Projects/Programs

Displaying 1 - 25 of 118

$Schematics and diffraction patterns$

Aberration-corrected scanning transmission electron microscopy

Ongoing

Provide atomic resolution imaging and analysis of complex materials and devices, while also advancing transmission electron microscopy methods.

Accurate Cure Kinetics, Stress, Mechanical Properties and Warpage

Ongoing

Advanced packaging involves increasingly challenging requirements for heterogeneous integration and chiplet packaging. Needs such as fine pitch interconnects (

AC-DC Difference

Ongoing

The NIST Ac-dc 2 Difference Project performs leading edge measurement services and research for ac-dc difference measurements and dc voltage metrology. We

Advanced Analytical Electron Tomography for Materials Development and Failure Analysis in Semiconductor Devices

Ongoing

Transmission electron microscopy (TEM) and scanning transmission electron microscopy (STEM) are widely used in industry for identifying structural and

Photograph depicting IC manufacturing showing glowing squares on a round wafer, with a yellow triangular warning indicator labeled UV.

Advanced IC Interconnects - Process Metrology and Models

Ongoing

The objective for Advanced IC Interconnects is to provide measurement standards and advanced measurement methods supporting metrology needs of the semiconductor

Advanced Materials: Elemental and Chemical Analysis of Microstructured Materials

Ongoing

Electron, ion and photon-based microanalysis methods, instrumentation and protocols are developed to advance measurement science towards the elemental and

Advanced Materials Metrology

Ongoing

In this project we measure the fundamental electrical properties of materials from bulk to nanoscale from 1 MHz to 0.3 THz. Understanding the interaction of

Cross section of a SAC solder joint in a BGA, with sketches of potential micro specimens

Advanced Mechanical Characterization of Mesoscale Materials

Ongoing

We develop methods to evaluate the mechanical behavior of micro- and mesoscale metal alloys to fracture, and Micro Electro Mechanical Systems (MEMS) materials

Advanced Metrology to Enable Next Generation EUV Photoresists

Ongoing

The semiconductor industry continues to push for smaller features, more integration, and increased yield. New photoresist chemistries and advances in extreme

Advanced Microwave Photonics

Ongoing

Research on quantum information (QI) seeks to control and exploit exotic properties of quantum mechanics, and researchers are already generating "unbreakable"

Advancing Power Electronics with Defect Metrology

Ongoing

The exponential growth in the power electronics market requires efficient devices based on wide bandgap (WBG) semiconductors. The yield of power devices is

Micrographs of kinetic inductance-based parametric amplifier

Amplifiers

Ongoing

To process information from quantum circuits and systems, it is important to have amplifiers with wide bandwidth, high dynamic range, and extremely low noise

$Four examples of Transmission electron diffraction patterns obtained in a scanning electron microscope.$

Analytical Scanning Transmission Electron Microscopy in a Scanning Electron Microscope (STEM-in-SEM)

Ongoing

Transmission electron imaging and diffraction in an SEM are powerful tools that can be utilized in settings ranging from academia to small business, to

The NIST millimeter-wave extrapolation range being prepared for antenna measurements.

Antenna Metrology Project

Ongoing

Antennas are the eyes, ears and voice boxes of everything from cell phones to interplanetary spacecraft. The Antenna Metrology Program carries on NIST's

Atom Probe Tomography: Nanostructured Semiconductor Materials, Interfaces, and Devices

Ongoing

The semiconductor industry requires sub-nanometer, 3-dimensional quantitative elemental mapping of materials, nanoscale structures, and devices with high

a conceptual diagram of a gate-all-around (GAA) field-effect transistor

Causal Green's function simulations of phonons for multiscale/multiphysics modeling of thermal transport in gate-allaround transistors

Ongoing

This project employs a causal Green’s function (CGF) method to model thermal transport in nanoscale semiconductors, overcoming limitations posed by the Fourier

RF Channel Propagation Measurements and Models for Communications Circuits

Ongoing

An accurate characterization of how the wireless signal propagates through different environments and frequency bands, is key to developing radio frequency (RF)

Characterization of Nano-to-Microscale Process-Induced Thermo-Mechanical Changes in Heterogeneously Integrated Microelectronics

Ongoing

Some of the manufacturing difficulties encountered by the heterogeneous integration of modular chips in system-in-package are due to thermal management and

Electronics

Projects/Programs

Aberration-corrected scanning transmission electron microscopy

Accurate Cure Kinetics, Stress, Mechanical Properties and Warpage

AC-DC Difference

Advanced Analytical Electron Tomography for Materials Development and Failure Analysis in Semiconductor Devices

Advanced IC Interconnects - Process Metrology and Models

Advanced Materials: Elemental and Chemical Analysis of Microstructured Materials

Advanced Materials Metrology

Advanced Mechanical Characterization of Mesoscale Materials

Advanced Metrology to Enable Next Generation EUV Photoresists

Advanced Microwave Photonics

Advancing Power Electronics with Defect Metrology

Amplifiers

Analytical Scanning Transmission Electron Microscopy in a Scanning Electron Microscope (STEM-in-SEM)

Antenna Metrology Project

Atom Probe Tomography: Nanostructured Semiconductor Materials, Interfaces, and Devices

Causal Green's function simulations of phonons for multiscale/multiphysics modeling of thermal transport in gate-allaround transistors

RF Channel Propagation Measurements and Models for Communications Circuits

Characterization of Nano-to-Microscale Process-Induced Thermo-Mechanical Changes in Heterogeneously Integrated Microelectronics

Chemical Functionalization and Manipulation of Nano Materials

Critical Dimension Small Angle X-Ray Scattering (CDSAXS) for Next Generation in-line Metrology

Degradation of extreme-ultraviolet optics

Detector Readout Project

Dynamic EUV Imaging and Spectroscopy for Microelectronics

Dynamic EUV Metrology of Nanoscopic Thermal Transport in Active Devices

Earth Energy Budget

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