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Displaying 1151 - 1175 of 1580

Two-Tier Multiline TRL for Calibration of Low-Cost Network Analyzers

December 1, 1995
Author(s)
Jeffrey A. Jargon, Roger Marks
We compare calibrations for use on three-sampler vector network analyzers (VNAs), which do not allow the direct applica­tion of some advanced error-correction schemes such as TRL (thru-reflect-line). Here we compare various alternatives, including an

Coaxial Line-Reflect-Match Calibration

October 1, 1995
Author(s)
Jeffrey A. Jargon, Roger Marks, Dylan F. Williams
We describe a coaxial line-reflect-match calibration that corrects for imperfections in the load used as a match standard. The method provides a practical means of obtaining accurate, wideband calibrations with compact coaxial standard sets. When our load

Electrical Measurements of Microwave Flip-Chip Interconnections

October 1, 1995
Author(s)
Roger Marks, Jeffrey A. Jargon, C. K. Pao, C. P. Wen
Abstract: We apply custom calibration standards and software to the accurate on-wafer measurement of components on flip-chip coplanar-waveguide MM ICs. We characterize transmission lines, M IM capacitors, and spiral inductors and develop equivalent circuit

Microwave Characterization of Flip-Chip MMIC Components

May 1, 1995
Author(s)
Roger Marks, Jeffrey A. Jargon, C. K. Pao, C. P. Wen, Y. C. Shih
Abstract: We apply custom calibration standards and software to the accurate on-wafer measurement of MIM capacitors and spiral inductors on flip-chip coplanar-waveguide MMICs. We suggest equiva1lent cir­cuit models and document their deficiencies. The

Microwave Characterization of Flip-Chip MMIC Interconnections

May 1, 1995
Author(s)
Roger Marks, Jeffrey A. Jargon, C. K. Pao, C. P. Wen
Abstract: We report accurate on-wafer measurements of transmission lines on flip-chip coplanar-waveguide MMICs. The effects are difficult to predict theoretically, and, without custom standards and unique calibration software, measurements would be
Displaying 1151 - 1175 of 1580
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