry's Call for Semiconductor Measurement Assistance

March 2, 1994

U.S. Commerce Secretary Ronald H. Brown today announced that the Commerce Department's National Institute of Standards and Technology (NIST) is entering into an...

Six Companies Join Industry/Government Consortium to Improve Biosensor Technology

July 21, 1993

One day in the not-too-distant future, your doctor likely will be able to dip a pen-sized electronic device in a few drops of blood and provide an instant...

Technology Transfer Activity as a “Concierge Service” to the Scientific and Engineering Community

Commercialization Academy Director for Venture Partners of the University of Colorado, Boulder, Ms. Sally Hatcher, who is my colleague and fellow Technology...

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NIST Headquarters
-Creating Helpful Incentives to Produce Semiconductors for America (CHIPS)
--CHIPS Program Office
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---Radiation Safety Division
----Radiation Facilities Group
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---Boulder Safety, Health and Environment Division
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---Financial Systems and Reporting Division
----CBS Core Support Group
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----Financial Systems and Reporting Division - HQ
----Financial Statements Group
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---Office of Financial Resource Management
----Office of Financial Resource Management - HQ
----Internal Controls Management & Evaluation Office
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---Financial Operations Division
----Travel Group
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----Accounts Receivable Group
----Financial Operations - HQ
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---Budget Division
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----Budget - HQ
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-Laboratory Programs
--Communications Technology Laboratory
---Quantum Communications Division
----Quantum Communications - HQ
----Quantum Networking Transduction Group
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----Scalable Quantum Computing Group
---RF Technology Division
----High-Speed Waveform Metrology Group
----Superconductive Electronics Group
----Guided Wave Electromagnetics Group
----Electromagnetic Fields Group
----RF Technology Division - HQ
---Smart Connected Systems Division
----IoT Devices and Infrastructures Group
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----Smart Connected Manufacturing Systems Group
----Smart Grid Group
----Transformational Networks and Services Group
---Spectrum Technology and Research Division
----Applied Systems Metrology Group
----Fiber Sources and Applications Group
----Shared Spectrum Metrology Group
----Spectrum Technology and Research – HQ
---Wireless Networks Division
----Internet Technologies Research Group
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----Wireless Networks Division - HQ
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---Public Safety Communications Research Division
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----Boulder Laboratory Director Office
--Engineering Laboratory
---Building Energy and Environment Division
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---Intelligent Systems Division
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---Systems Integration Division
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----Information Modeling and Testing Group
----Systems Integration - HQ
--Information Technology Laboratory
---Applied Cybersecurity Division
----Applied Cybersecurity - HQ
----Cybersecurity and Privacy Applications Group
----National Cybersecurity Center of Excellence
----NICE
---Computer Security Division
----Computer Security - HQ
----Cryptographic Technology Group
----Software Security Group
----Hardware Security Group
----Security Engineering and Risk Management Group
---Applied and Computational Mathematics Division
----Mathematical Software Group
----Mathematical Analysis and Modeling Group
----Quantum Information Group
----High Performance Computing and Visualization Group
----Applied and Computational Mathematics - HQ
---Statistical Engineering Division
----Applied and Computational Statistics Group
----Statistical Design, Analysis, and Modeling Group
----Statistical Engineering - HQ
---AI Research, Measurement, and Standards Division
----AI Standards and Guidelines Group
----AI Research, Measurement, and Standards – HQ
----Applied AI Research Group
---Technology Test and Evaluation Division
----Technology Test and Evaluation – HQ
----Biometric Technologies Group
----Multimedia Language Technologies Group
----AI Technologies Group
----Human-Centered Technologies Group
---Information Technology Laboratory Office
----Office of IT Standardization
----Information Technology Laboratory Office - HQ
----Office of Chief Cybersecurity Advisor
--Laboratory Programs
---Emerging Technologies Acceleration Program
----Artificial Intelligence Accelerator Group
----Emerging Technologies Acceleration Program - HQ
----Quantum Technology Accelerator Group
---Research Data and Computing Office
----Research Data and Computing Office – HQ
---Research Protections Office
----Research Protections Office - HQ
---Research Security and Safeguarding Science Office
----Research Security and Safeguarding Science - HQ
---Standards Coordination Office
----International Standards Policy and Coordination Group
----Standards and Conformity Assessment Services Group
----Standards Coordination Office - HQ
----National Voluntary Laboratory Accreditation Program (NVLAP)
---Special Programs Office
----Special Programs Office-HQ
---Associate Director for Laboratory Programs
----Associate Director for Laboratory Programs - HQ
--Material Measurement Laboratory
---Office of Reference Materials
----Business and Quality Management Group
----Business Application Development, Support, and Security Group
----Sales and Customer Services Group
----Publication and Web Services Group
----Office of Reference Materials - HQ
----Materials and Physical Services Group
---Material Data Division
----Data Science and AI Group
----Material Data Division – HQ
----Theory, Modeling, and Simulation Group
----Data Center and Business Group
----Data Services and Infrastructure Group
---Biosystems and Biomaterials Division
----Biomarker and Genomic Sciences Group
----Cellular Engineering Group
----Biomaterials Group
----Complex Microbial Systems Group
----Cell Systems Science Group
----Biosystems and Biomaterials Division - HQ
---Chemical Sciences Division
----Biochemical and Exposure Science Group
----Optical Measurements Group
----Chemical Process and Nuclear Measurements Group
----Gas Sensing Metrology Group
----Inorganic Chemical Metrology Group
----Biospecimen Science Group
----Chemical Sciences Division - HQ
----Organic Chemical Metrology Group
---Biomolecular Measurement Division
----Biomolecular Structure and Function Group
----Mass Spectrometry Data Center Group
----Bioprocess Measurements Group
----Bioanalytical Science Group
----Biomolecular Measurement Division - HQ
----Applied Genetics Group
---Applied Chemicals and Materials Division
----Applied Chemicals and Materials Division - HQ
----Thermodynamics Research Center Group
----Thermophysical Properties of Fluids Group
----Nanoscale Reliability Group
----Fluid Characterization Group
----Fatigue and Fracture Group
---Materials Science and Engineering Division
----Thermodynamics and Kinetics Group
----Polymers Processing Group
----Mechanical Performance Group
----Polymers and Complex Fluids Group
----Materials Science and Engineering Division - HQ
----Functional Polymers Group
----Functional Nanostructured Materials Group
---Materials Measurement Science Division
----Security Technologies Group
----Surface and Trace Chemical Analysis Group
----Nanomechanical Properties Group
----Nano Materials Research Group
----Materials Structure and Data Group
----Microscopy and Microanalysis Research Group
----Synchrotron Science Group
----Materials Measurement Science Division - HQ
----Data and AI-Driven Materials Science Group
---Material Measurement Laboratory Office
----The Material Measurement Laboratory Office of Operations Group
----Material Measurement Laboratory - HQ
----Genome-Scale Measurement Group
--NIST Center for Neutron Research
---NIST Center for Neutron Research
----Research Facility Operations Group
----NIST Center for Neutron Research - HQ
----Reactor Operations and Engineering Group
----Neutron-Condensed Matter Science Group
--Physical Measurement Laboratory
---Microsystems and Nanotechnology Division
----Biophysical and Biomedical Measurement Group
----Microsystems and Nanotechnology - HQ
----Nanostructure Fabrication and Measurement Group
----Photonics and Optomechanics Group
---Time and Frequency Division
----Atomic Devices & Instrumentation Group
----Precision Photonic Synthesis Group
----Quantum & Nonlinear Nanophotonics Group
----Ion Storage Group
----Neutral Atom Optical Clocks Group
----Time Realization and Distribution Group
----Phase Noise Metrology Group
----Time and Frequency - HQ
---Quantum Physics Division
----Quantum Physics - HQ
---Radiation Physics Division
----Dosimetry Group
----Radioactivity Group
----Radiation Physics - HQ
----Neutron Physics Group
---Sensor Science Division
----Fundamental Thermodynamics Group
----Sensor Science - HQ
----Temperature & Humidity Group
----Remote Sensing Group
----Optical Radiation Group
----Fluid Metrology Group
----Surface and Interface Metrology Group
---Applied Physics Division
----Advanced Microwave Photonics Group
----Spin Electronics Group
----Applied Physics - HQ
----Faint Photonics Group
----Quantitative Nanostructure Characterization Group
----Molecular and Bio-Photonics Group
----Magnetic Imaging Group
----Quantum Nanophotonics Group
----Sources and Detectors Group
---Quantum Measurement Division
----Quantum Optics Group
----Mass and Force Group
----Quantum Measurement - HQ
----Laser Cooling and Trapping Group
----Fundamental Electrical Measurements Group
----Applied Electrical Metrology Group
---Quantum Sensors Division
----Device Fabrication Group
----Long Wavelength Sensors and Applications Group
----Quantum Calorimeters Group
----Quantum Electronics Group
----Quantum Sensors – HQ
---Nanoscale Device Characterization Division
----Atom Scale Device Group
----Nanoscale Device Characterization Division - HQ
----Alternative Computing Group
----Nanoscale Spectroscopy Group
----Advanced Electronics Group
----Quantum Nanoelectronics Group
---Physical Measurement Laboratory Office
----Boulder Microfabrication Facility
----Physical Measurement Laboratory- HQ
----Center for Nanoscale Science and Technology
----Office of Weights and Measures
-Innovation & Industry Services
--Office of Advanced Manufacturing
---Microelectronics Manufacturing Division
----Microelectronics Manufacturing – HQ
----Microelectronics Strategy and Enterprise Group
----Semiconductor Coordination Group
----Semiconductor Operations Group
----Workforce and Equity Development Group
---Office of Advanced Manufacturing
----Office of Advanced Manufacturing - HQ
---Partnerships and Outreach Division
----Communications and Marketing Group
----Education and Workforce Development Group
----Partnership Engagement Group
----Partnerships and Outreach – HQ
----Technology Hubs Development Group
---Program Operations Division
----Competitions Group
----Institute and Program Management Group
----Performance Management Group
----Program Operations - HQ
---Strategy and Planning Division
----Analysis and Benchmarking Group
----Strategic Planning Group
----Strategy and Planning – HQ
--Baldrige Performance Excellence Program
---Baldrige Performance Excellence Program Office
----Award Process Group
----Director's Office, Baldrige Performance Excellence Program
----Administrative Support/Electronic Information Group
----Outreach and Communications Group
----Publications Management Group
----Workforce Development Group
--Innovation & Industry Services
---Associate Director for Innovation & Industry Services
----Associate Director for Innovation & Industry Services - HQ
---Technology Partnerships Office
----Technology Partnerships Office - HQ
--Hollings Manufacturing Extension Partnership Program
---National Platforms Division
----National Platforms – HQ
----Network Knowledge Management Group
----Supply Chain Group
---National Programs Division
----National Programs- HQ
---Outreach and External Affairs Division
----Outreach and External Affairs – HQ
---Performance Evaluation and Economic Impacts Division
----Performance Evaluation and Economic Impacts - HQ
----Performance Metrics and Evaluation Group
---Network Agreements Management Division
----Network Agreements Management - HQ
----Node B Group
----Node A Group
---Internal Operations Division
----Internal Operations – HQ
---Hollings Manufacturing Extension Partnership Program Office
----Hollings Manufacturing Extension Partnership Program - HQ
-Director's Office
--Director's Office
---Communications and Outreach Office
----External Stakeholder Outreach Group
----Media Relations Group
----Video Production Group
----Communications and Outreach - HQ
----Internal Communications Group
----Conference Program and Audiovisual Services Group
----Boulder Outreach Group
----Digital Content & Multimedia Design Group
---Ombuds Office
----Ombuds Office - HQ
---Program Coordination Office
----Program Coordination Office - HQ
---Director's Office
----Director's Office - HQ
---Congressional and Legislative Affairs Office
----Congressional and Legislative Affairs Office - HQ
---Management and Organization Office
----Management and Organization Office- HQ
---International and Academic Affairs Office
----International and Academic Affairs Office - HQ