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PUBLICATIONS

Electrical Measurements of Microwave Flip-Chip Interconnections

Published

Author(s)

Roger Marks, Jeffrey A. Jargon, C. K. Pao, C. P. Wen

Abstract

Abstract: We apply custom calibration standards and software to the accurate on-wafer measurement of components on flip-chip coplanar-waveguide MM ICs. We characterize transmission lines, M IM capacitors, and spiral inductors and develop equivalent circuit models. The results are applicable to the development of an accurate CAD database.
Proceedings Title
Proc., Intl. Symp on Microelectronics
Conference Dates
October 24-26, 1995
Conference Location
Los Angeles, CA
Pub Type
Conferences

Download Paper

Local Download

Keywords

coplanar waveguide, electronics packaging, flip-chip, interconnection, MMIC, transmission line
Electromagnetics

Citation

Marks, R. , Jargon, J. , Pao, C. and Wen, C. (1995), Electrical Measurements of Microwave Flip-Chip Interconnections, Proc., Intl. Symp on Microelectronics, Los Angeles, CA, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=28756 (Accessed October 18, 2025)

Issues

If you have any questions about this publication or are having problems accessing it, please contact [email protected].

Created October 1, 1995, Updated February 19, 2017
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