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Electronics

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Commerce Acts on Industry's Call for Semiconductor Measurement Assistance

March 2, 1994

U.S. Commerce Secretary Ronald H. Brown today announced that the Commerce Department's National Institute of Standards and Technology (NIST) is entering into an...

Commerce Acts on Industry's Call for Semiconductor Measurement Assistance

March 2, 1994

U.S. Commerce Secretary Ronald H. Brown today announced that the Commerce Department's National Institute of Standards and Technology (NIST) is entering into an...

Six Companies Join Industry/Government Consortium to Improve Biosensor Technology

July 21, 1993

One day in the not-too-distant future, your doctor likely will be able to dip a pen-sized electronic device in a few drops of blood and provide an instant...

Technology Transfer Activity as a “Concierge Service” to the Scientific and Engineering Community

Commercialization Academy Director for Venture Partners of the University of Colorado, Boulder, Ms. Sally Hatcher, who is my colleague and fellow Technology...

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NIST Headquarters
-Executive Director for Semiconductor Innovation and Investment
--CHIPS Program Office
---CHIPS Program Headquarters
----CHIPS Program Headquarters - HQ
----Opportunity & Inclusion Group
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---External R&D Partnerships Division
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---Semiconductor Metrology & Characterization Office
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--Executive Director for Semiconductor Innovation and Investment
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---Business Operations Office
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---Gaithersburg Safety, Health and Environment Division
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---Boulder Safety, Health and Environment Division
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---Financial Systems and Reporting Division
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----Financial Systems and Reporting Division - HQ
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---Office of Financial Resource Management
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---Financial Operations Division
----Travel Group
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---Budget Division
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---Quantum Communications Division
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----RF Technology Division - HQ
---Smart Connected Systems Division
----IoT Devices and Infrastructures Group
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---Spectrum Technology and Research Division
----Applied Systems Metrology Group
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----Spectrum Technology and Research – HQ
---Wireless Networks Division
----Internet Technologies Research Group
----Radio Access and Propagation Metrology Group
----Wireless Networks Division - HQ
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---Public Safety Communications Research Division
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----Advanced Communications Research Group
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---Communications Technology Laboratory HQ
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---Building Energy and Environment Division
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---Intelligent Systems Division
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---Materials and Structural Systems Division
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----Infrastructure Materials Group
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----Materials and Structural Systems - HQ
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---Engineering Laboratory Office
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----Cybersecurity and Privacy Applications Group
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---Computer Security Division
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---Applied and Computational Mathematics Division
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----High Performance Computing and Visualization Group
----Applied and Computational Mathematics - HQ
---Statistical Engineering Division
----Applied and Computational Statistics Group
----Statistical Design, Analysis, and Modeling Group
----Statistical Engineering - HQ
---AI Research, Measurement, and Standards Division
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----AI Research, Measurement, and Standards – HQ
----Applied AI Research Group
---Technology Test and Evaluation Division
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----Biometric Technologies Group
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---Information Technology Laboratory Office
----Office of IT Standardization
----Information Technology Laboratory Office - HQ
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--Laboratory Programs
---Emerging Technologies Acceleration Program
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----Emerging Technologies Acceleration Program - HQ
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---Research Data and Computing Office
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----Research Protections Office - HQ
---Research Security and Safeguarding Science Office
----Research Security and Safeguarding Science - HQ
---Standards Coordination Office
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----Standards Coordination Office - HQ
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---Special Programs Office
----Special Programs Office-HQ
---Associate Director for Laboratory Programs
----Associate Director for Laboratory Programs - HQ
--Material Measurement Laboratory
---Office of Reference Materials
----Business and Quality Management Group
----Business Application Development, Support, and Security Group
----Sales and Customer Services Group
----Publication and Web Services Group
----Office of Reference Materials - HQ
----Materials and Physical Services Group
---Material Data Division
----Data Science and AI Group
----Material Data Division – HQ
----Theory, Modeling, and Simulation Group
----Data Center and Business Group
----Data Services and Infrastructure Group
---Biosystems and Biomaterials Division
----Biomarker and Genomic Sciences Group
----Cellular Engineering Group
----Biomaterials Group
----Complex Microbial Systems Group
----Cell Systems Science Group
----Biosystems and Biomaterials Division - HQ
---Chemical Sciences Division
----Biochemical and Exposure Science Group
----Optical Measurements Group
----Chemical Process and Nuclear Measurements Group
----Gas Sensing Metrology Group
----Inorganic Chemical Metrology Group
----Biospecimen Science Group
----Chemical Sciences Division - HQ
----Organic Chemical Metrology Group
---Biomolecular Measurement Division
----Biomolecular Structure and Function Group
----Mass Spectrometry Data Center Group
----Bioprocess Measurements Group
----Bioanalytical Science Group
----Biomolecular Measurement Division - HQ
----Applied Genetics Group
---Applied Chemicals and Materials Division
----Applied Chemicals and Materials Division - HQ
----Thermodynamics Research Center Group
----Thermophysical Properties of Fluids Group
----Nanoscale Reliability Group
----Fluid Characterization Group
----Fatigue and Fracture Group
---Materials Science and Engineering Division
----Thermodynamics and Kinetics Group
----Polymers Processing Group
----Mechanical Performance Group
----Polymers and Complex Fluids Group
----Materials Science and Engineering Division - HQ
----Functional Polymers Group
----Functional Nanostructured Materials Group
---Materials Measurement Science Division
----Security Technologies Group
----Surface and Trace Chemical Analysis Group
----Nanomechanical Properties Group
----Nano Materials Research Group
----Materials Structure and Data Group
----Microscopy and Microanalysis Research Group
----Synchrotron Science Group
----Materials Measurement Science Division - HQ
----Data and AI-Driven Materials Science Group
---Material Measurement Laboratory Office
----The Material Measurement Laboratory Office of Operations Group
----Material Measurement Laboratory - HQ
----Genome-Scale Measurement Group
--NIST Center for Neutron Research
---NIST Center for Neutron Research
----Research Facility Operations Group
----NIST Center for Neutron Research - HQ
----Reactor Operations and Engineering Group
----Neutron-Condensed Matter Science Group
--Physical Measurement Laboratory
---Microsystems and Nanotechnology Division
----Biophysical and Biomedical Measurement Group
----Microsystems and Nanotechnology - HQ
----Nanostructure Fabrication and Measurement Group
----Photonics and Optomechanics Group
---Time and Frequency Division
----Atomic Devices & Instrumentation Group
----Precision Photonic Synthesis Group
----Quantum & Nonlinear Nanophotonics Group
----Ion Storage Group
----Neutral Atom Optical Clocks Group
----Time Realization and Distribution Group
----Phase Noise Metrology Group
----Time and Frequency - HQ
---Quantum Physics Division
----Quantum Physics - HQ
---Radiation Physics Division
----Dosimetry Group
----Radioactivity Group
----Radiation Physics - HQ
----Neutron Physics Group
---Sensor Science Division
----Fundamental Thermodynamics Group
----Sensor Science - HQ
----Temperature & Humidity Group
----Remote Sensing Group
----Optical Radiation Group
----Fluid Metrology Group
----Surface and Interface Metrology Group
---Applied Physics Division
----Advanced Microwave Photonics Group
----Spin Electronics Group
----Applied Physics - HQ
----Faint Photonics Group
----Quantitative Nanostructure Characterization Group
----Molecular and Bio-Photonics Group
----Magnetic Imaging Group
----Quantum Nanophotonics Group
----Sources and Detectors Group
---Quantum Measurement Division
----Quantum Optics Group
----Mass and Force Group
----Quantum Measurement - HQ
----Laser Cooling and Trapping Group
----Fundamental Electrical Measurements Group
----Applied Electrical Metrology Group
---Quantum Sensors Division
----Device Fabrication Group
----Long Wavelength Sensors and Applications Group
----Quantum Calorimeters Group
----Quantum Electronics Group
----Quantum Sensors – HQ
---Nanoscale Device Characterization Division
----Atom Scale Device Group
----Nanoscale Device Characterization Division - HQ
----Alternative Computing Group
----Nanoscale Spectroscopy Group
----Advanced Electronics Group
----Quantum Nanoelectronics Group
---Physical Measurement Laboratory Office
----Boulder Microfabrication Facility
----Physical Measurement Laboratory- HQ
----Center for Nanoscale Science and Technology
----Office of Weights and Measures
-Innovation & Industry Services
--Office of Advanced Manufacturing
---Microelectronics Manufacturing Division
----Microelectronics Manufacturing – HQ
----Microelectronics Strategy and Enterprise Group
----Semiconductor Coordination Group
----Semiconductor Operations Group
----Workforce and Equity Development Group
---Office of Advanced Manufacturing
----Office of Advanced Manufacturing - HQ
---Partnerships and Outreach Division
----Communications and Marketing Group
----Education and Workforce Development Group
----Partnership Engagement Group
----Partnerships and Outreach – HQ
----Technology Hubs Development Group
---Program Operations Division
----Competitions Group
----Institute and Program Management Group
----Performance Management Group
----Program Operations - HQ
---Strategy and Planning Division
----Analysis and Benchmarking Group
----Strategic Planning Group
----Strategy and Planning – HQ
--Baldrige Performance Excellence Program
---Baldrige Performance Excellence Program Office
----Award Process Group
----Director's Office, Baldrige Performance Excellence Program
----Administrative Support/Electronic Information Group
----Outreach and Communications Group
----Publications Management Group
----Workforce Development Group
--Innovation & Industry Services
---Associate Director for Innovation & Industry Services
----Associate Director for Innovation & Industry Services - HQ
---Technology Partnerships Office
----Technology Partnerships Office - HQ
--Hollings Manufacturing Extension Partnership Program
---National Platforms Division
----National Platforms – HQ
----Network Knowledge Management Group
----Supply Chain Group
---National Programs Division
----National Programs- HQ
---Outreach and External Affairs Division
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---Performance Evaluation and Economic Impacts Division
----Performance Evaluation and Economic Impacts - HQ
----Performance Metrics and Evaluation Group
---Network Agreements Management Division
----Network Agreements Management - HQ
----Node B Group
----Node A Group
---Internal Operations Division
----Internal Operations – HQ
---Hollings Manufacturing Extension Partnership Program Office
----Hollings Manufacturing Extension Partnership Program - HQ
-Director's Office
--Director's Office
---Communications and Outreach Office
----External Stakeholder Outreach Group
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----Internal Communications Group
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---Ombuds Office
----Ombuds Office - HQ
---Program Coordination Office
----Program Coordination Office - HQ
---Director's Office
----Director's Office - HQ
---Congressional and Legislative Affairs Office
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---Management and Organization Office
----Management and Organization Office- HQ
---International and Academic Affairs Office
----International and Academic Affairs Office - HQ