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Electrical Measurements of Microwave Flip-Chip Interconnections



Roger Marks, Jeffrey A. Jargon, C. K. Pao, C. P. Wen


Abstract: We apply custom calibration standards and software to the accurate on-wafer measurement of components on flip-chip coplanar-waveguide MM ICs. We characterize transmission lines, M IM capacitors, and spiral inductors and develop equivalent circuit models. The results are applicable to the development of an accurate CAD database.
Proceedings Title
Proc., Intl. Symp on Microelectronics
Conference Dates
October 24-26, 1995
Conference Location
Los Angeles, CA


coplanar waveguide, electronics packaging, flip-chip, interconnection, MMIC, transmission line


Marks, R. , Jargon, J. , Pao, C. and Wen, C. (1995), Electrical Measurements of Microwave Flip-Chip Interconnections, Proc., Intl. Symp on Microelectronics, Los Angeles, CA, [online], (Accessed April 20, 2024)
Created October 1, 1995, Updated February 19, 2017