Marks, R.
, Jargon, J.
, Pao, C.
and Wen, C.
(1995),
Electrical Measurements of Microwave Flip-Chip Interconnections, Proc., Intl. Symp on Microelectronics, Los Angeles, CA, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=28756
(Accessed April 20, 2024)
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Electrical Measurements of Microwave Flip-Chip Interconnections
Published
Author(s)
, , C. K. Pao, C. P. Wen
Abstract
Abstract: We apply custom calibration standards and software to the accurate on-wafer measurement of components on flip-chip coplanar-waveguide MM ICs. We characterize transmission lines, M IM capacitors, and spiral inductors and develop equivalent circuit models. The results are applicable to the development of an accurate CAD database.Proceedings Title
Proc., Intl. Symp on Microelectronics
Conference Dates
October 24-26, 1995
Conference Location
Los Angeles, CA
Pub Type
Conferences
Download Paper
Keywords
coplanar waveguide, electronics packaging, flip-chip, interconnection, MMIC, transmission line
Citation
Created October 1, 1995, Updated February 19, 2017